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6.5W/MK Silicone-Based Thermal Gap Pad Thermal Management Thermal GAP PAD Materials For Network Communication Products

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6.5W/MK Silicone-Based Thermal Gap Pad Thermal Management Thermal GAP PAD Materials For Network Communication Products

6.5W/MK Silicone-Based Thermal Gap Pad Thermal Management Thermal GAP PAD Materials For Network Communication Products
6.5W/MK Silicone-Based Thermal Gap Pad Thermal Management Thermal GAP PAD Materials For Network Communication Products
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Large Image :  6.5W/MK Silicone-Based Thermal Gap Pad Thermal Management Thermal GAP PAD Materials For Network Communication Products

Product Details:
Place of Origin: China
Brand Name: ZIITEK
Certification: UL and RoHs
Model Number: TIF500-65-11ES
Payment & Shipping Terms:
Minimum Order Quantity: 1000pcs
Price: Negotiation
Packaging Details: 1000pcs/bag
Delivery Time: 3-5 work days
Payment Terms: T/T
Supply Ability: 100000pcs/day
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Detailed Product Description
Products Name: 6.5W/MK Silicone-Based Thermal Gap Pad Thermal Management Thermal GAP PAD Materials For Network Communication Products Keywords: Thermal GAP PAD Materials
Thermal Conductivity: 6.5W/m-K Color: Dark Gray
Continuous Use Temp: -40 To 200℃ Application: Network Communication Products
Thickness: 0.020"(0.50mm)~0.200"(5.0mm) Sample: Sample Free
Hardness: 20/10 Shore 00

6.5W/MK Silicone-Based Thermal Gap Pad Thermal Management Thermal GAP PAD Materials For Network Communication Products

 

The TIF®500-65-11ES Series is a thermal pad specifically designed to tackle the high level cooling challenges and environments sensitive to extreme mechanical stress. It combines higt thermal conductivity with a near-fluid ultimate softness, ensuring perfect filling of the contact interface even under ultra-low mounting pressure, completely eliminating air thermal resistance,and providing superior thermal solutions and physical protection for the most precise and higt heat flux electronic components.


Features


> High thermal conductivity
> Extremely soft,low compression stress effectively protects sensitive components
> Self-adhesive without the need for additional surface adhesives
> Good insulation performance


Applications

 

> Power tools
> Network communication products
> Electric vehicle batteries
> Computer CPU/GPU Cooling
> New energy vehicle power systems

 

Typical Properties of TIF®500-65-11ES Series
Property Value Test method
Color Dark gray Visual
Construction & Compostion Ceramic filled silicone elastomer ******
Density(g/cm³) 3.4 ASTM D792
Thickness Range(inch/mm) 0.020~0.030 0.040~0.200 ASTM D374
(0.50~0.75) (1.00~5.00)
Hardness 20 Shore 00 10 Shore 00 ASTM 2240
Continuos Use Temp -40 to 200℃ ******
Breakdown Voltage(V/mm) ≥ 5500 ASTM D149
Dielectric Constant 7.0 MHz ASTM D150
Volume Resistivity ＞1.0X1012 Ohm-meter ASTM D257
Thermal Conductivity (W/m-K) 6.5 ASTM D5470
6.5 ISO22007
Fire rating V-0 UL 94 (E331100)
 
Product Specifications
Standard Thickness: 0.020" (0.50 mm)～ 0.200" (5.00 mm) with increments of 0.010" (0.25 mm).
Standard Size: 16"×16" (406 mm ×406 mm).

Component Codes:
Reinforcement Fabric: FG (Fiberglass).
Coating Options: NS1 (Non-adhesive treatment),
DC1 (Single-sided hardening).
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive).

The TIF® series is available in custom shapes and various forms.
For other thicknesses or more information, please contact us.

6.5W/MK Silicone-Based Thermal Gap Pad Thermal Management Thermal GAP PAD Materials For Network Communication Products 0

Packaging Details & Lead time

 

The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

 

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

 

Company profile

 

Dongguan Ziitek Electronic Material Technology Co., Ltd. was established in 2006. Is a high-tech enterprise specializing in the research, development, production and sales of thermal interface materials. We mainly produce: heat-conducting joint filler, low melting point thermal interface materials, heat-conducting insulator, heat-conducting adhesive tape, heat-conducting interface pad and heat-conducting grease, heat-conducting plastic, silicone rubber, silicone rubber foam, etc. We adhere to the business philosophy of "survival by quality, development by quality", and continue to provide the most efficient and best service for new and old customers with excellent quality in the spirit of rigor, pragmatism and innovation.

 

Factory Size:8000~10,000 square meters

Factory Country/Region:No.12, Xiju Road, Hengli Township, Dongguan City, Guangdong Province, P.R.China

Online-service : 12 hours , Inquiry reply within fastest.
Working time: 8:00am - 5:30pm, Monday to Saturday (UTC+8).

Well-trained & experienced staff are to answer all your inquiries in English of course.

Standard Export Carton Or Marked With Customer's Information Or Customized.

Provide free samples

 

After-service: Even our products have passed strict inspection, if you find the parts can not work well, please show us the proof.

we will help you to deal with it and give you satisfactory solution.

6.5W/MK Silicone-Based Thermal Gap Pad Thermal Management Thermal GAP PAD Materials For Network Communication Products 1

Tag:

thermally conductive filler,

thermal conductivity silicone,

high temperature phase change materials

Contact Details
Dongguan Ziitek Electronic Materials & Technology Ltd.

Contact Person: Dana Dai

Tel: +86 18153789196

Send your inquiry directly to us (0 / 3000)

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