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Products Name: | High Temp Resistance 2.6W/MK Soft Silicone Type Thermal Pad For Electronics | Construction: | Ceramic Filled Silicone Elastomer |
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Continuos Use Temp: | -45℃ To 200℃ | Density: | 3.0g/cc |
Hardness: | 13 Shore 00 | Color: | Blue |
Thermal Conductivity& Compostion: | 2.6W/m-K | Thickness: | 2.0mmT |
Keywords: | Soft Thermal Pad | Application: | Electronics |
High Temp Resistance 2.6W/MK Soft Silicone Type Thermal Pad For Electronics
Products Description
TIFTM580BS use a special process, with silicone as the base material, adding thermal conductive powder and flame retardant together to make the mixture to become thermal interface material. This is effective in lower the thermal resistance between the heat source and the heat sink.
Features:
> Good thermal conductive : 2.6W/mK
> Naturally tacky needing no further adhesive coating
> High tack surface reduces contact resistance
> RoHS compliant
> UL recognized
Applications
> Cooling components to the chassis of frame
> High speed mass storage drives
> Heat Sinking Housing at LED-lit BLU in LCD
> LED TV and LED-lit lamps
> RDRAM memory modules
> Micro heat pipe thermal solutions
> Automotive engine control units
> Display card
> Mainboard/mother board
> Notebook
> Power supply
Key attributes
Typical Properties of TIFTM580BS | ||
Color | Blue | Visual |
Construction & Compostion | Ceramic filled silicone elastomer | ******* |
Density | 3.0g/cc | ASTM D297 |
Thickness range | 2.0mmT | ASTM C351 |
Hardness | 13 Shore 00 | ASTM 2240 |
Dielectric Breakdown Voltage | >5500 VAC | ASTM D412 |
Operating Temp | -45 ~200℃ | ******* |
Dielectric Constant | 5.0 MHz | ASTM D150 |
Volume Resistivity | ≥2.0X1013Ohm-meter | ASTM D257 |
Fire rating | 94 V0 | equivalent UL |
Thermal conductivity | 2.6W/mK | ASTM D5470 |
Product Specifications
Standard Thickness:
0.02 to 0.20 (0.50 to 5.00 mm) with increments of 0.01 (0.25 mm).
Standard Size:
8"X16"(203 mm×406 mm).
Component Codes:
Reinforcement Fabric: FG (Fiberglass).
Coating Options: NS1 (Non-adhesive treatment). DC1 (Single-sided hardening).
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive).
Notes: FG (Fiberglass)provides enhanced strength, suitable for materials with thicknesses of 0.01 to 0.02 inch (0.25 to 0.50 mm).
The TIF series is available in custom shapes and various forms.
For other thicknesses or moreinformation. please contact us.
Details Images
The packaging of thermal pad
1.with PET film or foam-for protection
2. use Paper Card To Separate Each Layer
3. export carton inside and outside
4. meet with customers' requirement-customized
Lead Time :Quantity(Pieces):5000
Est. Time(days): To be negotiated
Ziitek Electronic Material and Technology Ltd. is a R&D and production company, we have many production lines and processing technology of thermal conductive materials, owns advanced production equipment and optimized process, can provide various thermal solutions for different applications.
FAQ:
Q: Are you trading company or manufacturer ?
A: We are manufacturer in China.
Q: How to find a right thermal conductivity for my applications
A: It depends on the watts of power source , ability of heat dissipation. Please tell us your detailed applications and the power, so we can recommend most suitable thermal conductive materials.
Q: Do you accept custom orders ?
A:Yes , welcome to custom orders. Our custom elements including dimension , shape , color and coated on side or two sides adhesive or coated fiberglass. If you want to place a custom order , pls kindly offer a drawing or leave your custom order information .
Contact Person: Dana Dai
Tel: 18153789196