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CPU thermal pad TIF500s BLUE

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January 30, 2021
Category Connection: Thermal Conductive Pad
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Tags:
#thermal conductive material #thermally conductive pad #cpu thermal pad
Brief: Discover the TIF500s BLUE CPU thermal pad, a high-performance thermal conductive gap filler designed for routers and large tolerance stack ups. With 3.0W/mK thermal conductivity and 50 Shore 00 hardness, this silicone pad ensures efficient heat dissipation and gap filling for various applications.
Related Product Features:
  • Naturally tacky surface eliminates the need for additional adhesive coating.
  • Soft and compressible for low-stress applications and large tolerance stack ups.
  • Available in various thicknesses to suit different thermal management needs.
  • High tack surface reduces contact resistance for better thermal performance.
  • RoHS compliant and UL recognized for safety and environmental standards.
  • Stable performance across a wide temperature range from -50℃ to 200℃.
  • Good thermal conductivity of 3.0W/mK for efficient heat dissipation.
  • Suitable for telecommunication hardware, routers, and LED-lit applications.
Faqs:
  • What is the thermal conductivity of the TIF500s BLUE thermal pad?
    The TIF500s BLUE thermal pad offers a thermal conductivity of 3.0W/mK, ensuring efficient heat dissipation for your devices.
  • What applications is this thermal pad suitable for?
    This thermal pad is ideal for routers, telecommunication hardware, LED-lit applications, and other electronics requiring efficient thermal management.
  • Is the TIF500s BLUE thermal pad compliant with safety standards?
    Yes, the TIF500s BLUE thermal pad is RoHS compliant and UL recognized, meeting stringent safety and environmental standards.
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