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UL Recognized Thermal Conductive Gap Filler 4.5mmT For RDRAM Memory Modules

China Dongguan Ziitek Electronic Materials & Technology Ltd. certification
China Dongguan Ziitek Electronic Materials & Technology Ltd. certification
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UL Recognized Thermal Conductive Gap Filler 4.5mmT For RDRAM Memory Modules

UL Recognized Thermal Conductive Gap Filler 4.5mmT For RDRAM Memory Modules
UL Recognized Thermal Conductive Gap Filler 4.5mmT For RDRAM Memory Modules
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Large Image :  UL Recognized Thermal Conductive Gap Filler 4.5mmT For RDRAM Memory Modules

Product Details:
Place of Origin: China
Brand Name: ZIITEK
Certification: UL and RoHs
Model Number: TIF5180-50-11S
Payment & Shipping Terms:
Minimum Order Quantity: 1000pcs
Price: negotiation
Packaging Details: 1000pcs/bag
Delivery Time: 3-5work days
Supply Ability: 10000/day
Detailed Product Description
Thermal Conductivity& Compostion: 5.0W/m-K Color: Grey
Branch Name: ZIITEK Hardness: 45 SHORE00
Application: Rainproof LED Power Thickness: 4.5mmT
High Light:

Thermal Gap Filler UL Recognized

,

Thermal Conductive Gap Filler

,

Thermal Gap Filler 5W / MK

5W / MK,UL Recognized Thermal Conductive Gap Filler 4.5mmT,45 Shore00 With Grey Colour For RDRAM Memory Modules

 

5W / MK,UL recognized thermal conductive gap filler 45 shore00 with grey colour For RDRAM memory modules
 
  The TIF5180-50-11US iis an extremely soft gap filling material rated at a thermal conductivity of 5 W/m-K. It is specially formulated for high performance applications requiring low assembly stress. The material offers exceptional thermal performance at low pressures due to the unique filler package and ultra low modulus resin formulation. The TIF5180-50-11US is highly conformal to rough or irregular surfaces, allowing excellent wet-out at the interface. Protective liners are supplied on both sides allowing for ease of use.
 

TIF500-50-11S Datasheet-REV02.pdf
 
Features:
> Good thermal conductive: 5.0W/mK 
>Thickness:4.5mmT

>Soft and compressible for low stress applications

>Outstanding thermal performance

>Fiberglass reinforced for puncture, shear and tear resistance

>Electrically isolating

 

Applications:

>RDRAM memory modules

>Micro heat pipe thermal solutions

>Semiconductor automated test equipment (ATE)

>CPU

>Memory Modules

>Mass storage devices

>Automotive electronics

 

Typical Properties of TIF5180-50-11S
Color

Grey

Visual Composite Thickness hermalImpedance
@10psi
(℃-in²/W)
Construction &
Compostion
Ceramic filled silicone rubber *** 10mils / 0.254 mm 0.21
20mils / 0.508 mm 0.27
Specific Gravity 3.15 g /cc ASTM D297

30mils / 0.762 mm

0.39

40mils / 1.016 mm

0.43
Thichness 4.5mmT ***

50mils / 1.270 mm

0.50

60mils / 1.524 mm

0.58

Hardness 45 Shore 00 ASTM 2240

70mils / 1.778 mm

0.65

80mils / 2.032 mm

0.76
Tensile Strength

55 ps

ASTM D412

90mils / 2.286 mm

0.85

100mils / 2.540 mm

0.94
Continuos Use Temp -40 to 160℃

***

110mils / 2.794 mm

1.00 

120mils / 3.048 mm

1.07 
Dielectric Breakdown Voltage >5500 VAC ASTM D149

130mils / 3.302mm

1.16

140mils / 3.556 mm

1.25
Dielectric Constant 4.0 MHz ASTM D150

150mils / 3.810 mm

1.31

160mils / 4.064 mm

1.38
Volume Resistivity 4.0X1012 Ohm-meter ASTM D257

170mils / 4.318 mm

1.43

180mils / 4.572 mm

1.50
Fire rating 94 V0

equivalent UL

190mils / 4.826 mm

1.60

200mils / 5.080 mm

1.72
Thermal conductivity 5.0 W/m-K ASTM D5470 Visua l/ ASTM D751 ASTM D5470

 

Packaging Details & Lead time

 

The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

 

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated


 

UL Recognized Thermal Conductive Gap Filler 4.5mmT For RDRAM Memory Modules 0

Advantage

 

Ziitek has independent R&D team. This team is experience, rigorous and pragmatic.

They undertake the core research and development tasks of Ziitek thermal conductive materials. With well-equipped testing equipment, we Ziitek can also do some tests with customers' samples, so we can find a more suitable Ziitek materials for every customer.

 

Why Choose us ?

 

1.Our value message is'' Do it right the First time, total quality control''.

2.Our core competencies is thermal conductive interface materials

3.Competitive advantage products.

4.Condidentiality agreement Bussiness Secrect Contract

5.Free sample offer

6.Quality assurance contract

Contact Details
Dongguan Ziitek Electronic Materials & Technology Ltd.

Contact Person: Miss. Dana

Tel: 18153789196

Send your inquiry directly to us (0 / 3000)