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Product Details:
Payment & Shipping Terms:
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| Thermal Conductivity& Compostion: | 1.8W/m-K | Color: | Grey |
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| Branch Name: | ZIITEK | Hardness: | 20 SHORE00 |
| Application: | Wireless Routers | Thickness: | 2.5mmT |
| High Light: | 20 Shore00 Heat Sink Pad,Construction Heat Sink Pad,Heat Sink Pad 1.8W/MK |
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20 shore00 Easy release construction heat sink pad 1.8W/mK, 2.5mmT for Automotive electronics
The TIF5100-18-11US is not only designed to take advantage of the gap heat transfer, to fill gaps, complete the heat transfer between heating and cooling parts, but also played insulation, damping, sealing and so on, to meet the equipment miniaturization and ultra-thin design Requirements, which is a highly technology and use, and the thickness of the wide range of applications, is also an excellent thermal conductivity filler material.
TIF500-18-11US Datasheet-REV02.pdf
Company Profile
Ziitek Electronic Material and Technology Ltd. is a R&D and production company, we have many production lines and processing technology of thermal conductive materials, owns advanced production equipment and optimized process, can provide various thermal solutions for different applications.
Features:
>Thickness:2.5mmT
> Good thermal conductive: 1.8W/mK
> Moldability for complex parts
> Outstanding thermal performance
> High tack surface reduces contact resistance
> RoHS compliant
> UL recognized
> Fiberglass reinforced for puncture, shear and tear resistance
> Easy release construction
> Electrically isolating
> High durability
Applications:
>Automotive electronics
>notebook
>power supply
>Heat pipe thermal solutions
>Memory Modules
>GPS navigation and other portable devices
>CD-Rom, DVD-Rom cooling
>LED Power Supply
>Rainproof LED Power
>Waterproof LED Power
>SMD LED module
>LED Flesible strip, LED bar
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Typical Properties of TIF™5100-18-11US
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| Color |
Grey |
Visual | Composite Thickness | hermalImpedance @10psi (℃-in²/W) |
| Construction & Compostion |
Ceramic filled silicone rubber | *** | 10mils / 0.254 mm | 0.21 |
| 20mils / 0.508 mm | 0.27 | |||
| Specific Gravity | 2.8 g /cc | ASTM D297 |
30mils / 0.762 mm |
0.39 |
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40mils / 1.016 mm |
0.43 | |||
| Heat Capacity | 1 l /g-K | ASTM C351 |
50mils / 1.270 mm |
0.50 |
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60mils / 1.524 mm |
0.58 |
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| Hardness | 20 Shore 00 | ASTM 2240 |
70mils / 1.778 mm |
0.65 |
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80mils / 2.032 mm |
0.76 | |||
| Tensile Strength |
55 ps |
ASTM D412 |
90mils / 2.286 mm |
0.85 |
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100mils / 2.540 mm |
0.94 | |||
| Continuos Use Temp | -40 to 160℃ |
*** |
110mils / 2.794 mm |
1.00 |
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120mils / 3.048 mm |
1.07 | |||
| Dielectric Breakdown Voltage | >5500 VAC | ASTM D149 |
130mils / 3.302mm |
1.16 |
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140mils / 3.556 mm |
1.25 | |||
| Dielectric Constant | 4.2 MHz | ASTM D150 |
150mils / 3.810 mm |
1.31 |
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160mils / 4.064 mm |
1.38 | |||
| Volume Resistivity | 1.0X1012 Ohm-meter | ASTM D257 |
170mils / 4.318 mm |
1.43 |
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180mils / 4.572 mm |
1.50 | |||
| Fire rating | 94 V0 |
equivalent UL |
190mils / 4.826 mm |
1.60 |
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200mils / 5.080 mm |
1.72 | |||
| Thermal conductivity | 1.8 W/m-K | ASTM D5470 | Visua l/ ASTM D751 | ASTM D5470 |
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Thickness |
2.5mmT | *** | ||
Packaging Details & Lead time
The packaging of thermal pad
1.with PET film or foam-for protection
2. use Paper Card To Separate Each Layer
3. export carton inside and outside
4. meet with customers' requirement-customized
Lead Time :Quantity(Pieces):5000
Est. Time(days): To be negotiated
Why Choose us ?
1.Our value message is'' Do it right the First time, total quality control''.
2.Our core competencies is thermal conductive interface materials
3.Competitive advantage products.
4.Condidentiality agreement Bussiness Secrect Contract
5.Free sample offer
6.Quality assurance contract
Contact Person: Miss. Dana
Tel: 18153789196
