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13.0W/MK Ultra Soft Thermal Gap Filler Wireless Routers Heatsink Thermal Pad

China Dongguan Ziitek Electronic Materials & Technology Ltd. certification
China Dongguan Ziitek Electronic Materials & Technology Ltd. certification
The Thermal Conductive Pad is looking and working very good. We have no need for other Thermal Conductive Pad now!

—— Peter Goolsby

I had cooperated with Ziitek for 2 years, they provided high quality thermal conductive materials, and delivery in time, recommend their phase change materials

—— Antonello Sau

Good quality, Good service. Your team always give us help and resolving, hope we will be good partner all the time!

—— Chris Rogers

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13.0W/MK Ultra Soft Thermal Gap Filler Wireless Routers Heatsink Thermal Pad

13.0W/MK Ultra Soft Thermal Gap Filler Wireless Routers Heatsink Thermal Pad

Large Image :  13.0W/MK Ultra Soft Thermal Gap Filler Wireless Routers Heatsink Thermal Pad

Product Details:
Place of Origin: China
Brand Name: ZIITEK
Certification: UL RoHs
Model Number: TIF800QE
Payment & Shipping Terms:
Minimum Order Quantity: 1000pcs
Price: negotiation
Packaging Details: 1000pcs/bag
Delivery Time: 3-5work days
Supply Ability: 100000pcs/day
Detailed Product Description
Products Name: 13.0W/MK Ultra Soft Thermal Gap Filler Wireless Routers Heatsink Thermal Pad Thermal Conductivity: 13.0W/mK
Application: Wireless Router Dielectric Breakdown Voltage: >5500 (V/mm)
Feature: Available In Different Thickness Options Keywords: Thermal Gap Filler
Hardness: 35 Shore 00
Highlight:

thermally conductive filler

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thermal conductivity silicone

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Ultra Soft Thermal Gap Filler

 13.0W/MK Ultra Soft Thermal Gap Filler Wireless Routers Heatsink Thermal Pad
 
The TIF800QE series of thermal interface materials is specifically designed to fill air gaps between heat-generating components and heat sinks or metal baseplates. It ofers excellent compliance, allowing it to conform tightly to heat sources with varying shapes and height differences. Even in confined or irregular spaces,it maintains stable thermal conductivity,enabling efficient heat transfer from discrete components or the entire PCB to the metal housing or heat sink.This significantly improves the heat dissipation eficiency of electronic lcomponents, thereby enhancing operational stability and extending device lifespan.


Features:


> Good thermal conductive: 13.0W/mK
> Naturally tacky needing no further adhesive coating
> High compliance adapts to various pressure application environments
> Available in different thickness options


Applications:

 

> Heat dissipation structure for radiators
> Telecommunication equipment
> Automotive electronics
> Battery packs for electric vehicles
> LED drivers and lamps

> Handheld portable electronics
> Semiconductor automated test equipment (ATE)
> CPU
> Display card
> Mainboard/mother board

 

Typical Properties of TIF®800QE Series
Color Gray Visual
Construction Ceramic filled silicone elastomer ******
Thickness Range(inch/mm) 0.03~0.20inch(0.75mm~5.0mm)  ASTM D374
Density(g/cc) 3.7 g/cc ASTM D792
Hardness 35 Shore 00 ASTM 2240
Recommended Operating Temperature(℃) -40 to 200℃ ******
Dielectric Breakdown Voltage >5500 VAC ASTM D149
Dielectric Constant @ 1MHz 8 ASTM D150
Volume Resistivity ≥1.0X10¹² Ohm-meter ASTM D257
Flame rating V-0 UL94(E331100)
Thermal conductivity 13.0W/m-K ASTM D5470
 

 

Product Specifications
Standard Thickness: 0.02 to 0.20 (0.50 to 5.0mm) with increments of 0.01 (0.25mm).
Standard Size: 16" X 16" (406mm X 406mm).
Component Codes:
Reinforcement Fabric: FG (Fiberglass).
Coating Options:NS1 (Non-adhesive treatment),DC1(Single-sided hardening).
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive).
Notes:FG(Fiberglas)provides enhanced strength, suitable for materials with thicknesses of 0.01 to 0.02 inch (0.25 to 0.5mm).
TheTIF series is available in custom shapes and various forms. For other thicknesses or more information, please contact us.

13.0W/MK Ultra Soft Thermal Gap Filler Wireless Routers Heatsink Thermal Pad 0

Certifications:
ISO9001:2015
ISO14001: 2004 IATF16949:2016
IECQ QC 080000:2017
UL

 

Company Profile
With a wide range, good quality, reasonable prices and stylish designs, Ziitek thermal conductive interface materials are extensively used in Mainboards, VGA cards, Notebooks, DDR&DDR2 products, CD-ROM ,LCD TV, PDP products, Server Power products, Down lamps, Spotlights, Street lamps, Daylight lamps, LED Server Power products and others.
 
FAQ:

Q: Are you trading company or manufacturer ?

A: We are manufacturer in China

 

Q: How long is your delivery time?
A: Generally it is 3-7 work days if the goods are in stock. or it is 7-10 work days if the goods are not in stock, it is according to quantity.

 

Q: Do you offer free samples ?

A: Yes, we are willing to offer free sample.

Contact Details
Dongguan Ziitek Electronic Materials & Technology Ltd.

Contact Person: Dana Dai

Tel: 18153789196

Send your inquiry directly to us (0 / 3000)