13.0W/MK Ultra Soft Thermal Gap Filler Wireless Routers Heatsink Thermal Pad

The TIF^®️800QE series of thermal interface materials is specifically designed to fill air gaps between heat-generating components and heat sinks or metal baseplates. It offers excellent compliance, allowing it to conform tightly to heat sources with varying shapes and height differences. Even in confined or irregular spaces, it maintains stable thermal conductivity, enabling efficient heat transfer from discrete components or the entire PCB to the metal housing or heat sink. This significantly improves the heat dissipation efficiency of electronic components, thereby enhancing operational stability and extending device lifespan.

Standard Thickness: 0.02 to 0.20 (0.50 to 5.0mm) with increments of 0.01 (0.25mm).

Standard Size: 16" × 16" (406mm × 406mm).

The TIF^®️ series is available in custom shapes and various forms. For other thicknesses or more information, please contact us.

Founded in 2006, ZIITEK specializes in the development and manufacturing of thermal management materials for electric vehicles, energy storage systems and automotive electronics. Our product portfolio includes thermal pads, thermal gels, thermal greases, phase change materials, thermal potting compounds and thermally conductive insulating materials. These solutions can be used in battery packs, energy storage systems, BMS, power modules and automotive electronic systems. Through solutions for thermal conductivity, electrical insulation, gap filling, cushioning and sealing, ZIITEK helps customers improve thermal management efficiency, safety and long-term reliability.