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Heat Sink Thermal Conductive Adhesive Tape , 0.9 W / mK Glass Fiber Backing Heat Resistant Tape

China Dongguan Ziitek Electronic Materials & Technology Ltd. certification
China Dongguan Ziitek Electronic Materials & Technology Ltd. certification
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Heat Sink Thermal Conductive Adhesive Tape , 0.9 W / mK Glass Fiber Backing Heat Resistant Tape

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Large Image :  Heat Sink Thermal Conductive Adhesive Tape , 0.9 W / mK Glass Fiber Backing Heat Resistant Tape

Product Details:
Place of Origin: China
Brand Name: Ziitek
Certification: RoHs
Model Number: TIA815
Payment & Shipping Terms:
Minimum Order Quantity: 10SQM
Packaging Details: 10RL/bag
Delivery Time: 2-3Work day
Supply Ability: 1000SQM/Day
Detailed Product Description
Thickness: 0.1mmT~0.5mmT Adhesive Type: Acrylic Adhesive
Peel Adhesion: 1200 G/inch2 Thermal Conductivity: 0.9 W/mK
Voltage Breakdown: > 3500 Vac
High Light:

adhesive foam tape

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thermally conductive adhesive tape

Heat Sink Thermal Conductive Adhesive Tape , 0.8 W / mK Glass Fiber Backing Heat Resistant Tape

 

The TIA™815 Series products are mostly used for bonding heat dissipation fins, microprocessors and other power consumption semiconductors. This type of adhesive tape possesses ultimate bonding strength with low thermal impedance, with which in effect can be able to replace the method of lubricating grease and mechanical fixing.

 

TIA800 Series Datasheet-(E)-REV01.pdf


Features

 

Thermal Conductivity 0.9W/mK.
High bond strength to a variety of surfaces
Double sided pressure sensitive adhesive tape.
High performance, thermally conductive acrylic adhesive
allow for good conformability to irregular surfaces and good electrical isolation
Easy Application
Eliminates need for external hardware (screws, clips, etc.)
Available with easy release tabs

 

 

Applications

 

Mount heat sink onto BGA graphic processor or drive processor.
Mount heat spreader onto power converter PCB or onto motor control PCB
Can be used instead of heat cure adhesive,screw mounting or clip mounting
Heat sink onto BGA graphic processor
Heat sink to computer processor
Heat sink onto drive processor
LED Power Supply
LED Controller
LED Lights
LED Ceilinglamp
Monitoring the Power Box
AD-DC Power Adapters
Rainproof LED Power Supply
Waterproof LED Power Supply
Piranha wroof and common lED module
LED module for Channelletters
SMD LED module
LED Flesible strip, LED bar
LED PanelLight

 

Typical Properties of TIA™800 Series
Product Name TIA™815 Test Method
Color White Visual
Construction Ceramic filled silicone elastomer ***
&Compostion
Composite Thickness 0.015"/0.381mm ASTM D751
Specific Gravity 2.4 g/cc ASTM D297
Specific Gravity 1 l/g-K ASTM C351
Hardness 50 Shore A ASTM 2240
Tensile Strength >600 psi ASTM D412
Continuous Use Temp (-58 to 356℉) / (-50 to 180℃) ***
Electrical  
Dielectric Breakdown Voltage >5000 VAC ASTM D149
Dielectric Constant 5.5 MHz ASTM D150
Volume Resistivity 5.0X10" Ohm-meter ASTM D257
Flame Rating 94 V0 equivalent UL
Thermal  
Thermal Conductivity 0.9 W/m-K ASTM D5470
Thermal lmpedance @50psi 1.23℃-in²/W ASTM D5471
 
Heat Sink Thermal Conductive Adhesive Tape , 0.9 W / mK Glass Fiber Backing Heat Resistant Tape 0
 
Standard Thicknesses:

0.005"(0.127mm) 0.006"(0.152mm) 0.008"(0.203mm) 0.010"(0.254mm) 0.015"(0.381mm) 0.020"(0.508mm)
Consult the factory alternate thickness.

Standard Sizes:

10" x 18"(254mm x 457mm) 10" x 400'(254mm x 121.9M)
Individual die cut shapes can be supplied.

Reinforcement:

TIA™800 Series sheets are fiberglass reinforced.

Contact Details
Dongguan Ziitek Electronic Materials & Technology Ltd.

Contact Person: Dana

Tel: +8618153789196

Send your inquiry directly to us (0 / 3000)