The Thermal Conductive Pad is looking and working very good. We have no need for other Thermal Conductive Pad now!
—— Peter Goolsby
I had cooperated with Ziitek for 2 years, they provided high quality thermal conductive materials, and delivery in time, recommend their phase change materials
—— Antonello Sau
Good quality, Good service. Your team always give us help and resolving, hope we will be good partner all the time!
2.5mm Thickness Thermal Gap Pad Ziitek TIF5100US For Micro heat pipe thermal solutions 18 Shore 00 2.95 g/cc The TIF5100US Series thermally conductive interface materials are applied to fill the air gaps ... Read More
high cost-effective 45 psi Silicon Thermal Gap Pad 3mmT 94 V0 for LED street light with good performance 2.6w TIF5120US The TIF5120US Series thermally conductive interface materials are applied to fill the air ... Read More
3.5mm 94 V0 new developed Silicon Thermal Gap Pad for Automotive engine control units 2.6w TIF5140US China supplied The TIF5140US Series thermally conductive interface materials are applied to fill the air gaps ... Read More
manufactured High durability silicone sheets for LED Controller The TIF1160-40-11US is a silicone based, thermally conductive gap pad. Its unreinforced construction allows additional compliancy. This product ... Read More
Easily attached gray thermal silicone pad 4w/mK silicone heatsink pads -40 to 160 for router The TIF5120-40-11US is recommended for applications that require a minimum amount of pressure on components. The ... Read More
4.5mmT Hardness 20 shore 00 High durability silicone pads for Monitoring the Power Box The TIF1180-32-05US is recommended for applications that require a minimum amount of pressure on components. The viscoelast... Read More
TIC808A Phase Changing Materials in High Frequency Microprocessors Company Profile Ziitek company is a manufacturer of thermal conductive gap fillers, low melting point thermal interface materials, thermal ... Read More
>5W / MK UL China company supplied silicone sheets 2.0mmT,45 SHORE00 for mainboard/mother board The TIF580-50-11US is not only designed to take advantage of the gap heat transfer, to fill gaps, complete the ... Read More
3.0mmT,Continuos Use Temp: -40 to 160,an electrically isolating silicone pads for IT infrastructure The TIF1120-30-11ES is a highly compliant Gap Pad material that is ideal for fragile component leads. The ... Read More
Cache Chips gray 2.5 W/mK No heat sink preheating required phase changing materials The TIC808A is low melting point thermal interface material. At 50, The TIC800A Series begins to soften and flow, filling the ... Read More