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Pink Semiconductor Automated Test Equipment Thermal Gap Filler Silicone Pad 3.0W/MK

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China Dongguan Ziitek Electronic Materials & Technology Ltd. certification
China Dongguan Ziitek Electronic Materials & Technology Ltd. certification
Customer Reviews
The Thermal Conductive Pad is looking and working very good. We have no need for other Thermal Conductive Pad now!

—— Peter Goolsby

I had cooperated with Ziitek for 2 years, they provided high quality thermal conductive materials, and delivery in time, recommend their phase change materials

—— Antonello Sau

Good quality, Good service. Your team always give us help and resolving, hope we will be good partner all the time!

—— Chris Rogers

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Pink Semiconductor Automated Test Equipment Thermal Gap Filler Silicone Pad 3.0W/MK

Pink Semiconductor Automated Test Equipment Thermal Gap Filler Silicone Pad 3.0W/MK
Pink Semiconductor Automated Test Equipment Thermal Gap Filler Silicone Pad 3.0W/MK Pink Semiconductor Automated Test Equipment Thermal Gap Filler Silicone Pad 3.0W/MK Pink Semiconductor Automated Test Equipment Thermal Gap Filler Silicone Pad 3.0W/MK Pink Semiconductor Automated Test Equipment Thermal Gap Filler Silicone Pad 3.0W/MK Pink Semiconductor Automated Test Equipment Thermal Gap Filler Silicone Pad 3.0W/MK

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Product Details:
Place of Origin: China
Brand Name: ZIITEK
Certification: UL and RoHs
Model Number: TIF100-30-25S
Payment & Shipping Terms:
Minimum Order Quantity: 1000pcs
Price: Negotiation
Packaging Details: 1000pcs/bag
Delivery Time: 3-5 workdays
Payment Terms: T/T
Supply Ability: 10000/day

Pink Semiconductor Automated Test Equipment Thermal Gap Filler Silicone Pad 3.0W/MK

Description
Prodcuts Name: Pink Semiconductor Automated Test Equipment Thermal Gap Filler Silicone Pad 3.0W/MK Thermal Conductivity: 3.0W/m-K
Densisy: 3.0g/cm³ Sample: Free Sample
Color: Pink/light Pink Recommended Operating Temperature: -40 To 200℃
Hardness: 45/65 Shore 00 Keywords: Thermal Gap Filler Pad
Application: Semiconductor Automated Test Equipment
Highlight:

thermally conductive filler

,

thermal conductivity silicone

,

silicone pad 3.0 W/MK

Pink Semiconductor Automated Test Equipment Thermal Gap Filler Silicone Pad 3.0W/MK

 

Company Profile

 

Ziitek company is a manufacturer of thermal conductive gap fillers, low melting point thermal interface materials, thermal conductive insulators, thermally conductive tapes, electrically & thermally conductive Interface pads and thermal grease,Thermal Conductive plastic,Silicone Rubber,Silicone Foams,Phase Changing Materials products, with well-equipped testing equipment and strong technical force.

 

The TIF®100-30-25S is a silicone based, thermally conductive gap pad. Its unreinforced construction allows additional compliancy. This product has low hardness is conformable and is electrically isolating. The low modulus characteristic of the product offers optimal thermal performance with the ease of handling


Features:


>  Good thermal conductive:3.0 W/mK 

>  Naturally tacky needing no further adhesive coating 
>  Soft and Compressible for low stress applications
>  Available in varies thickness


Applications:


>  Cooling components to the chassis of frame  
>  High speed mass storage drives
>  Heat Sinking Housing at LED-lit BLU in LCD
>  LED TV and LED-lit lamps
>  RDRAM memory modules 
>  Micro heat pipe thermal solutions 
>  Automotive engine control units
>  Telecommunication hardware
>  Handheld portable electronics
>  Semiconductor automated test equipment (ATE)

 

Typical Properties of TIF®100-30-25S Series
Property Value Test method
Color Pink Visual
Construction & Compostion Ceramic filled silicone elastomer ******
Density(g/cm³) 3.0 ASTM D792
Thickness Range(inch/mm) 0.010~0.020 0.030~0.200 ASTM D374
(0.25~0.50) (0.75~5.00)
Hardness (Shore 00) 65 45 ASTM 2240
Recommended Operating Temperature -40 to 200℃ ******
Breakdown Voltage(V/mm) ≥5500 ASTM D149
Dielectric Constant 6.0 MHz ASTM D150
Volume Resistivity >1.0X1012 Ohm-meter ASTM D257
Flame rating V-0 UL 94 (E331100)
Thermal conductivity 3.0 W/m-K ASTM D5470
3.0 W/m-K ISO22007

 

Product Specification


Product Thicknesses: 0.010"(0.25mm)~ 0.200" (5.00mm) with increments of 0.010"(0.25mm).
Product Sizes: 16" x 16" (406mm x 406mm)

 

Component Codes:


Reinforcement Fabric: FG (Fiberglass).
Coating Options: NS1 (Non-adhesive treatment),
DC1 (Single-sided hardening).
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive).

 

The TIF® series is available in custom shapes and various forms.
For other thicknesses or more information, please contact us.

Pink Semiconductor Automated Test Equipment Thermal Gap Filler Silicone Pad 3.0W/MK 0
Why Choose us ?

 

1.Our value message is'' Do it right the First time, total quality control''.

2.Our core competencies is thermal conductive interface materials

3.Competitive advantage products.

4.Condidentiality agreement Bussiness Secrect Contract

5.Free sample offer

6.Quality assurance contract

 

Ziitek Culture

 

Quality :

Do it right the first time, total quality control

Effectiveness:

Work precisely and thoroughly for effectiveness

Service:

Quick response, On time delivery and Excellent service

Team work:

Complete teamwork, including sales team, Marketing team, engineering team, R&D team, Manufacturing team, logistics team. All is for supporting and servicing a satisfy service for customers.

 
FAQ:
Q: Are you trading company or manufacturer ?
A: We are manufacturer in China.
Q: Do you provide samples ? is it free or extra cost?
A: Yes, we could offer samples free of charge.

Contact Details
Dongguan Ziitek Electronic Materials & Technology Ltd.

Contact Person: Dana Dai

Tel: +86 18153789196

Send your inquiry directly to us (0 / 3000)