The Thermal Conductive Pad is looking and working very good. We have no need for other Thermal Conductive Pad now!
—— Peter Goolsby
I had cooperated with Ziitek for 2 years, they provided high quality thermal conductive materials, and delivery in time, recommend their phase change materials
—— Antonello Sau
Good quality, Good service. Your team always give us help and resolving, hope we will be good partner all the time!
professional factory Electrically isolating Outstanding thermal performance thermal gap pad for routers ,2.0 g/cc The TIF1160-12-05US is not only designed to take advantage of the gap heat transfer, to fill ... Read More
High Frequency Microprocessors Thermal Interface Pad Low Resistance -25 - 125 The TIC800P Series is low melting point thermal interface material. At 50, The TIC800P Series begins to soften and flow, filling the ... Read More
No Need Preheating Pink Thermal Phase Change Interface Material For Notebook The TIC808P Series is low melting point thermal interface material. At 50, The TIC808P Series begins to soften and flow, filling the ... Read More
Pink Low Resistance Thermal phase chaging materials Interface Pad For Computer Serves 0.95 W/MK The TIC803P Series is low melting point thermal interface material. At 50, The TIC800P Series begins to soften and ... Read More
5.0 W/mK Low Thermal Resistance Pink Phase Changing Materials For IGBTs TIC808P series is low melting point thermal interface material. At 50, TIC808P series begins to soften and flow, filling the microscopic ... Read More
LED lighting Thermal phase changing materials Interface Pad Pink Low Resistance 0.95 W/MK The TIC810P Series is low melting point thermal interface material. At 50, The TIC810P Series begins to soften and flow, ... Read More
0.95W/mK YELLOW Thermal Phase Changing Materials TIC805Y with 0.024-in / W The TIC805Y Series is low melting point thermal interface material. At 50, The TIC805Y Series begins to soften and flow, filling the ... Read More
Electrically isolating new developed silicone thermal pad for Audio and video components,2.9 g/cc,1.5mmT The TIF160-30-11ES is recommended for applications that require a minimum amount of pressure on ... Read More
UL recognized popular thermal gap filler for Handheld portable electronics,3.0 W/m-K,2.9 g/cc The TIF1160-30-11ES use a special process, with silicone as the base material, adding thermal conductive powder and ... Read More
UL recognized High durability 5.0 W/mK silicone pads for Semiconductor automated test equipment,1.0mmT The TIF140-50-11US thermal silicone pad is a product with both performance and economy. It is a unique ... Read More