The Thermal Conductive Pad is looking and working very good. We have no need for other Thermal Conductive Pad now!
—— Peter Goolsby
I had cooperated with Ziitek for 2 years, they provided high quality thermal conductive materials, and delivery in time, recommend their phase change materials
—— Antonello Sau
Good quality, Good service. Your team always give us help and resolving, hope we will be good partner all the time!
Ultrasoft CPU Heatsink Pad Thermal Gap Filler 1.5 W/m-K Green Thermal Silicone Pads 45 Shore 00 TIF100-07S The TIF100-07S is a silicone based, thermally conductive gap pad. Its unreinforced construction allows ... Read More
2 W/m-K Silicone Rubber Thermal Gap Filler For Automotive Engine Control Units45 Shore 00 TIF100-20-02s Company Profile Ziitek Electronic Material and Technology Ltd. is dedicated to developing composite ... Read More
4.0W/Mk Ultra Soft Low Resistance Thermal Gap Pad TIF100-40-07E Light Green 5.5 MHz Dielectric Constant The TIF100-40-07E thermally conductive interface materials are applied to fill the air gaps between the ... Read More
High Voltage Isolation Heatsink Thermal Pads Non Toxic 2.0W / mK For Micro Heat Pipe The TIF100-20-11S Series thermally conductive interface materials are applied to fill the air gaps between the heating ... Read More
Ziitek thermal conductive interface materials are widely recognized and trusted by users and can meet continuously developing economic and social needs. 2.5mm T Thickness Thermal Gap Filler Pad , 3W / MK LED ... Read More
0.5mm T Fiberglass Reinforced Thermal Gap Filler Pad For Heat Sinking Housing The TIF120FG-14S is not only designed to take advantage of the gap heat transfer, to fill gaps, complete the heat transfer between ... Read More
high cost-effective 4.0mmT thermal gap filler for SMD LED module, 20 Shore 00 The TIF1160-50-11US is not only designed to take advantage of the gap heat transfer, to fill gaps, complete the heat transfer ... Read More
3.0W Gray Easy Release Construction Silicone Pads for IT Infrastructure The TIF1160-30-02US is not only designed to take advantage of the gap heat transfer, to fill gaps, complete the heat transfer between ... Read More
Low Thermal Resistance High Dielectric Constant Materials For CPU Heat Sinking The TIF100-16-38UF thermally conductive interface materials are applied to fill the air gaps between the heating elements and the ... Read More
Compressible Thermal Gap Filler For Semiconductor Automated Test Equipment, High tack surface reduces resistance The TIF100-12F thermally conductive interface materials are applied to fill the air gaps between ... Read More
