The Thermal Conductive Pad is looking and working very good. We have no need for other Thermal Conductive Pad now!
—— Peter Goolsby
I had cooperated with Ziitek for 2 years, they provided high quality thermal conductive materials, and delivery in time, recommend their phase change materials
—— Antonello Sau
Good quality, Good service. Your team always give us help and resolving, hope we will be good partner all the time!
Gray Heat Dissipation Fins Thermal Gap Filler For notebook, -40 - 160 Continuos Use Temp 3.0 W/m-K The TIF120-30-11US is not only designed to take advantage of the gap heat transfer, to fill gaps, complete the ... Read More
LED Lamp Heat Resistant Adhesive Thermal Conductive with Ceramic Filled Silicone Elastomer The TIA810FG Series products are mostly used for bonding heat dissipation fins, microprocessors and other power ... Read More
Thermal conductive adhesive fire resistance tape TIA608P 0.2mm thickness for bonding heat microprocessors The TIA608P Series products are mostly used for bonding heat dissipation fins, microprocessors and other ... Read More
Pink Color Thermal Heat Conductivity Materials Silicone Laptop Gap Filler Pad The TIF110FG-14E thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat ... Read More
Blue 3W Thermally Conductive Gel Thermal Gap Filler High Viscosity For Micro Heat Pipe TIF030-05 is a soft silicone gel-based gap filer pad, formulated with a special blend of filers to provide both excellent ... Read More
Highest Thermal Gap Filler Thermal Conductive Pad For Electronics Heat Transfer The TIF800QE series of thermal interface materials is specifically designed to fill air gaps between heat-generating components ... Read More
Thermal Management Materials 1.5W Silicone thermal gap pad for Chip heat dissipation Company profile Dongguan Zhaoke Electronic Material Technology Co., Ltd. was established in 2006. Is a high-tech enterprise ... Read More
3mm Thickness Thermal Pad Silicone Laptop Die Cuts High Cooling Thermal Heating Pads For Chipset Battery Factory Thermal Pad The TIF7120RUS is recommended for applications that require a minimum amount of ... Read More
Outgasing 0.35% UL recognized Conductive Pads for Micro Heat Pipe Thermal Solutions The TIF1160-05UF use a special process, with silicone as the base material, adding thermal conductive powder and flame ... Read More
1.2W/Mk Thermal Pad Multi Size Silicone Pad High-Temperature CPU Graphics Card Heat Dissipation Insulation Pad The TIF100-12-05ES is recommended for applications that require a minimum amount of pressure on ... Read More