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Ceramic Filled Silicone Elastomer Thermal Adhesive tape, Thickness 0.1~0.5mmT

China Dongguan Ziitek Electronic Materials & Technology Ltd. certification
China Dongguan Ziitek Electronic Materials & Technology Ltd. certification
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Ceramic Filled Silicone Elastomer Thermal Adhesive tape, Thickness 0.1~0.5mmT

Ceramic Filled Silicone Elastomer Thermal Adhesive tape, Thickness 0.1~0.5mmT
Ceramic Filled Silicone Elastomer Thermal Adhesive tape, Thickness 0.1~0.5mmT Ceramic Filled Silicone Elastomer Thermal Adhesive tape, Thickness 0.1~0.5mmT Ceramic Filled Silicone Elastomer Thermal Adhesive tape, Thickness 0.1~0.5mmT Ceramic Filled Silicone Elastomer Thermal Adhesive tape, Thickness 0.1~0.5mmT Ceramic Filled Silicone Elastomer Thermal Adhesive tape, Thickness 0.1~0.5mmT

Large Image :  Ceramic Filled Silicone Elastomer Thermal Adhesive tape, Thickness 0.1~0.5mmT

Product Details:
Place of Origin: China
Brand Name: Ziitek
Certification: RoHs
Model Number: TIA808FG Replace Bergquist Bond-Ply 100
Payment & Shipping Terms:
Minimum Order Quantity: 10SQM
Packaging Details: 10RL/bag
Delivery Time: 2-3Work day
Supply Ability: 1000SQM/Day
Detailed Product Description
Thickness: 0.1~0.5mmT Color: White
Construction &Compostion: Ceramic Filled Silicone Elastomer Peel Adhesion: 1200 G/inch2
Thermal Conductivity: 0.8 W/mK Hardness: 50 Shore A
High Light:

thermally conductive adhesives

,

acrylic based adhesive

Ceramic Filled Silicone Elastomer Thermal Adhesive tape, Thickness 0.1~0.5mmT

 

Company Profile

Ziitek company is a high-tech enterprise which dedicated to the R&D, manufacture and sales of the thermal interface materials (TIMs). We have rich experiences in this field which can support you the latest, most effective and one -step thermal management solutions. We have many advanced production equipments,full test equipments and fully automatic coating production lines which can support the production for high performance thermal silicone pad, thermal graphite sheet/ film, thermal double-sided tape, thermal insulation pad, thermal ceramic pad, phase change material, thermal grease etc. UL94 V-0, SGS and ROHS are compliant.
 
 The TIA™800FG Series products are mostly used for bonding heat dissipation fins, microprocessors and other power consumption semiconductors. This type of adhesive tape possesses ultimate bonding strength with low thermal impedance, with which in effect can be able to replace the method of lubricating grease and mechanical fixing.
 

Features

> Thermal Conductivity: 1.2 W/mK
> High bond strength to a variety of surfaces double sided pressure sensitive adhesive tape
> High performance, thermally conductive acrylic adhesive

Applications

> Mount heat sink onto BGA graphic processor or drive processor
> Mount heat spreader onto power converter PCB or onto motor control PCB
> High performance, thermally conductive acrylic adhesive 
> Can be used instead of heat cure adhesive,screw mounting or clip mounting
 
Typical Properties of TIA™800FG Series
Product Name TIATM805FG TIATM806FG TIATM808FG TIATM810FG TIATM815FG TIATM820FG  Test  Method
Color White Visual
Adhesive Type Acrylic Adhesive ********
Backing Type Glass fiber ********
Composite Thickness 0.005" 0.127mm 0.006" 0.152mm 0.020" 0.203mm 0.010" 0.254mm 0.015" 0.381mm 0.020" 0.508mm ASTM D374
Glass fiber Thickness ±0.001"  ±0.025mm ±0.001"  ±0.025mm ±0.0012" ±0.03mm ±0.0012" ±0.03mm ±0.0015" ±0.038mm ±0.002"  ±0.05mm

ASTM D374

Voltage Breakdown > 2000 Vac > 2000 Vac > 2300 Vac > 3000 Vac > 3500 Vac > 3500 Vac ASTM D149
Peel Adhesion 1200 g/inch2 JIS K02378

Holding Power
25℃/Days

> 120 kg/inch2 JIS K023711
Holding Power 120℃/Hours > 10 kg/inch2 JIS K023711
Recommend Using Pressure 10 psi ********
Thermal Conductivity 0.8W/mK ********

Thermal
Impedance@50psi

0.52℃-in²/W 0.59℃-in²/W 0.83℃-in²/W 0.91℃-in²/W 1.15℃-in²/W 1.43℃-in²/W ASTM D5470
 
 
Standard Thicknesses:      
     
0.005"(0.127mm)     0.006"(0.152mm)     0.008"(0.203mm)     0.010"(0.254mm)     0.015"(0.381mm)     0.020"(0.508mm)   
Consult the factory alternate thickness.

Standard Sizes: 

10" x 18"(254mm x 457mm)    10" x 400'(254mm x 121.9M) 
Individual die cut shapes can be supplied.

Reinforcement:     
                
TIA™800 Series sheets are fiberglass reinforced.
Ceramic Filled Silicone Elastomer Thermal Adhesive tape, Thickness 0.1~0.5mmT 0

Ziitek Culture

 

Quality :

Do it right the first time, total quality control

Effectiveness:

Work precisely and thoroughly for effectiveness

Service:

Quick response, On time delivery and Excellent service

Team work:

Complete teamwork, including sales team, Marketing team, engineering team, R&D team, Manufacturing team, logistics team. All is for supporting and servicing a satisfy service for customers.

 

Contact Details
Dongguan Ziitek Electronic Materials & Technology Ltd.

Contact Person: Dana

Tel: +8618153789196

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