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Product Details:
Payment & Shipping Terms:
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| Thickness: | Available In Varies Thicknes | Thermal Conductivity: | 5.0 W/m-K |
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| Construction & Compostion: | Ceramic Filled Silicone Rubber | Specific Gravity: | 2.75 G/cc |
| Heat Capacity: | 1 L /g-K | Typical Properties: | TIF100-50-05S |
| Highlight: | thermally conductive filler,thermal conductivity silicone,5.0W/mK Thermal Gap Filler Materials |
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Telecommunication Hardware Gap Fillers Materials With High Thermal Conductivity
Company Profile
Ziitek Electronic Material and Technology Ltd. is dedicated to developing composite thermal solution and manufacturing superior thermal interface materials for competitive market.
Our vast experience allows us to assist our customers best in thermal engineering field.
We serve customers with customized products, full product lines and flexible production, which makes us be the best and reliable partner of you. Let's make your design more perfect!
The TIF100-50-05S is not only designed to take advantage of the gap heat transfer, to fill gaps, complete the heat transfer between heating and cooling parts, but also played insulation, damping, sealing and so on, to meet the equipment miniaturization and ultra-thin design Requirements, which is a highly technology and use, and the thickness of the wide range of applications, is also an excellent thermal conductivity filler material.
Features:
> Good thermal conductive: 5.0 W/mK
> Naturally tacky needing no further adhesive coating
> Soft and Compressible for low stress applications
> Broad range of hardnesses available
> Outstanding thermal performance
Applications:
> mainboard/mother board
> LED TV and LED-lit lamps
> RDRAM memory modules
> Micro heat pipe thermal solutions
> Automotive engine control units
> Automotive electronics
> Handheld portable electronics
> Semiconductor automated test equipment (ATE)
> GPS navigation and other portable devices
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Typical Properties of TIF100-50-05S Series
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Color
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Blue |
Visual | Composite Thickness | hermalImpedance @10psi (℃-in²/W) |
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Construction &
Compostion |
Ceramic filled silicone rubber
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*** | 10mils / 0.254 mm | 0.36 |
| 20mils / 0.508 mm | 0.41 | |||
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Specific Gravity
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2.75 g/cc | ASTM D297 |
30mils / 0.762 mm |
0.47 |
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40mils / 1.016 mm |
0.52 | |||
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Heat Capacity
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1 l /g-K | ASTM C351 |
50mils / 1.270 mm |
0.58 |
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60mils / 1.524 mm |
0.65 |
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Hardness
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45 Shore 00 | ASTM 2240 |
70mils / 1.778 mm |
0.72 |
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80mils / 2.032 mm |
0.79 | |||
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Tensile Strength
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45 psi |
ASTM D412 |
90mils / 2.286 mm |
0.87 |
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100mils / 2.540 mm |
0.94 | |||
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Continuos Use Temp
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-50 to 200℃ |
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110mils / 2.794 mm |
1.01 |
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120mils / 3.048 mm |
1.09 | |||
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Dielectric Breakdown Voltage
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>10000 VAC | ASTM D149 |
130mils / 3.302mm |
1.17 |
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140mils / 3.556 mm |
1.24 | |||
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Dielectric Constant
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5.5 MHz | ASTM D150 |
150mils / 3.810 mm |
1.34 |
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160mils / 4.064 mm |
1.42 | |||
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Volume Resistivity
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7.8X10" Ohm-meter | ASTM D257 |
170mils / 4.318 mm |
1.50 |
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180mils / 4.572 mm |
1.60 | |||
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Fire rating
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94 V0 |
equivalent UL |
190mils / 4.826 mm |
1.68 |
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200mils / 5.080 mm |
1.77 | |||
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Thermal conductivity
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5.0 W/m-K | ASTM D5470 | Visua l/ ASTM D751 | ASTM D5470 |
Packaging Details & Lead time
The packaging of thermal pad
1.with PET film or foam-for protection
2. use Paper Card To Separate Each Layer
3. export carton inside and outside
4. meet with customers' requirement-customized
Lead Time :Quantity(Pieces):5000
Est. Time(days): To be negotiated
Standard Sheets Sizes:
8" x 16"(203mm x 406mm)
TIF™ series Individual die cut shapes can be supplied.
Standard Thicknesses:
0.020" (0.51mm) 0.030" (0.76mm)
0.040" (1.02mm) 0.050" (1.27mm) 0.060" (1.52mm)
0.070" (1.78mm) 0.080" (2.03mm) 0.090" (2.29mm)
0.100" (2.54mm) 0.110" (2.79mm) 0.120" (3.05mm)
0.130" (3.30mm) 0.140" (3.56mm) 0.150" (3.81mm)
0.160" (4.06mm) 0.170" (4.32mm) 0.180" (4.57mm)
0.190" (4.83mm) 0.200" (5.08mm)
Consult the factory to alternate thickness.
Why Choose us ?
1.Our value message is'' Do it right the First time, total quality control''.
2.Our core competencies is thermal conductive interface materials
3.Competitive advantage products.
4.Condidentiality agreement Bussiness Secrect Contract
5.Free sample offer
6.Quality assurance contract
4.兆科文化
Contact Person: Miss. Dana
Tel: 18153789196
