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Telecommunication Hardware Blue 5.0W/mK Thermal Gap Filler Materials Thermal Silicone Rubber Pad

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China Dongguan Ziitek Electronic Materials & Technology Ltd. certification
China Dongguan Ziitek Electronic Materials & Technology Ltd. certification
Customer Reviews
The Thermal Conductive Pad is looking and working very good. We have no need for other Thermal Conductive Pad now!

—— Peter Goolsby

I had cooperated with Ziitek for 2 years, they provided high quality thermal conductive materials, and delivery in time, recommend their phase change materials

—— Antonello Sau

Good quality, Good service. Your team always give us help and resolving, hope we will be good partner all the time!

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Telecommunication Hardware Blue 5.0W/mK Thermal Gap Filler Materials Thermal Silicone Rubber Pad

Telecommunication Hardware Blue 5.0W/mK Thermal Gap Filler Materials Thermal Silicone Rubber Pad
Telecommunication Hardware Blue 5.0W/mK Thermal Gap Filler Materials Thermal Silicone Rubber Pad Telecommunication Hardware Blue 5.0W/mK Thermal Gap Filler Materials Thermal Silicone Rubber Pad Telecommunication Hardware Blue 5.0W/mK Thermal Gap Filler Materials Thermal Silicone Rubber Pad

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Product Details:
Place of Origin: China
Brand Name: ZIITEK
Certification: UL and RoHs
Model Number: TIF100-50-05S
Document: TIF100-50-05S_Data Sheet.pdf
Payment & Shipping Terms:
Minimum Order Quantity: 1000pcs
Price: Negotiation
Packaging Details: 1000pcs/bag
Delivery Time: 3-5work days
Payment Terms: T/T
Supply Ability: 10000/day

Telecommunication Hardware Blue 5.0W/mK Thermal Gap Filler Materials Thermal Silicone Rubber Pad

Description
Product Name: Telecommunication Hardware Blue 5.0W/mK Thermal Gap Filler Materials Thermal Silicone Rubber Pad Thickness: Available In Varies Thicknes
Thermal Conductivity: 5.0 W/m-K Construction: Ceramic Filled Silicone Elastomer
Density: 3.4 G/cm³ Keywords: Thermal Gap Filler
Model: TIF100-50-05S Application: Telecommunication Hardware
Color: Blue
Highlight:

thermally conductive filler

,

thermal conductivity silicone

,

5.0W/mK Thermal Gap Filler Materials

Telecommunication Hardware Blue 5.0W/mK Thermal Gap Filler Materials Thermal Silicone Rubber Pad


Company Profile


Dongguan Ziitek Electronic Material and Technology Ltd. is dedicated to developing composite thermal solution and manufacturing superior thermal interface materials for competitive market. Our vast experience allows us to assist our customers best in thermal engineering field. We serve customers with customized products, full product lines and flexible production, which makes us be the best and reliable partner of you. Let's make your design more perfect!


Products description


The TIF®100-50-05S is not only designed to take advantage of the gap heat transfer, to fill gaps, complete the heat transfer between heating and cooling parts, but also played insulation, damping, sealing and so on, to meet the equipment miniaturization and ultra-thin design Requirements, which is a highly technology and use, and the thickness of the wide range of applications, is also an excellent thermal conductivity filler material.


Features:


>  Good thermal conductive: 5.0 W/mK 
>  Naturally tacky needing no further adhesive coating 
>  Soft and Compressible for low stress applications
>  Broad range of hardnesses available

> Outstanding thermal performance


Applications:


>  mainboard/mother board
>  LED TV and LED-lit lamps
>  RDRAM memory modules 
>  Micro heat pipe thermal solutions 
>  Automotive engine control units
>  Automotive electronics
>  Handheld portable electronics
>  Semiconductor automated test equipment (ATE)

> GPS navigation and other portable devices


Typical Properties of TIF®100-50-05S Series
Property Value Test method
Color Blue Visual
Construction Ceramic filled silicone elastomer ******
Density(g/cm³) 3.4 ASTM D792
Thickness Range(inch/mm) 0.010~0.020 0.030~0.200 ASTM D374
(0.25~0.50) (0.75~5.00)
Hardness 65 Shore 00 45 Shore 00 ASTM 2240
Recommended Operating Temperature -40 to 200℃ ******
Breakdown Voltage(V/mm) ≥5500 ASTM D149
Dielectric Constant 7.5 MHz ASTM D150
Volume Resistivity >1.0X1012 Ohm-meter ASTM D257
Flame rating V-0 UL 94 (E331100)
Thermal conductivity 5.0 W/m-K ASTM D5470
5.0 W/m-K ISO22007

Products specification


Standard Thickness: 0.010"(0.25 mm)~0.200" (5.00 mm) with increments of 0.010" (0.25 mm).
Standard Size:16"×16" (406 mm×406 mm).


Component Codes:


Reinforcement Fabric: FG (Fiberglass).
Coating Options: NS1 (Non-adhesive treatment), DC1 (Single-sided hardening).
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive).


The TIF® series is available in custom shapes and various forms.

For other thicknesses or more information, please contact us.


Telecommunication Hardware Blue 5.0W/mK Thermal Gap Filler Materials Thermal Silicone Rubber Pad 0


Packaging Details & Lead time


The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized


Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated


Why Choose us ?


1.Our value message is'' Do it right the First time, total quality control''.

2.Our core competencies is thermal conductive interface materials

3.Competitive advantage products.

4.Condidentiality agreement Bussiness Secrect Contract

5.Free sample offer

6.Quality assurance contract 

 

FAQ:


Q: Are you trading company or manufacturer ? 

A: We are manufacturer in China.


Q: How long is your delivery time? 

A: Generally it is 3-7 work days if the goods are in stock. or it is 7-10 work days if the goods are not in stock, it is according to quantity. 


Q: Do you provide samples ? is it free or extra cost? 

A: Yes, we could offer samples free of charge.

Contact Details
Dongguan Ziitek Electronic Materials & Technology Ltd.

Contact Person: Dana Dai

Tel: +86 18153789196

Send your inquiry directly to us (0 / 3000)