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High Bonding Strength 0.8 W/mK Thermal Conductive Double Side Tape For LED Module

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2.2 g/cc Thermally Adhesive Tape

2.2 g/cc Thermally Adhesive Tape

Thermal Adhesive Tape double sided

Thermal Adhesive Tape double sided

PCB Thermal Conductive Adhesive

PCB Thermal Conductive Adhesive

Certification
China Dongguan Ziitek Electronical Material and Technology Co., Ltd certification
China Dongguan Ziitek Electronical Material and Technology Co., Ltd certification
Customer Reviews
The Thermal Conductive Pad is looking and working very good. We have no need for other Thermal Conductive Pad now!

—— Peter Goolsby

I had cooperated with Ziitek for 2 years, they provided high quality thermal conductive materials, and delivery in time, recommend their phase change materials

—— Antonello Sau

Good quality, Good service. Your team always give us help and resolving, hope we will be good partner all the time!

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High Bonding Strength 0.8 W/mK Thermal Conductive Double Side Tape For LED Module

High Bonding Strength 0.8 W/mK Thermal Conductive Double Side Tape For LED Module
High Bonding Strength 0.8 W/mK Thermal Conductive Double Side Tape For LED Module
High Bonding Strength 0.8 W/mK Thermal Conductive Double Side Tape For LED Module High Bonding Strength 0.8 W/mK Thermal Conductive Double Side Tape For LED Module High Bonding Strength 0.8 W/mK Thermal Conductive Double Side Tape For LED Module High Bonding Strength 0.8 W/mK Thermal Conductive Double Side Tape For LED Module High Bonding Strength 0.8 W/mK Thermal Conductive Double Side Tape For LED Module

Large Image :  High Bonding Strength 0.8 W/mK Thermal Conductive Double Side Tape For LED Module

Product Details:
Place of Origin: China
Brand Name: Ziitek
Certification: RoHs
Model Number: TIA800FG
Document: TIA800FG_Data Sheet.pdf
Payment & Shipping Terms:
Minimum Order Quantity: 10SQM
Price: Negotiation
Packaging Details: 10RL/bag
Delivery Time: 3-7 Work days
Payment Terms: T/T
Supply Ability: 1000SQM/Day
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High Bonding Strength 0.8 W/mK Thermal Conductive Double Side Tape For LED Module

Description
Products Name: High Bonding Strength 0.8 W/mK Thermal Conductive Double Side Tape For LED Module Recommended Operating Temperature(℃): -40 ~ 125
Adhesive Type: Acrylic Adhesive Backing Type: Fiberglass
180° Peel Adhesion (gf/inch) Steel, Immediate: ≥ 1000 Thermal Conductivity: 0.8 W/mK
Color: White Application: LED Module
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Blue Thermal Adhesive Tape

High Bonding Strength 0.8 W/mK Thermal Conductive Double Side Tape For LED Module

The TIA®800FG Series is widely used for bonding heat sinks to microprocessors and other power consuming semiconductors. These tapes have strong adhesive strength and good thermal conductivity, aiming to replace traditional mechanical fixation and thermal conductive silicone grease, simplify assembly processes, improve product reliability, and are an ideal choice for solving the heat dissipation challenges of modern compact electronic devices.

Features
  • High bonding strength
  • Good thermal conductivity efficiency
  • Easy to apply and can be die-cut into custom sizes
  • Stable operation over a wide temperature range
Applications
  • Mount heat sink onto BGA graphic processor or drive processor
  • Mount heat spreader onto power converter PCB or onto motor control PCB
  • High performance, thermally conductive acrylic adhesive
  • Can be used instead of heat cure adhesive, screw mounting or clip mounting
Typical Properties of TIA®800FG Series
Product Name TIA®805FG TIA®806FG TIA®808FG TIA®810FG TIA®812FG TIA®815FG TIA®820FG Test Method
Color White Visual
Adhesive Type Acrylic Adhesive ********
Backing Type Fiberglass ********
Recommended Operating Temperature(℃) -40 ~ 125 ********
Composite Thickness(inch/mm) 0.005/0.13 0.006/0.15 0.008/0.20 0.010/0.25 0.012/0.30 0.015/0.38 0.020/0.51 ASTM D374
Voltage Breakdown(V) ≥2500 ≥3000 ≥3500 ≥4000 ≥4200 ≥4500 ≥5000 ASTM D149
Thermal Conductivity(W/mK) 0.8 ASTM D5470
180° Peel Adhesion (gf/inch) Steel, Immediate ≥ 1000 ASTM D3330
180° Peel Adhesion (gf/inch) Steel, Steel 24 hrs ≥ 1200 ASTM D3330
Holding Power (H/inch) @25℃ ≥ 48 ASTM D3654
Holding Power (H/inch) @80℃ ≥ 48 ASTM D3654
Product Specifications

Standard Thickness: 0.005" (0.13 mm), 0.006" (0.15 mm), 0.008" (0.20 mm), 0.010" (0.25 mm), 0.012" (0.30 mm), 0.015" (0.38 mm), 0.020" (0.51 mm)

Standard Size: 16" × 100" (406 mm × 30.48 m)

Reinforcing Carrier: TIA®800FG Series rolls can be reinforced with fiberglass.

The TIA® Series can be provided with die-cutting into various shapes. For different thicknesses or more information about thermally conductive materials, please contact our company.

TIA®800FG Series Thermal Conductive Double Side Tape product image
Company Profile

Dongguan Ziitek Electronic Material and Technology Co., Ltd. was established in 2006. Is a high-tech enterprise specializing in the research, development, production and sales of thermal interface materials. We mainly produce: heat-conducting joint filler, low melting point thermal interface materials, heat-conducting insulator, heat-conducting adhesive tape, heat-conducting interface pad and heat-conducting grease, heat-conducting plastic, silicone rubber, silicone rubber foam, etc. We adhere to the business philosophy of "survival by quality, development by quality", and continue to provide the most efficient and best service for new and old customers with excellent quality in the spirit of rigor, pragmatism and innovation.

Independent R&D team

Frequently Asked Questions
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Tag:

adhesive foam tape,

acrylic adhesive tape,

thermally conductive adhesive tape

Contact Details
Dongguan Ziitek Electronical Material and Technology Co., Ltd

Contact Person: Dana Dai

Tel: +86 18153789196

Send your inquiry directly to us (0 / 3000)

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