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Product Details:
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| Products Name: | Thermal Adhesive Tape Providing Durable And Thermal Conductivity For Mounting Heat Sinks And Managing Semiconductor Heat | Color: | White |
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| Thickness(inch/mm): | 0.010"/0.25mm | Voltage Breakdown(V)): | ≥4000 |
| 180° Peel Adhesion (gf/inch) Steel, Steel 24 Hrs: | ≥1200 | Thermal Conductivity: | 0.8W/mK |
| Keywords: | Thermal Adhesive Tape | Application: | For Mounting Heat Sinks And Managing Semiconductor Heat |
| Highlight: | adhesive foam tape,thermally conductive adhesive tape,Heat Resistant Adhesive Thermal Conductive |
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Thermal Adhesive Tape Providing Durable And Thermal Conductivity For Mounting Heat Sinks And Managing Semiconductor Heat
| Typical Properties of TIA®800FG Serie | ||||||||
| Product Name | TIA®805FG | TIA®806FG | TIA®808FG | TIA®810FG | TIA®812FG | TIA®815FG | TIA®820FG | Test Method |
| Color | White | Visual | ||||||
| Adhesive Type | Acrylic Adhesive | ******** | ||||||
| Backing Type | Fiberglass | ******** | ||||||
| Recommended Operating Temperature(℃) | -40 ~ 125 | ******** | ||||||
| Composite Thickness(inch/mm) |
0.005 0.13 |
0.006 0.15 |
0.008 0.20 |
0.010 0.25 |
0.012 0.30 |
0.015 0.38 |
0.020 0.51 |
ASTM D374 |
| Voltage Breakdown(V)) | ≥2500 | ≥3000 | ≥3500 | ≥4000 | ≥4200 | ≥4500 | ≥5000 | ASTM D149 |
| Thermal Conductivity(W/mK) | 0.8 | ASTM D5470 | ||||||
| 180° Peel Adhesion (gf/inch) Steel, Immediate | ≥ 1000 | ASTM D3330 | ||||||
| 180° PeelA dhesion (gf/inch) Steel, Steel 24 hrs | ≥ 1200 | ASTM D3330 | ||||||
| Holding Power (H/inch) @25℃ | ≥ 48 | ASTM D3654 | ||||||
| Holding Power (H/inch) @80℃ | ≥ 48 | ASTM D3654 | ||||||
Independent R&D team
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This message should include any questions you might have about the products as well as your purchase requests.
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Contact Person: Dana Dai
Tel: +86 18153789196