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Thermal Adhesive Tape Providing Durable And Thermal Conductivity For Mounting Heat Sinks And Managing Semiconductor Heat

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China Dongguan Ziitek Electronical Material and Technology Co., Ltd certification
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Thermal Adhesive Tape Providing Durable And Thermal Conductivity For Mounting Heat Sinks And Managing Semiconductor Heat

Thermal Adhesive Tape Providing Durable And Thermal Conductivity For Mounting Heat Sinks And Managing Semiconductor Heat
Thermal Adhesive Tape Providing Durable And Thermal Conductivity For Mounting Heat Sinks And Managing Semiconductor Heat Thermal Adhesive Tape Providing Durable And Thermal Conductivity For Mounting Heat Sinks And Managing Semiconductor Heat Thermal Adhesive Tape Providing Durable And Thermal Conductivity For Mounting Heat Sinks And Managing Semiconductor Heat Thermal Adhesive Tape Providing Durable And Thermal Conductivity For Mounting Heat Sinks And Managing Semiconductor Heat Thermal Adhesive Tape Providing Durable And Thermal Conductivity For Mounting Heat Sinks And Managing Semiconductor Heat

Large Image :  Thermal Adhesive Tape Providing Durable And Thermal Conductivity For Mounting Heat Sinks And Managing Semiconductor Heat

Product Details:
Place of Origin: China
Brand Name: Ziitek
Certification: RoHs
Model Number: TIA810FG
Document: TIA800FG_Data Sheet.pdf
Payment & Shipping Terms:
Minimum Order Quantity: 10SQM
Price: Negotiation
Packaging Details: 10RL/bag
Delivery Time: 3-7 Work days
Payment Terms: T/T
Supply Ability: 1000SQM/Day

Thermal Adhesive Tape Providing Durable And Thermal Conductivity For Mounting Heat Sinks And Managing Semiconductor Heat

Description
Products Name: Thermal Adhesive Tape Providing Durable And Thermal Conductivity For Mounting Heat Sinks And Managing Semiconductor Heat Color: White
Thickness(inch/mm): 0.010"/0.25mm Voltage Breakdown(V)): ≥4000
180° Peel Adhesion (gf/inch) Steel, Steel 24 Hrs: ≥1200 Thermal Conductivity: 0.8W/mK
Keywords: Thermal Adhesive Tape Application: For Mounting Heat Sinks And Managing Semiconductor Heat
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Thermal Adhesive Tape Providing Durable And Thermal Conductivity For Mounting Heat Sinks And Managing Semiconductor Heat


The TIA®800FG Series is widely used for bonding heat sinks to microprocessors and other power consuming semiconductors. These tapes have strong adhesive strength and good thermal conductivity, aiming to replace traditional mechanical fixation and thermal conductive silicone grease, simplify assembly processes, improve product reliability, and are an ideal choice for solving the heat dissipation challenges of modern compact electronic devices.

Features

> High bonding strength
> Good thermal conductivity efficiency
> Easy to apply and can be die-cut into custom sizes
> Stable operation over a wide temperature range

Applications

> Mount heat sink onto BGA graphic processor or drive processor
> Mount heat spreader onto power converter PCB or onto motor control PCB
> High performance, thermally conductive acrylic adhesive 
> Can be used instead of heat cure adhesive,screw mounting or clip mounting

Typical Properties of  TIA®800FG Serie
Product Name TIA®805FG TIA®806FG TIA®808FG TIA®810FG TIA®812FG TIA®815FG TIA®820FG Test Method
Color White Visual
Adhesive Type Acrylic Adhesive ********
Backing Type Fiberglass ********
Recommended Operating Temperature(℃) -40 ~ 125 ********
Composite Thickness(inch/mm)

0.005

0.13

0.006

0.15

0.008

0.20

0.010

0.25

0.012

0.30

0.015

0.38

0.020

0.51

ASTM D374
Voltage Breakdown(V)) ≥2500 ≥3000 ≥3500 ≥4000 ≥4200 ≥4500 ≥5000 ASTM D149
Thermal Conductivity(W/mK)  0.8  ASTM D5470
180° Peel Adhesion (gf/inch) Steel, Immediate ≥ 1000  ASTM D3330
180° PeelA dhesion  (gf/inch) Steel, Steel 24 hrs ≥ 1200 ASTM D3330
Holding Power (H/inch) @25℃ ≥ 48 ASTM D3654
Holding Power (H/inch) @80℃ ≥ 48 ASTM D3654


Product Specifications

Standard Thickness: 0.005" (0.13 mm),0.006" (0.15 mm), 0.008" (0.20 mm), 0.010" (0.25 mm), 0.012" (0.30 mm), 0.015" (0.38 mm), 0.020" (0.51 mm),
Standard Size: 16" × 100" (406 mm × 30.48 m)
Reinforcing Carrier: TIA®800FG Series rolls can be reinforced with fiberglass.

The TIA® Series can be provided with die-cutting into various shapes.For different thicknesses or more information about thermally conductive materials, please contact our company.
Thermal Adhesive Tape Providing Durable And Thermal Conductivity For Mounting Heat Sinks And Managing Semiconductor Heat
 
Company profile
 
Ziitek Technology Company is dedicated to providing a comprehensive range of thermal management products and services to meet various demand scenarios. Ziitek Technology offers prompt and flexible services. Our thermal conductive materials are widely used in the fields of new energy, electronic appliances, transportation, industry, healthcare, communication, etc. Ziitek has obtained ISO9001, ISO14001 and IECQ certifications, which indicate our commitment to producing high-quality products and adopting excellent management methods. Our products comply with RoHS, REACH and UL standards, ensuring safety and reliability.
 

Independent R&D team


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Contact Details
Dongguan Ziitek Electronical Material and Technology Co., Ltd

Contact Person: Dana Dai

Tel: +86 18153789196

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