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Thermal Gap Filler Providing Superior 4.0W/mK Thermal Conductivity and Electrical Insulation for Electronic Device Applications

Certification
China Dongguan Ziitek Electronical Material and Technology Co., Ltd certification
China Dongguan Ziitek Electronical Material and Technology Co., Ltd certification
Customer Reviews
The Thermal Conductive Pad is looking and working very good. We have no need for other Thermal Conductive Pad now!

—— Peter Goolsby

I had cooperated with Ziitek for 2 years, they provided high quality thermal conductive materials, and delivery in time, recommend their phase change materials

—— Antonello Sau

Good quality, Good service. Your team always give us help and resolving, hope we will be good partner all the time!

—— Chris Rogers

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Thermal Gap Filler Providing Superior 4.0W/mK Thermal Conductivity and Electrical Insulation for Electronic Device Applications

Thermal Gap Filler Providing Superior 4.0W/mK Thermal Conductivity and Electrical Insulation for Electronic Device Applications
Thermal Gap Filler Providing Superior 4.0W/mK Thermal Conductivity and Electrical Insulation for Electronic Device Applications Thermal Gap Filler Providing Superior 4.0W/mK Thermal Conductivity and Electrical Insulation for Electronic Device Applications Thermal Gap Filler Providing Superior 4.0W/mK Thermal Conductivity and Electrical Insulation for Electronic Device Applications

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Product Details:
Place of Origin: China
Brand Name: ZIITEK
Certification: UL and RoHs
Model Number: TIF100-40-10F
Document: TIF100-40-10F_Data Sheet.pdf
Payment & Shipping Terms:
Minimum Order Quantity: 1000pcs
Price: Negotiation
Packaging Details: 1000pcs/bag
Delivery Time: 3-7 work days
Payment Terms: T/T
Supply Ability: 10000/day

Thermal Gap Filler Providing Superior 4.0W/mK Thermal Conductivity and Electrical Insulation for Electronic Device Applications

Description
Product Name: Thermal Gap Filler Providing Superior 4.0W/mK Thermal Conductivity And Electrical Insulation For Electronic Device Applications Recommended Operating Temperature (°C): -40 To 200℃
Hardness: 65/60 Shore 00 Breakdown Strength(V/mm): ≥5500
Sample: Sample Free Construction: Electronic Device Applications
Keywords: Thermal Gap Filler Thermal Conductivity(W/mk): 4.0W/mK
Flame Rating: UL 94 V-0 Application: Electronic Components

Thermal Gap Filler Providing Superior 4.0W/mK Thermal Conductivity and Electrical Insulation for Electronic Device Applications
Product Overview

The TIF®100-40-10F Series is a structurally supportive thermal pad designed to provide high heat dissipation while also ensuring structural support and durability. It can reliably fill interface gaps, transfer heat, and offer mechanical support for stacked components, resisting compressive deformation. This product is an ideal choice for applications that require a balance between heat dissipation, insulation, and mechanical stability.

Key Features
  • High thermal conductivity
  • Good softness and fillability
  • Self-adhesive without the need for additional surface adhesives
  • Good insulation performance
Applications
  • Power tools
  • Network communication products
  • Electric vehicle batteries
  • Computer CPU/GPU Cooling
  • New energy vehicle power systems
  • Signal communication
  • New energy vehicle
  • Motherboard chip
  • Radiator
  • AI Processors AI Server
Technical Specifications of TIF®100-40-10F Series
Property Value Test Method
Color Gray Visual
Construction Ceramic filled silicone elastomer -
Density (g/cm³) 3.2 ASTM D792
Thickness Range (inch/mm) 0.010~0.020 | 0.030~0.200
0.25~0.50 | 0.75~5.00
ASTM D374
Hardness (Shore 00) 65 | 60 ASTM 2240
Recommended Operating Temperature -40 to 200℃ -
Breakdown Strength (V/mm) ≥5500 ASTM D149
Dielectric Constant @1MHz 8.0 ASTM D150
Volume Resistivity (Ohm-meter) >1.0×10¹² ASTM D257
Flame Rating V-0 UL 94 (E331100)
Thermal Conductivity (W/m-K) 4.0 ASTM D5470
ISO22007
Product Specifications

Standard Thickness: 0.010" (0.25 mm)~0.200" (5.00 mm), with increments of 0.010" (0.25 mm).

Standard Size: 16"×16" (406 mm×406 mm)

Component Codes:
Reinforcement Fabric: FG (Fiberglass)
Coating Options: NS1 (Non-adhesive treatment), DC1 (Single-sided hardening)
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive)

The TIF® series is available in custom shapes and various forms. For other thicknesses or more information, please contact us.

Thermal Gap Filler Providing Superior 4.0W/mK Thermal Conductivity and Electrical Insulation for Electronic Device Applications

Packaging & Lead Time

Packaging Details:

  • PET film or foam for protection
  • Paper card to separate each layer
  • Export carton inside and outside
  • Customized packaging available to meet customer requirements

Lead Time: 5000 pieces - To be negotiated

Company Profile

Ziitek is a high-tech enterprise dedicated to the R&D, manufacture and sales of thermal interface materials (TIMs). With rich experience in this field, we provide the latest, most effective one-step thermal management solutions. Our facility includes advanced production equipment, full test equipment, and fully automatic coating production lines capable of manufacturing high performance thermal products including:

All products are compliant with UL94 V-0, SGS and ROHS standards.

Certifications: ISO9001:2015, ISO14001:2004, IATF16949:2016, IECQ QC 080000:2017, UL

Our Services
  • Online service: 12 hours, inquiry reply within fastest response time
  • Working time: 8:00am - 5:30pm, Monday to Saturday (UTC+8)
  • Well-trained & experienced staff answering all inquiries in English
  • Standard export carton or marked with customer's information or customized
  • Free samples available
  • After-service support: If products don't work as expected, we provide satisfactory solutions with proper proof
Frequently Asked Questions
Q: What thermal conductivity test method was used to achieve the values given on the data sheets?
A: A test fixture is utilized that meets the specifications outlined in ASTM D5470.
Q: Is GAP PAD offered with an adhesive?
A: Currently, most thermal gap pad surfaces have double side natural inherent tack. Non-stick surface can also be treated according to customer's requirements.
Q: What are thermal pads used for?
A: Thermal pads transfer heat away from hot electronic parts like computer chips into a metal cooler or heat sink. They fill empty air spaces between surfaces, provide electrical safety, and keep parts from getting too hot.
Q: Is a thermal pad effective?
A: While a pad is not as compressible as a paste, the range of available materials means thermal pads are extremely effective with any substrate.

Overall Rating

5.0
Based on 50 reviews for this supplier

Rating Snapshot

The following is the distribution of all ratings
5 stars
100%
4 stars
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All Reviews

D
Dante
Poland Jul 20.2026
These worked so well, I came back for more. I have a mini pc with passive cooling. When it heats up, the case/heat sink separates slightly from the CPU causing the CPU temps to increase drastically. These thermal pads filled the gap giving me consistent CPU temperatures. I also used them for LAN and NVME drives.
Contact Details
Dongguan Ziitek Electronical Material and Technology Co., Ltd

Contact Person: Dana Dai

Tel: +86 18153789196

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