logo
Home ProductsThermal Conductive Gel

Low Thermal Impedance One Component 3.0W/mK Thermal Conductive Gel For Communication Hardware

Certification
China Dongguan Ziitek Electronical Material and Technology Co., Ltd certification
China Dongguan Ziitek Electronical Material and Technology Co., Ltd certification
Customer Reviews
The Thermal Conductive Pad is looking and working very good. We have no need for other Thermal Conductive Pad now!

—— Peter Goolsby

I had cooperated with Ziitek for 2 years, they provided high quality thermal conductive materials, and delivery in time, recommend their phase change materials

—— Antonello Sau

Good quality, Good service. Your team always give us help and resolving, hope we will be good partner all the time!

—— Chris Rogers

I'm Online Chat Now

Low Thermal Impedance One Component 3.0W/mK Thermal Conductive Gel For Communication Hardware

Low Thermal Impedance One Component 3.0W/mK Thermal Conductive Gel For Communication Hardware
Low Thermal Impedance One Component 3.0W/mK Thermal Conductive Gel For Communication Hardware Low Thermal Impedance One Component 3.0W/mK Thermal Conductive Gel For Communication Hardware

Large Image :  Low Thermal Impedance One Component 3.0W/mK Thermal Conductive Gel For Communication Hardware

Product Details:
Place of Origin: China
Brand Name: ZIITEK
Certification: UL and RoHs
Model Number: TIF030-10
Document: TIF030-10_Data Sheet.pdf
Payment & Shipping Terms:
Minimum Order Quantity: 1000 tubes
Price: Negotiation
Packaging Details: 30 cc/pcs,50cc/pcs
Delivery Time: 7-15work days
Payment Terms: T/T
Supply Ability: 10000/day

Low Thermal Impedance One Component 3.0W/mK Thermal Conductive Gel For Communication Hardware

Description
Name: Low Thermal Impedance One Component 3.0W/mK Thermal Conductive Gel For Communication Hardware Construction: Ceramic Filled Silicon Material
Color: Gray Continuous Use Temp: -40-200 ℃
Density(g/cm³): 2.9 Thermal Conductivity: 3.0 W/mK
Flame Rating: 94 V0 Keywords: Thermal Conductive Gel
Application: Communication Hardware
Highlight:

Low thermal impedance conductive gel

,

3.0W/mK thermal gel for hardware

,

One component thermal conductive gel

Low Thermal Impedance One Component 3.0W/mK Thermal Conductive Gel For Communication Hardware
Company Profile

Ziitek company is a high-tech enterprise dedicated to the R&D, manufacture and sales of thermal interface materials (TIMs). With rich experience in this field, we provide the latest, most effective one-step thermal management solutions. Our facility includes advanced production equipment, full test equipment, and fully automatic coating production lines capable of manufacturing high performance thermal products including:

  • Thermal gap pad
  • Thermal graphite sheet/film
  • Thermal double-sided tape
  • Thermal insulation pad
  • Thermal grease
  • Phase change material
  • Thermal gel

All products are compliant with UL94 V-0, SGS and ROHS standards.

Certifications: ISO9001:2015, ISO14001:2004, IATF16949:2016, IECQ QC 080000:2017, UL

Product Description

TIF®030-10 is a soft silicone gel-based gap filler pad, formulated with a special blend of fillers to provide both high thermal conductivity and superior softness. Compared to conventional thermal greases, it has a higher viscosity, which effectively prevents filler separation from the silicone matrix and reduces filler migration, helping maintain consistent thermal performance. It is applied in a similar manner to thermal grease and is suitable for commercial dispensing or automated equipment.

Features
  • High Thermal conductivity
  • Soft, very low compression
  • Low thermal impedance
  • Suitable for automated operation in dispensing systems
  • Proven long-term reliability
Applications
  • Heat-sink & frame
  • LED backlight module, LED lighting
  • High speed hardware driver
  • Micro heat pipe radiator
  • Vehicle engine controller
  • Communication hardware
  • Semiconductor automatic laboratory equipment
Typical Properties of TIF®030-10
Property Value Test Method
Color Gray Visual
Construction Ceramic filled silicon material -
Flow Rate (g/min)
(30cc syringe/ 2.5mm orifice/90 psi)
12 Ziitek Test Method
Density (g/cm³) 2.9 ASTM D792
Thermal conductivity (W/mK) 3.0 ASTM D5470
Thermal impedance (℃-in²/W) @10psi 0.11 ASTM D5470
Thermal impedance (℃-in²/W) @50psi 0.10 ASTM D5470
Recommended Operating Temperature -40~200℃ -
Breakdown Strength (V/mm) ≥4000 ASTM D149
Volume Resistivity (Ohm*cm) >1.0x10¹¹ ASTM D257
Bond line Thickness (mm) 0.10 -
Flame Rating V-0 UL 94
Oil Separation (%) @ 150°C, 24 hrs <0.03 -
Volatility Loss (%) @150°C, 24 hrs <0.2 -
Product Specifications

30cc/pcs, 50cc/pcs, 300 cc/pc

For more information about thermal conductive materials, please contact our company.

Ziitek Thermal Conductive Materials Product Display
Our Services
  • Online-service: 12 hours, Inquiry reply within fastest
  • Working time: 8:00am - 5:30pm, Monday to Saturday (UTC+8)
  • Well-trained & experienced staff are to answer all your inquiries in English
  • Standard Export Carton Or Marked With Customer's Information Or Customized
  • Provide free samples
  • After-service: Even our products have passed strict inspection, if you find the parts cannot work well, please show us the proof. We will help you to deal with it and give you satisfactory solution
Certifications
ISO9001:2015 ISO14001:2004 IATF16949:2016 IECQ QC 080000:2017 UL

Contact Details
Dongguan Ziitek Electronical Material and Technology Co., Ltd

Contact Person: Dana Dai

Tel: +86 18153789196

Send your inquiry directly to us (0 / 3000)