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Stability Silicone Thermal Gap Filler Thermal Gel Thermal Putty For Heat-Sink And Frame

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Stability Silicone Thermal Gap Filler Thermal Gel Thermal Putty For Heat-Sink And Frame

Stability Silicone Thermal Gap Filler Thermal Gel Thermal Putty For Heat-Sink And Frame
Stability Silicone Thermal Gap Filler Thermal Gel Thermal Putty For Heat-Sink And Frame Stability Silicone Thermal Gap Filler Thermal Gel Thermal Putty For Heat-Sink And Frame

Large Image :  Stability Silicone Thermal Gap Filler Thermal Gel Thermal Putty For Heat-Sink And Frame

Product Details:
Place of Origin: China
Brand Name: ZIITEK
Certification: UL and RoHs
Model Number: TIF050-11
Payment & Shipping Terms:
Minimum Order Quantity: 1000tube
Price: negotiation
Packaging Details: 30cc/tube
Delivery Time: 7-15work days
Supply Ability: 10000/day
Detailed Product Description
Products Name: Stability Silicone Thermal Gap Filler Thermal Gel Thermal Putty For Heat-Sink And Frame Density(G/cc): 3.20
Flow Rate(g/min): 40 Fire Rating: 94-V0
Color: Grey Shelf Life: 12 Months
Good Thermal Conductive: 5.0W/mK Keywords: Thermal Gel
Highlight:

thermal putty

,

thermally conductive putty

Stability Silicone Thermal Gap Filler 3.05g/cc Grey Putty -45-200 ℃ 94-V0 For LED Backlight Module

 

Products Description


TIF®050-11 is a soft silicone gel-based gap filler pad, formulated with aspecial blend of fillers to provide both excellent thermal conductivity and superior softness. Compared to conventional thermal greases, TIF®050-11 has a high erviscosity, which effectively prevents filler separation from the silicone matrix and reduces filler migration, helping maintain consistent thermal performance. It is applied in a similar manner to thermal grease and is suitable for commercial dispensing or automated equipment. Typical applications include flip-chip microprocesors, PPGAs, micro BGA packages, BGA packages, DSP chips, circular silicon chips,LED lighting, and other high-power electronic components.

 

Feature

 

>Thermal conductivity: 5.0 W/mK
>Soft, very low compression
>Low thermal impedance
>Operate automatically
>Proven long-term reliability

 

Application

>Heat-sink & frame
>LED backlight module, LED lighting
>High speed hardware driver
>Micro heat pipe
>Vihicel enginee controller
>Telecom industry
>Semiconductor automatic laboratory equipment

 
TIF®050-11 Typical Properties
Property Value Test method
Color Gray Visual
Construction & Composition Ceramic filled silicon material -
Flow Rate(g/min) 40 Ziitek Test Method (30 cc syringe/ 2.5 mm orifice/ 90 psi)
Density(g/cc) 3.20g/c ASTM D297
Thermal conductivity 5.0W/mK ASTM D5470
Thermal Impedance @10psi (℃.in²w) 0.077 ASTM D5470
Thermal Impedance @50psi (℃.in²w) 0.068 ASTM D5470
Recommended Operating Temp -45 ~200°C Ziitek Test Method
Dielectric Strength(V/mm) ≥4000 ASTM D149
Bond Line Thickness(mm) 0.2 Ziitek Test Mothod
Flame Rating V-0 UL 94
Shelf Life 12 months -

 

Product Specification:

30 cc/pcs, 98 pcs/box; 300 cc/pcs, 6 pcs/box.
Custom packaging available for automation use. Please contact us for confirming.
If you want to know our thermal products, please visit our website.

Stability Silicone Thermal Gap Filler Thermal Gel Thermal Putty For Heat-Sink And Frame 0

Company profile

 

Dongguan Ziitek Electronic Material Technology Co., Ltd. was established in 2006. Is a high-tech enterprise specializing in the research, development, production and sales of thermal interface materials. We mainly produce: heat-conducting joint filler, low melting point thermal interface materials, heat-conducting insulator, heat-conducting adhesive tape, heat-conducting interface pad and heat-conducting grease, heat-conducting plastic, silicone rubber, silicone rubber foam, etc. We adhere to the business philosophy of "survival by quality, development by quality", and continue to provide the most efficient and best service for new and old customers with excellent quality in the spirit of rigor, pragmatism and innovation.

 

Our services

 

Online-service : 12 hours , Inquiry reply within fastest.


Working time: 8:00am - 5:30pm, Monday to Saturday (UTC+8).

Well-trained & experienced staff are to answer all your inquiries in English of course.

Standard Export Carton Or Marked With Customer's Information Or Customized.

Provide free samples

 

After-service: Even our products have passed strict inspection, if you find the parts can not work well, please show us the proof.

we will help you to deal with it and give you satisfactory solution.

Stability Silicone Thermal Gap Filler Thermal Gel Thermal Putty For Heat-Sink And Frame 1

Contact Details
Dongguan Ziitek Electronic Materials & Technology Ltd.

Contact Person: Dana Dai

Tel: 18153789196

Send your inquiry directly to us (0 / 3000)