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Low Compression Thermally Conductive Putty Thermal Gel 3.5W/MK For Vihicel Enginee Controller Cooling

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Low Compression Thermally Conductive Putty Thermal Gel 3.5W/MK For Vihicel Enginee Controller Cooling

Large Image : Low Compression Thermally Conductive Putty Thermal Gel 3.5W/MK For Vihicel Enginee Controller Cooling

Product Details:

Place of Origin:	China
Brand Name:	ZIITEK
Certification:	UL and RoHs
Model Number:	TIF035-05

Payment & Shipping Terms:

Minimum Order Quantity:	1000pcs
Price:	negotiation
Packaging Details:	600cc/tube
Delivery Time:	3-5work days
Supply Ability:	10000/day

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Detailed Product Description

Product Name:	Low Compression Thermally Conductive Putty Thermal Gel 3.5W/MK For Vihicel Enginee Controller Cooling	Density:	3.25g/cc
Fire Rating:	94-V0	Color:	Blue
Recommended Operating Temp:	-45-200 ℃	Thermal Conductivity:	3.5 W/mK
Shelf Life:	12 Months	Keywords:	Thermal Gel
Highlight:	thermal putty , thermally conductive putty

Low Compression Thermally Conductive Putty Thermal Gel 3.5W/MK For Vihicel Enginee Controller Cooling

TIF®035-05 is a soft silicone gel-based gap filer pad, formulated with a special blend of filers to provide both excellent thermal conductivity and superior softness. Compared to conventional thermal greases, TIF®035-05 has a higher viscosity, which effectively prevents filler separation from the silicone matrix and reduces filler migration, helping maintain consistent thermal performance. It is applied in a similar manner to thermal grease and is suitable for commercial dispensing or automated equipment. Typical applications include flip-chip microprocessors, PPGAs, micro BGA packages, BGA packages, DSP chips, circular Isilicon chips, LED lighting, and other high-power electronic components.

Feature

>Thermal conductivity: 3.0 W/mK
>Soft, very low compression
>Low thermal impedance
>Operate automatically
>Proven long-term reliability

Application

>Heat-sink & frame
>LED backlight module,LED lighting
>High speed hardware driver
>Micro heat pipe
>Vihicel enginee controller
>Telecom industry
>Semiconductor automatic laboratory equipment

TIF^®035-05 Typical Properties
Property	Value	Test method
Color	Blue	Visual
Construction & Composition	Ceramic filled silicon material	-
Flow Rate(g/min)	30	Ziitek Test Method (30 cc syringe/ 2.5 mm orifice/ 90 psi)
Flow Rate(g/min)	30	Ziitek Test Method (30 cc syringe/ 2.5 mm orifice/ 90 psi)
Density(g/cc)	3.25g/c	ASTM D297
Thermal conductivity	3.5W/mK	ASTM D5470
Thermal Impedance @10psi (℃.in²w)	0.08	ASTM D5470
Thermal Impedance @50psi (℃.in²w)	0.075	ASTM D5470
Recommended Operating Temp	-45 ~200°C	Ziitek Test Method
Dielectric Strength(V/mm)	≥4000	ASTM D149
Bond Line Thickness(mm)	0.1	Ziitek Test Mothod
Flame Rating	V-0	UL 94
Shelf Life	12 months	-

Product Specification:

30 cc/pcs, 98 pcs/box; 300 cc/pcs, 6 pcs/box.
Custom packaging available for automation use. Please contact us for confirming.
If you want to know our thermal products, please visit our website.

Low Compression Thermally Conductive Putty Thermal Gel 3.5W/MK For Vihicel Enginee Controller Cooling 0

Company Profile

Ziitek Electronic Material and Technology Ltd. is dedicated to developing composite thermal solution and manufacturing superior thermal interface materials for competitive market. Our vast experience allows us to assist our customers best in thermal engineering field.We serve customers with customized products, full product lines and flexible production, which makes us be the best and reliable partner of you. Let's make your design more perfect!

Ziitek Culture

Quality :

Do it right the first time, total quality control

Effectiveness:

Work precisely and thoroughly for effectiveness

Service:

Quick response, On time delivery and Excellent service

Team work:

Complete teamwork, including sales team, Marketing team, engineering team, R&D team, Manufacturing team, logistics team. All is for supporting and servicing a satisfy service for customers.

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