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Two Component 3.0W/mK Thermal Conductive Gel For Heat Sink And Heat Generating Semicondutor

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China Dongguan Ziitek Electronical Material and Technology Co., Ltd certification
Customer Reviews
The Thermal Conductive Pad is looking and working very good. We have no need for other Thermal Conductive Pad now!

—— Peter Goolsby

I had cooperated with Ziitek for 2 years, they provided high quality thermal conductive materials, and delivery in time, recommend their phase change materials

—— Antonello Sau

Good quality, Good service. Your team always give us help and resolving, hope we will be good partner all the time!

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Two Component 3.0W/mK Thermal Conductive Gel For Heat Sink And Heat Generating Semicondutor

Two Component 3.0W/mK Thermal Conductive Gel For Heat Sink And Heat Generating Semicondutor
Two Component 3.0W/mK Thermal Conductive Gel For Heat Sink And Heat Generating Semicondutor
Two Component 3.0W/mK Thermal Conductive Gel For Heat Sink And Heat Generating Semicondutor Two Component 3.0W/mK Thermal Conductive Gel For Heat Sink And Heat Generating Semicondutor Two Component 3.0W/mK Thermal Conductive Gel For Heat Sink And Heat Generating Semicondutor

Large Image :  Two Component 3.0W/mK Thermal Conductive Gel For Heat Sink And Heat Generating Semicondutor

Product Details:
Place of Origin: China
Brand Name: ZIITEK
Certification: UL and RoHs
Model Number: TIF030AB-05R
Document: TIF030AB-05R_Data Sheet.pdf
Payment & Shipping Terms:
Minimum Order Quantity: 1000pcs
Price: Negotiation
Packaging Details: 1000pcs/bag
Delivery Time: 3-5 work days
Payment Terms: T/T
Supply Ability: 100000pcs/day
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Two Component 3.0W/mK Thermal Conductive Gel For Heat Sink And Heat Generating Semicondutor

Description
Name: Two Component 3.0W/mK Thermal Conductive Gel For Heat Sink And Heat Generating Semicondutor Color: Blue
Keyword: Thermal Conductive Gel Applications: Heat Sink And Heat Generating Semicondutor
Breakdown Strength (V/mm): ≥5500 Density: 3.1g/cm³
Thermal Conductivity: 3.0W/mK Construction: Ceramic Filled Silicon Material
Highlight:

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Two Component 3.0W/mK Thermal Conductive Gel For Heat Sink And Heat Generating Semiconductor
TIF®030AB-05R is a two-component liquid gap filler material, featuring high thermal conductivity, low thermal resistance, excellent electrical insulation, and high temperature aging resistance. After curing, its performance is equivalent to that of thermal conductive silicone rubber sheets, making it suitable for low stress and high compression modulus scenarios. The cured adhesive layer also exhibits good pluggability, facilitating easy separation during RMA (Repair, Maintenance, and Assembly) without damaging the equipment, effectively reducing the difficulty of repair and the cost of scrap.
Key Features
  • High thermal conductivity
  • Two-part formulation for easy storage
  • Excellent low and high temperature mechanical and chemical stability
  • Ultra-conforming low-stress interface application
  • Easy to remove for RMA rework, no substrate damage
Applications
  • Computer and peripherals
  • Telecommunications
  • Automotive electronics
  • Thermally conductive vibration dampening
  • Heat sink and any heat generating semiconductor
Typical Properties of TIF®030AB-05R Series
Uncured Material Properties
Construction Ceramic filled silicon material -
Color/Part A White Visual
Color/Part B Blue Visual
Flow Rate (g/min) 25 Ziitek Test Method (50 cc syringe/1.5 mm orifice/90 psi)
Bond Line Thickness (mm) 0.15 -
Thermal Resistance (℃*in²/W) @10psi 0.09 ASTM D5470
Thermal Resistance (℃*in²/W) @50psi 0.08 ASTM D5470
Mix Ratio 1:1 -
Cure Schedule
Cure @25℃ 45 min Ziitek Test Method
Cure @70℃ 10 min Ziitek Test Method
Cure Material Properties
Color Blue Visual
Hardness (Shore 00) 50 ASTM D2240
Density (g/cm³) 3.1 ASTM D792
Thermal Conductivity (W/mK) 3.0 ASTM D5470
Breakdown Strength (V/mm) ≥5500 ASTM D149
Volume Resistivity (Ohm-cm) ＞1.0x10¹¹ ASTM D257
Recommended Operating Temperature (°C) -40~200℃ -
Flame Rating V-0 UL 94
Product Specification
50 cc/pcs, 400 cc/pcs, or customized packaging for automation applications.
For more information about thermal conductive materials, please contact our company.
TIF thermal conductive gel product sample
Company Profile
Dongguan Ziitek Electronic Material and Technology Co., Ltd. is dedicated to developing composite thermal solution and manufacturing superior thermal interface materials for competitive market. Our vast experience allows us to assist our customers best in thermal engineering field. We serve customers with customized products, full product lines and flexible production, which makes us be the best and reliable partner of you. Let's make your design more perfect!
Ordering Process
How do I place an order?
1. Click the "Send messages" button to continue with the process.
2. Fill out the message form by entering a subject line, and message to us. This message should include any questions you might have about the products as well as your purchase requests.
3. Click the "Send" button when you are finished to complete the process and send your message to us.
4. We will reply you as soon as possible with Email or online.
Frequently Asked Questions
What thermal conductivity test method was used to achieve the values given on the data sheets?
A test fixture is utilized that meets the specifications outlined in ASTM D5470.
Is GAP PAD offered with an adhesive?
Currently, most thermal gap pad surfaces have double side natural inherent tack. Non-stick surface can also be treated according to customer's requirements.
What are thermal pads used for?
Thermal pads transfer heat away from hot electronic parts like computer chips into a metal cooler or heat sink. They fill empty air spaces between surfaces, provide electrical safety, and keep parts from getting too hot.

Tag:

thermally conductive putty,

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Contact Details
Dongguan Ziitek Electronical Material and Technology Co., Ltd

Contact Person: Dana Dai

Tel: +86 18153789196

Send your inquiry directly to us (0 / 3000)

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