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5.0W/MK Thermal Conductive Pad Designed For Easy Application With Naturally Tacky Surface And No Additional Adhesive Coating Needed

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China Dongguan Ziitek Electronical Material and Technology Co., Ltd certification
Customer Reviews
The Thermal Conductive Pad is looking and working very good. We have no need for other Thermal Conductive Pad now!

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I had cooperated with Ziitek for 2 years, they provided high quality thermal conductive materials, and delivery in time, recommend their phase change materials

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5.0W/MK Thermal Conductive Pad Designed For Easy Application With Naturally Tacky Surface And No Additional Adhesive Coating Needed

5.0W/MK Thermal Conductive Pad Designed For Easy Application With Naturally Tacky Surface And No Additional Adhesive Coating Needed
5.0W/MK Thermal Conductive Pad Designed For Easy Application With Naturally Tacky Surface And No Additional Adhesive Coating Needed
5.0W/MK Thermal Conductive Pad Designed For Easy Application With Naturally Tacky Surface And No Additional Adhesive Coating Needed 5.0W/MK Thermal Conductive Pad Designed For Easy Application With Naturally Tacky Surface And No Additional Adhesive Coating Needed 5.0W/MK Thermal Conductive Pad Designed For Easy Application With Naturally Tacky Surface And No Additional Adhesive Coating Needed

Large Image :  5.0W/MK Thermal Conductive Pad Designed For Easy Application With Naturally Tacky Surface And No Additional Adhesive Coating Needed

Product Details:
Place of Origin: China
Brand Name: ZIITEK
Certification: UL and RoHs
Model Number: TIF100 5027-11
Document: TIF100 5027-11_Data Sheet.pdf
Payment & Shipping Terms:
Minimum Order Quantity: 1000pcs
Price: Negotiation
Packaging Details: 1000pcs/bag
Delivery Time: 3-5 days
Payment Terms: T/T
Supply Ability: 100000pcs/day
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5.0W/MK Thermal Conductive Pad Designed For Easy Application With Naturally Tacky Surface And No Additional Adhesive Coating Needed

Description
Product Name: 5.0W/MK Thermal Conductive Pad Designed For Easy Application With Naturally Tacky Surface And No Additional Adhesive Coating Needed Keywords: Silicone Thermal Pad
Thermal Conductivity: 5.0W/m-K Application: Heat Transfer
Thickness: 0.010~0.200inch(0.25~5.0mmT) Hardness: 65/27 Shore 00
Fire Rating: 94-V0 Sample: Free Sample
Highlight:

5.0W/MK thermal conductive pad

,

naturally tacky thermal pad

,

adhesive-free thermal conductive pad

5.0W/MK Thermal Conductive Pad Designed For Easy Application With Naturally Tacky Surface And No Additional Adhesive Coating Needed
Product Overview

The TIF®100 5027-11 Series is an ultra-soft thermal interface material designed specifically to protect precision components that are extremely sensitive to mechanical stress. This product combines high thermal conductivity with exceptional gel-level softness, achieving a perfectly low-stress fit. It is suitable for addressing issues such as large tolerances, uneven surfaces, and the susceptibility of precision components to mechanical damage in high-precision assemblies.

Key Features
  • High thermal conductivity
  • Super soft and highly compliant
  • Self-adhesive without the need for additional surface adhesives
  • Good insulation performance
Applications
  • Power tools
  • Network communication products
  • Electric vehicle batteries
  • Computer CPU/GPU Cooling
  • New energy vehicle power systems
Technical Specifications of TIF®100 5027-11 Series
Property Value Test Method
Color Dark gray Visual
Construction Ceramic filled silicone elastomer -
Density (g/cm³) 3.4 ASTM D792
Thickness Range (inch/mm) 0.010~0.020 | 0.030~0.200
0.25~0.50 | 0.75~5.00		 ASTM D374
Hardness (Shore 00) 65 | 27 ASTM 2240
Recommended Operating Temperature (℃) -40 to 200 -
Breakdown Strength (V/mm) ≥5500 ASTM D149
Dielectric Constant @1MHz 7.0 ASTM D150
Volume Resistivity (Ohm-cm) ＞1.0×10¹² ASTM D257
Flame rating V-0 UL 94 (E331100)
Thermal conductivity (W/m-K) 5.0 ASTM D5470
ISO22007
Product Specifications

Standard Thickness: 0.010" (0.25 mm)~0.200" (5.00 mm) with increments of 0.010" (0.25 mm)

Standard Size: 16"×16" (406 mm×406 mm)

Component Codes

Reinforcement Fabric: FG (Fiberglass)

Coating Options: NS1 (Non-adhesive treatment), DC1 (Single-sided hardening)

Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive)

The TIF® series is available in custom shapes and various forms. For other thicknesses or more information, please contact us.

TIF®100 5027-11 Series Thermal Conductive Pad product image
Packaging & Lead Time

Packaging Details:

  • With PET film or foam for protection
  • Paper card to separate each layer
  • Export carton inside and outside
  • Customized packaging available to meet customer requirements

Lead Time: Quantity: 5000 pieces - Estimated time to be negotiated

Company Profile

Dongguan Ziitek Electronic Material and Technology Co., Ltd. was established in 2006. We are a high-tech enterprise specializing in the research, development, production and sales of thermal interface materials. Our product portfolio includes:

  • Heat-conducting joint filler
  • Low melting point thermal interface materials
  • Heat-conducting insulator
  • Heat-conducting adhesive tape
  • Heat-conducting interface pad and heat-conducting grease
  • Heat-conducting plastic, silicone rubber, silicone rubber foam

We adhere to the business philosophy of "survival by quality, development by quality", and continue to provide the most efficient and best service for new and old customers with excellent quality in the spirit of rigor, pragmatism and innovation.

Certifications

ISO9001:2015

ISO14001:2004

IATF16949:2016

IECQ QC 080000:2017

UL Certified

Independent R&D Team

Our dedicated research and development team continuously innovates to meet evolving market demands.

How to Place an Order
Q: How do I place an order?

A:

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  2. Fill out the message form by entering a subject line and message to us
  3. Include any questions you might have about the products as well as your purchase requests
  4. Click the "Send" button when you are finished to complete the process and send your message to us
  5. We will reply to you as soon as possible via Email or online

Tag:

thermal conductive material,

thermally conductive pad,

cpu thermal pad

Contact Details
Dongguan Ziitek Electronical Material and Technology Co., Ltd

Contact Person: Dana Dai

Tel: +86 18153789196

Send your inquiry directly to us (0 / 3000)

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