Thermal Pad Expert 6.5W/mK Gap Filler Pad Thermal Interface Material For Gap Filling Applications
Products description
The TIF®100-65-11US Series is an ultra-soft thermal interface material designed specifically to protect precision components that are extremely sensitive to mechanical stress. This product combines high thermal conductivity with exceptional gel-level softness, achieving a perfectly low-stress fit. It is suitable for addressing issues such as large tolerances, uneven surfaces, and the susceptibility of precision components to mechanical damage in high-precision assemblies.
Features:
> Good thermal conductivity :6.5W/mK
> Moldability for complex parts
> Soft and compressible for low stress applications
> Naturally tacky needing no further adhesive coating
> Available in varies thicknesses
Applications:
> Home applince industry
> Power module
> Wearable device
> Solar photovoltaic panel
> LED lighting fixtures
> Audio and video components
> IT infrastructure
> Cooling components to the chassis of frame
> High speed mass storage drives
> Heat Sinking Housing at LED-lit BLU in LCD
> LED TV and LED-lit lamps
| Typical Properties of TIF®100-65-11US Series |
| Property |
Value |
Test method |
| Color |
Dark gray |
Visual |
| Construction & Compostion |
Ceramic filled silicone elastomer |
****** |
| Density(g/cm³) |
3.45 |
ASTM D792 |
| Thickness Range(inch/mm) |
0.010~0.020 |
0.030~0.200 |
ASTM D374 |
| (0.25~0.50) |
(0.75~5.00) |
| Hardness |
65 Shore 00 |
20 Shore 00 |
ASTM 2240 |
| Recommended Operating Temperature |
-40 to 200℃ |
****** |
| Breakdown Voltage(V/mm) |
≥5500 |
ASTM D149 |
| Dielectric Constant |
7.0 MHz |
ASTM D150 |
| Volume Resistivity |
＞1.0X1012 Ohm-meter |
ASTM D257 |
| Flame rating |
V-0 |
UL 94 (E331100) |
| Thermal conductivity |
6.5 W/m-K |
ASTM D5470 |
| 6.5 W/m-K |
ISO22007 |
Products specification
Standard Thickness: 0.010"(0.25 mm)~0.200" (5.00 mm) with increments of 0.010" (0.25 mm).
Standard Size:16"×16" (406 mm×406 mm).
Component Codes:
Reinforcement Fabric: FG (Fiberglass).
Coating Options: NS1 (Non-adhesive treatment), DC1 (Single-sided hardening).
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive).
The TIF® series is available in custom shapes and various forms.
For other thicknesses or more information, please contact us.
Company Profile
Ziitek Electronic Material and Technology Ltd(ZIITEK) has been deeply involved in the field of heat conducting materials for many years, and is a high-tech enterprise integrating R&D, production and sales. Headquartered in Dongguan, with four production bases in Kunshan, Taiwan Province and Viet Nam, the global delivery capacity is stable and reliable. Mainly engaged in thermal conductive silica pads, thermal conductive graphite sheets, thermal conductive insulation materials, PCM phase change materials, thermal conductive plastics, thermal conductive silicone grease/paste, thermal conductive gel, thermal conductive epoxy potting glue, thermal conductive silicone adhesive, silicone foam, and silicon-free thermal pads. The core explosive heating plate is widely recognized by the market. Our products have passed ISO9001 and IATF16949 certification, and meet RoHS/UL standards, and are widely used in new energy, 5G, data center, automotive electronics and other fields.
FAQ:
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Q: How do I request customized samples?
A: To request samples, you can leave us message on website, or just contact us by send email or call us.
Q: What's the thermal conductivity test method given on the data sheet ?
A: All the data in the sheet are actual tested.Hot Disk and ASTM D5470 are utilized to test the thermal conductivity.
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