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Thermal Gap Filler with Superior Thermal Conductivity and Softness to Improve Cooling Efficiency of Electronic Assemblies

China Dongguan Ziitek Electronic Materials & Technology Ltd. certification
China Dongguan Ziitek Electronic Materials & Technology Ltd. certification
The Thermal Conductive Pad is looking and working very good. We have no need for other Thermal Conductive Pad now!

—— Peter Goolsby

I had cooperated with Ziitek for 2 years, they provided high quality thermal conductive materials, and delivery in time, recommend their phase change materials

—— Antonello Sau

Good quality, Good service. Your team always give us help and resolving, hope we will be good partner all the time!

—— Chris Rogers

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Thermal Gap Filler with Superior Thermal Conductivity and Softness to Improve Cooling Efficiency of Electronic Assemblies

Thermal Gap Filler with Superior Thermal Conductivity and Softness to Improve Cooling Efficiency of Electronic Assemblies

Large Image :  Thermal Gap Filler with Superior Thermal Conductivity and Softness to Improve Cooling Efficiency of Electronic Assemblies

Product Details:
Place of Origin: China,dongguan
Brand Name: ZIITEK
Certification: UL and RoHs
Model Number: TIF100-30-11US
Document: TIF100-30-11US_Data Sheet.pdf
Payment & Shipping Terms:
Minimum Order Quantity: 1000pcs
Price: Negotiation
Packaging Details: 1000pcs/bag
Delivery Time: 3-5work days
Payment Terms: T/T
Supply Ability: 100000/day
Detailed Product Description
Product Name: Thermal Gap Filler With Superior Thermal Conductivity And Softness To Improve Cooling Efficiency Of Electronic Assemblies Keywords: Thermal Gap Filler
Construction & Compostion: Ceramic Filled Silicone Elastomer Density: 3.0g/cm³
Dielectric Constant @1MHz: 7.0 Thermal Conductivity(W/mk): 3.0W/mK
Sample: Sample Free Recommended Operating Temperature (°C): -40 To 200℃
Hardness: 65/20 Shore 00 Flame Rating: UL 94 V-0
Application: Enhance Cooling And Reliability Of Electronic Assemblies

Thermal Gap Filler with Superior Thermal Conductivity and Softness to Improve Cooling Efficiency of Electronic Assemblies 


Products description


TIF®100-30-11US Series is an ultra-soft thermal interface material designed specifically to protect precision components that are extremely sensitive to mechanical stress. This product combineshigh thermal conductivity with exceptional gel-level softness achieving a perfcly low-stress fit ,It is suitable for addressing issues such as large tolerances, uneven surfaces, and the susceptibility of precision components to mechanical damage in high-precision assemblies.


Features


 > Outstanding thermal performance
> High tack surface reduces contact resistance
> RoHS compliant
> UL recognized
> Fiberglass reinforced for puncture, shear and tear resistance

Applications

 > Home appliance industry
 > Power module
 > Wearable device
 > Solar photovoltaic panel
 > LED lighting fixtures

 > Power tools
 > Network communication products
 > Electric vehicle batteries
 > Computer CPU/GPU Cooling
 > New energy vehicle power systems

> Motherboard chip
> Radiator
> AI Processors AI Servers

Key attributes

Typical Properties of TIF®100-30-11US Series
Property Value Test method
Colo Dark Gray Visual
Construction & Compostion Ceramic filled silicone elastomer ******
Density(g/cm³) 3.0 ASTM D792
Thickness Range(inch/mm) 0.010~0.020 0.030~0.200 ASTM D374
(0.25~0.50) (0.75~5.00)
Hardness 65 Shore 00

20 Shore 00

ASTM 2240
Recommended Operating Temperature -40 to 200℃ ******
Breakdown Voltage(V/mm) ≥5500 ASTM D149
Dielectric Constant @1MHz 7.0 ASTM D150
Volume Resistivity(Ohm-meter) >1.0X1012  ASTM D257
Flame rating V-0 UL 94 (E331100)
Thermal conductivity (W/m-K) 3.0 ASTM D5470
3.0 ISO22007


Product Specifications


Standard Thickness:0.010" (0.25 mm)~0.200" (5.00 mm) with increments of 0.010" (0.25 mm).
Standard Size: 16" X16" (406 mm X406 mm).


Component Codes:
Reinforcement Fabric: FG (Fiberglass).
Coating Options: NS1 (Non-adhesive treatment),
DC1 (Single-sided hardening).
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive).


The TIF®series is available in custom shapes and various forms.
For other thicknesses or more information, please contact us.

Thermal Gap Filler with Superior Thermal Conductivity and Softness to Improve Cooling Efficiency of Electronic Assemblies 0

Packaging Details & Lead time


The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized


Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

Thermal Gap Filler with Superior Thermal Conductivity and Softness to Improve Cooling Efficiency of Electronic Assemblies 1

Company Profile

Ziitek company is a manufacturer of thermal conductive gap fillers, low melting point thermal interface materials, thermal conductive insulators, thermally conductive tapes, electrically & thermally conductive Interface pads and thermal grease,Thermal Conductive plastic,Silicone Rubber,Silicone Foams,Phase Changing Materials products, with well-equipped testing equipment and strong technical force.


Certifications:

 ISO9001:2015

 ISO14001: 2004 IATF16949:2016

 IECQ QC 080000:2017

 UL   

Thermal Gap Filler with Superior Thermal Conductivity and Softness to Improve Cooling Efficiency of Electronic Assemblies 2

Our services 


Online-service : 12 hours , Inquiry reply within fastest. 


Working time: 8:00am - 5:30pm, Monday to Saturday (UTC+8).

Well-trained & experienced staff are to answer all your inquiries in English of course.

Standard Export Carton Or Marked With Customer's Information Or Customized.

Provide free samples

After-service: Even our products have passed strict inspection, if you find the parts can not work well, please show us the proof.

we will help you to deal with it and give you satisfactory solution.


FAQ 


Q: How do I place an order? 

A:1. Click the "Sent messages" button to continue with the process. 

2. Fill out the message form by entering a subject line, and message to us.  

This message should include any questions you might have about the products as well as your purchase requests.

3. Click the "Send" button when you are finished to complete the process and send your message to us 

4. We will reply you as soon as possible with Email or online 


Q:How can we get detailed price list? 

A:Please offer us detailed information of the product such as Size(length,width,thickness),color,specific packaging requirements and purchasing quantity. 


Q: What kind of packaging you offer? 

A: During the packaging process, preventive measures will be taken by us to assure that the goods are in a good condition during storage and delivery.


Exhibition desplay 

Thermal Gap Filler with Superior Thermal Conductivity and Softness to Improve Cooling Efficiency of Electronic Assemblies 3


Contact Details
Dongguan Ziitek Electronic Materials & Technology Ltd.

Contact Person: Dana Dai

Tel: +86 18153789196

Send your inquiry directly to us (0 / 3000)