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Ultra-Soft 7.5W/m-K Self-Adhesive Thermal Pad Silicone Cooling Pad for PC Laptop

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China Dongguan Ziitek Electronic Materials & Technology Ltd. certification

The Thermal Conductive Pad is looking and working very good. We have no need for other Thermal Conductive Pad now!

—— Peter Goolsby

I had cooperated with Ziitek for 2 years, they provided high quality thermal conductive materials, and delivery in time, recommend their phase change materials

—— Antonello Sau

Good quality, Good service. Your team always give us help and resolving, hope we will be good partner all the time!

—— Chris Rogers

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Ultra-Soft 7.5W/m-K Self-Adhesive Thermal Pad Silicone Cooling Pad for PC Laptop

Large Image : Ultra-Soft 7.5W/m-K Self-Adhesive Thermal Pad Silicone Cooling Pad for PC Laptop

Product Details:

Place of Origin:	China
Brand Name:	ZIITEK
Certification:	UL and RoHs
Model Number:	TIF500-75-11U

Payment & Shipping Terms:

Minimum Order Quantity:	1000pcs
Price:	Negotiation
Packaging Details:	1000pcs/bag
Delivery Time:	3-5 work days
Payment Terms:	T/T
Supply Ability:	100000pcs/day

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Detailed Product Description

Products Name:	Easy And Safe To Install 7.5W/M.K Thermal Pads Silicone Cooling Pad With Self-Adhesive For PC Laptop	Hardness:	50/27 Shore 00
Application:	PC Laptop	Thermal Conductivity:	7.5W/m-K
Color:	Dark Gray	Continuous Use Temp:	-40 To 200℃
Sample:	Sample Free	Thickness:	0.020"(0.50mm)~0.200"(5.0mm)
Keywords:	Silicone Cooling Pad
Highlight:	self-adhesive silicone thermal pad , 7.5W/M.K laptop cooling pad , PC thermal gap filler

Easy And Safe To Install 7.5W/M.K Thermal Pads Silicone Cooling Pad With Self-Adhesive For PC Laptop

The TIF^®500-75-11U Series is an ultra-soft thermal interface material designed specifically to protect precision components that are extremely sensitive to mechanical stress.This product combines high thermal conductivity with exceptional gel-level softness, achieving a perfectly low stress fit. It is suitable for addressing issues such as large tolerances, uneven surfaces, and the susceptibility of precision components to mechanical damage in high-precision assemblies.

Features

> High thermal conductivity
> Super soft and highly compliant
> Good insulation performance

> High tack surface reduces contact resistance
> RoHS compliant
> UL recognized

Applications

> Industrial Control
> New Energy

> Power tools
> Network communication products
> Electric vehicle batteries
> Computer CPU/GPU Cooling
> New energy vehicle power systems

> Al Servers
> Semiconductor Packaging
> Low-altitude Aircraft
> Optical Communication Products
> 5G Base Stations

Typical Properties of TIF^®500-75-11U Series
Property	Value		Test method
Color	Dark gray		Visual
Construction & Compostion	Ceramic filled silicone elastomer		******
Density(g/cm³)	3.45		ASTM D792
Thickness Range(inch/mm)	0.020~0.030	0.040~0.200	ASTM D374
	(0.50~0.75)	(1.00~5.00)
Hardness	50 Shore 00	27 Shore 00	ASTM 2240
Continuos Use Temp	-40 to 200℃		******
Breakdown Voltage(V/mm)	≥ 5500		ASTM D149
Dielectric Constant	8.0 MHz		ASTM D150
Volume Resistivity	＞1.0X10¹² Ohm-meter		ASTM D257
Thermal Conductivity (W/m-K)	7.5		ASTM D5470
	7.5		ISO22007
Fire rating	V-0		UL 94 (E331100)

Product Specifications
Standard Thickness: 0.020" (0.50 mm)～ 0.200" (5.00 mm) with increments of 0.010" (0.25 mm).
Standard Size: 16"×16" (406 mm ×406 mm).

Component Codes:
Reinforcement Fabric: FG (Fiberglass).
Coating Options: NS1 (Non-adhesive treatment),
DC1 (Single-sided hardening).
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive).

The TIF^® series is available in custom shapes and various forms.
For other thicknesses or more information, please contact us.

Ultra-Soft 7.5W/m-K Self-Adhesive Thermal Pad Silicone Cooling Pad for PC Laptop 0

Packaging Details & Lead time

The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

Company profile

Dongguan Ziitek Electronic Material Technology Co., Ltd. was established in 2006. Is a high-tech enterprise specializing in the research, development, production and sales of thermal interface materials. We mainly produce: heat-conducting joint filler, low melting point thermal interface materials, heat-conducting insulator, heat-conducting adhesive tape, heat-conducting interface pad and heat-conducting grease, heat-conducting plastic, silicone rubber, silicone rubber foam, etc. We adhere to the business philosophy of "survival by quality, development by quality", and continue to provide the most efficient and best service for new and old customers with excellent quality in the spirit of rigor, pragmatism and innovation.

Certifications:

ISO9001:2015

ISO14001: 2004 IATF16949:2016

IECQ QC 080000:2017

Why Choose us ?

1.Our value message is'' Do it right the First time, total quality control''.

2.Our core competencies is thermal conductive interface materials.

3.Competitive advantage products.

4.Condidentiality agreement Bussiness Secrect Contract.

5.Free sample offer.

6.Quality assurance contract.

Ultra-Soft 7.5W/m-K Self-Adhesive Thermal Pad Silicone Cooling Pad for PC Laptop 1

Tag:

Contact Person: Dana Dai

Tel: +86 18153789196

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Ultra-Soft 7.5W/m-K Self-Adhesive Thermal Pad Silicone Cooling Pad for PC Laptop

Ultra-Soft 7.5W/m-K Self-Adhesive Thermal Pad Silicone Cooling Pad for PC Laptop

self-adhesive silicone thermal pad

7.5W/M.K laptop cooling pad

PC thermal gap filler

thermally conductive filler,

thermal conductivity silicone,

high temperature phase change materials