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Product Details:
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| Products Name: | Good Insulation Performance 6.5W/MK Thermal GAP PAD Materials For Computer CPU/GPU Cooling | Keywords: | Thermal Gap Pad |
|---|---|---|---|
| Thermal Conductivity: | 6.5W/m-K | Color: | Dark Gray |
| Continuous Use Temp: | -40 To 200℃ | Application: | Computer CPU/GPU Cooling |
| Thickness: | 0.010"(0.25mm)~0.200"(5.0mm) | Sample: | Sample Free |
| Hardness: | 65/27 Shore 00 |
Good Insulation Performance 6.5W/MK Thermal GAP PAD Materials For Computer CPU/GPU Cooling
The TIF®500-65-11U Series is an ultra-soft thermal interface material designed specifically to protect precision components that are extremely sensitive to mechanical stress. This product combines high thermal conductivity with exceptional gel-level softness, achieving a perfectly low-stress fit. It is suitable for addressing issues such as large tolerances, uneven surfaces, and the susceptibility of precision components to mechanical damage in high-precision assemblies.
Features
> High thermal conductivity
> Super soft and highly compliant
> Self-adhesive without the need for additional surface adhesives
> Good insulation performance
> RoHS compliant
> UL recognized
Applications
> Power tools
> Network communication products
> Electric vehicle batteries
> Computer CPU/GPU Cooling
> New energy vehicle power systems
> Heat pipe thermal solutions
> Memory Modules
> Mass storage devices
> Automotive electronics
| Typical Properties of TIF®500-65-11U Series | |||
| Property | Value | Test method | |
| Color | Dark gray | Visual | |
| Construction & Compostion | Ceramic filled silicone elastomer | ****** | |
| Density(g/cm³) | 3.4 | ASTM D792 | |
| Thickness Range(inch/mm) | 0.010~0.020 | 0.030~0.200 | ASTM D374 |
| (0.25~0.50) | (0.75~5.00) | ||
| Hardness | 65 Shore 00 | 27 Shore 00 | ASTM 2240 |
| Continuos Use Temp | -40 to 200℃ | ****** | |
| Breakdown Voltage(V/mm) | ≥ 5500 | ASTM D149 | |
| Dielectric Constant | 7.0 MHz | ASTM D150 | |
| Volume Resistivity | >1.0X1012 Ohm-meter | ASTM D257 | |
| Thermal Conductivity (W/m-K) | 6.5 | ASTM D5470 | |
| 6.5 | ISO22007 | ||
| Fire rating | V-0 | UL 94 (E331100) | |
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The packaging of thermal pad
1.with PET film or foam-for protection
2. use Paper Card To Separate Each Layer
3. export carton inside and outside
4. meet with customers' requirement-customized
Lead Time :Quantity(Pieces):5000
Est. Time(days): To be negotiated
Company profile
Ziitek Technology Company is dedicated to providing a comprehensive range of thermal management products and services to meet various demand scenarios. Ziitek Technology offers prompt and flexible services. Our thermal conductive materials are widely used in the fields of new energy, electronic appliances, transportation, industry, healthcare, communication, etc. Ziitek has obtained ISO9001, ISO14001 and IECQ certifications, which indicate our commitment to producing high-quality products and adopting excellent management methods. Our products comply with RoHS, REACH and UL standards, ensuring safety and reliability.
Our services
Online-service : 12 hours , Inquiry reply within fastest.
Working time: 8:00am - 5:30pm, Monday to Saturday (UTC+8).
Well-trained & experienced staff are to answer all your inquiries in English of course.
Standard Export Carton Or Marked With Customer's Information Or Customized.
Provide free samples
After-service: Even our products have passed strict inspection, if you find the parts can not work well, please show us the proof.
we will help you to deal with it and give you satisfactory solution.
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Contact Person: Dana Dai
Tel: +86 18153789196