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Thermal GAP PAD Materials 2.0W/MK Silicone-Based Thermal Gap Pad For For Advanced Cooling Needs

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Thermal GAP PAD Materials 2.0W/MK Silicone-Based Thermal Gap Pad For For Advanced Cooling Needs

Thermal GAP PAD Materials 2.0W/MK Silicone-Based Thermal Gap Pad For For Advanced Cooling Needs
Thermal GAP PAD Materials 2.0W/MK Silicone-Based Thermal Gap Pad For For Advanced Cooling Needs
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Large Image :  Thermal GAP PAD Materials 2.0W/MK Silicone-Based Thermal Gap Pad For For Advanced Cooling Needs

Product Details:
Place of Origin: China
Brand Name: ZIITEK
Certification: UL and RoHs
Model Number: TIF200-20-18U
Payment & Shipping Terms:
Minimum Order Quantity: 1000pcs
Price: Negotiation
Packaging Details: 1000pcs/bag
Delivery Time: 3-5 work days
Payment Terms: T/T
Supply Ability: 100000pcs/day
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Detailed Product Description
Products Name: Thermal GAP PAD Materials 2.0W/MK Silicone-Based Thermal Gap Pad For For Advanced Cooling Needs Hardness: 27 Shore 00
Keywords: Thermal GAP PAD Materials Thermal Conductivity: 2.0W/m-K
Color: Yellow/ Green Continuous Use Temp: -40 To 200℃
Sample: Sample Free Thickness: 0.010"(0.25mm)~0.200"(5.0mm)
Application: Advanced Cooling Needs

Thermal GAP PAD Materials 2.0W/MK Silicone-Based Thermal Gap Pad For For Advanced Cooling Needs

 

The TIF®200-20-18U Series is a compound thermal interface material that combines good thermal conductivity,reliable electrical insulation, and extremely soft characteristics. This product not only provides excellent thermal conductivity but also ensures superior breakdown voltage strength,effectively preventing circuit short circuits. Its soft characteristic allows it to fully fill uneven interfaces, providing excellent cushioning protection for precision components while dissipating heat. This series is an ideal choice for applications requiring electrical isolation,such as power devices,new energy vehicles,and portable electronic devices.


Features


> Good thermal conductivity
> Super soft and highly compliant
> Self-adhesive without the need for additional surface adhesives
> High insulation performance
> Puncture-resistant, tear-resistant, and scratch-resistant performance


Applications

 

> Power Electronics
> Automotive Electronics
> Consumer Electronics
> Industrial Control
> New Energy

 

Typical Properties of TIF®200-20-18U Series
Property Value Test method
Color Yellow/Green Visual
Construction & Compostion Ceramic filled silicone elastomer ******
Density(g/cm³) 2.25 ASTM D792
Thickness Range(inch/mm) 0.010~0.020 0.030~0.200 ASTM D374
(0.25~0.50) (0.75~5.00)
Hardness 27 Shore 00 27 Shore 00 ASTM 2240
Continuos Use Temp -40 to 200℃ ******
Breakdown Voltage(V/mm) ≥ 8000 ASTM D149
Dielectric Constant 5.0 MHz ASTM D150
Volume Resistivity ＞1.0X1012 Ohm-meter ASTM D257
Thermal Conductivity (W/m-K) 2.0 ASTM D5470
2.0 ISO22007
Fire rating V-0 UL 94 (E331100)
 
Product Specifications
Standard Thickness: 0.010" (0.25 mm)～ 0.200" (5.00 mm) with increments of 0.010" (0.25 mm).
Standard Size: 16"×16" (406 mm ×406 mm).

Component Codes:
Reinforcement Fabric: FG (Fiberglass).
Coating Options: NS1 (Non-adhesive treatment),
DC1 (Single-sided hardening).
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive).

The TIF® series is available in custom shapes and various forms.
For other thicknesses or more information, please contact us.

Thermal GAP PAD Materials 2.0W/MK Silicone-Based Thermal Gap Pad For For Advanced Cooling Needs 0

Packaging Details & Lead time

 

The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

 

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

 

Company profile

 

Dongguan Ziitek Electronic Material Technology Co., Ltd. was established in 2006. Is a high-tech enterprise specializing in the research, development, production and sales of thermal interface materials. We mainly produce: heat-conducting joint filler, low melting point thermal interface materials, heat-conducting insulator, heat-conducting adhesive tape, heat-conducting interface pad and heat-conducting grease, heat-conducting plastic, silicone rubber, silicone rubber foam, etc. We adhere to the business philosophy of "survival by quality, development by quality", and continue to provide the most efficient and best service for new and old customers with excellent quality in the spirit of rigor, pragmatism and innovation.

 

Factory Size:8000~10,000 square meters

Factory Country/Region:No.12, Xiju Road, Hengli Township, Dongguan City, Guangdong Province, P.R.China

Online-service : 12 hours , Inquiry reply within fastest.
Working time: 8:00am - 5:30pm, Monday to Saturday (UTC+8).

Well-trained & experienced staff are to answer all your inquiries in English of course.

Standard Export Carton Or Marked With Customer's Information Or Customized.

Provide free samples

 

After-service: Even our products have passed strict inspection, if you find the parts can not work well, please show us the proof.

we will help you to deal with it and give you satisfactory solution.

Thermal GAP PAD Materials 2.0W/MK Silicone-Based Thermal Gap Pad For For Advanced Cooling Needs 1

Tag:

thermally conductive filler,

thermal conductivity silicone,

high temperature phase change materials

Contact Details
Dongguan Ziitek Electronic Materials & Technology Ltd.

Contact Person: Dana Dai

Tel: +86 18153789196

Send your inquiry directly to us (0 / 3000)

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