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Thermal GAP PAD Materials Thermally Gap Pad For AI Processors AI Servers

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china Dongguan Ziitek Electronic Materials & Technology Ltd. certification

The Thermal Conductive Pad is looking and working very good. We have no need for other Thermal Conductive Pad now!

—— Peter Goolsby

I had cooperated with Ziitek for 2 years, they provided high quality thermal conductive materials, and delivery in time, recommend their phase change materials

—— Antonello Sau

Good quality, Good service. Your team always give us help and resolving, hope we will be good partner all the time!

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Thermal GAP PAD Materials Thermally Gap Pad For AI Processors AI Servers

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Product Details:

Place of Origin:	China
Brand Name:	ZIITEK
Certification:	UL and RoHs
Model Number:	TIF500-50-11US

Payment & Shipping Terms:

Minimum Order Quantity:	1000pcs
Price:	Negotiation
Packaging Details:	1000pcs/bag
Delivery Time:	3-5work days
Supply Ability:	10000/day

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Detailed Product Description

Products Name:	Thermal GAP PAD Materials Thermally Gap Pad For AI Processors AI Servers	Thermal Conductivity:	5.0 W/mK
Thickness:	Available In Varies Thicknes	Application:	AI Processors AI Servers
Keywords:	Thermally Gap Pad	Hardness:	65 Shore 00
Specific Gravity:	3.2g/cc	Flame Rating:	94 -V0
Construction & Compostion:	Ceramic Filled Silicone Elastomer

Thermal GAP PAD Materials Thermally Gap Pad For AI Processors AI Servers

TIF^®500-50-11US Series is an ultra soft thermal interface material designed specifically to protect precision components that are extremely sensitive to mechanical stress. This product combines high thermal conductivity with extreme gel grade flexibility to achieve a perfect fit with low stress. It is suitable for solving problems such as large tolerances,uneven surfaces, and susceptibility of precision components to mechanical damage in high-precision assembly.

Features:

> High thermal conductive:5.0W/mK
> Available in varies thickness

> Good flexibility and fillability
> Self-adhesive without the need for additional surface adhesives
> Good insulation performance

> Ultra soft and highly compliant

Applications:

> Micro heat pipe thermal solutions
> Automotive engine control units
> Telecommunication hardware
> Handheld portable electronics
> Semiconductor automated test equipment (ATE)
> CPU

> AI Processors AI Servers

> Routers
> Medical Devices
> Auditioning electronic products
> unmanned aerial vehicle(UAV)
> Photovoltaic
> Signal communication
> New energy vehicle
> Motherboard chip
> Radiator

Typical Properties of TIF^®500-50-11US Series
Property	Value		Test method
Color	Dark Gray		Visual
Construction & Compostion	Ceramic filled silicone elastomer		******
Density(g/cm³)	3.2		ASTM D792
Thickness Range(inch/mm)	0.010~0.020	0.030~0.200	ASTM D374
	(0.25~0.5)	(0.75~5.0)
Hardness	65 Shore 00	20 Shore 00	ASTM 2240
Recommended Operating Temperature	-40 to 200℃		******
Breakdown Voltage(V/mm)	≥5500		ASTM D149
Dielectric Constant	6.0MHz		ASTM D150
Volume Resistivity	＞1.0X10¹² Ohm-meter		ASTM D257
Flame rating	V-0		UL 94 (E331100)
Thermal conductivity	5.0 W/m-K		ASTM D5470
	5.0 W/m-K		ISO22007

Packaging Details & Lead time

The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

Company Profile

With a wide range, good quality, reasonable prices and stylish designs, Ziitek thermal conductive interface materials are extensively used in Mainboards, VGA cards, Notebooks, DDR&DDR2 products, CD-ROM ,LCD TV, PDP products, Server Power products, Down lamps, Spotlights, Street lamps, Daylight lamps, LED Server Power products and others.

Thermal GAP PAD Materials Thermally Gap Pad For AI Processors AI Servers 1

Independent R&D team

Q: How do I place an order?

A:1. Click the "Sent messages" button to continue with the process.

2. Fill out the message form by entering a subject line, and message to us.

This message should include any questions you might have about the products as well as your purchase requests.

3. Click the "Send" button when you are finished to complete the process and send your message to us.

4. We will reply you as soon as possible with Email or online.

Tag:

Contact Person: Dana Dai

Tel: 18153789196

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Thermal GAP PAD Materials Thermally Gap Pad For AI Processors AI Servers

Thermal GAP PAD Materials Thermally Gap Pad For AI Processors AI Servers

thermally conductive filler,

thermal conductivity silicone,

high temperature phase change materials