1.5W/M. K Silicone Thermal Pad Manufacturer Direct Sale High Temperature Thermal Pad For CPU/GPU/SSD

1.5W/M. K Silicone Thermal Pad Manufacturer Direct Sale High Temperature Thermal Pad For CPU/GPU/SSD

The TIF^®100-05U Series use a special process, with silicone as the base material, adding thermal conductive powder and flame retardant together to make the mixture to become thermal interface material. This is effective in lower the thermal resistance between the heat source and the heat sink.

Features

> Good thermal conductive: 1.5W/mK 
> Moldability for complex parts
> Soft and compressible for low stress applications
> Moldability for complex parts
> Outstanding thermal performance
> High tack surface reduces contact resistance

Applications

> Cooling components to the chassis of frame
> High speed mass storage drives
> Heat Sinking Housing at LED-lit BLU in LCD
> LED TV and LED-lit lamps
> RDRAM memory modules
> Micro heat pipe thermal solutions
> Monitoring the Power Box
> AD-DC Power Adapters
> Rainproof LED Power
> Waterproof LED Power
> SMD LED module
> Routers
> Medical Devices
> Auditioning electronic products
> unmanned aerial vehicle(UAV)

Product Specification

Product Thicknesses: 0.010-inch to 0.200-inch (0.25mm to 5.0mm)
Product Sizes:8" x 16"(203mm x406mm)

Individual die cut shapes and custom thickness can be supplied, Please contact us for comfirming.