1.5W/M. K Silicone Thermal Pad Manufacturer Direct Sale High Temperature Thermal Pad For CPU/GPU/SSD

1.5W/M. K Silicone Thermal Pad Manufacturer Direct Sale High Temperature Thermal Pad For CPU/GPU/SSD

 The TIF^®100-05U Series is an ultra-soft thermal interface material designed specifically to protect precision components that are extremely sensitive to mechanical stress. This product combines good thermal conductivity with an exceptionally gel-like softness, achieving a low-stress perfect fit.

Features

> Good thermal conductivity: 1.5W/mK 
> Moldability for complex parts
> Soft and compressible for low stress applications
> Moldability for complex parts
> Outstanding thermal performance
> High tack surface reduces contact resistance

Applications

> Cooling components to the chassis of frame
> High speed mass storage drives
> Heat Sinking Housing at LED-lit BLU in LCD
> LED TV and LED-lit lamps
> RDRAM memory modules
> Micro heat pipe thermal solutions
> Monitoring the Power Box
> AD-DC Power Adapters
> Rainproof LED Power
> Waterproof LED Power
> SMD LED module
> Routers
> Medical Devices
> Auditioning electronic products
> unmanned aerial vehicle(UAV)

Product Specification

Standard Thickness: 0.010" (0.25 mm)~0.200" (5.00 mm)with increments of 0.010" (0.25 mm)
Standard Size: 16"X 16" (406 mmX406 mm)

Component Codes:

Reinforcement Fabric: FG (Fiberglass).
Coating Options: NS1 (Non-adhesive treatment),
DC1 (Single-sided hardening).
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive).

The TIF^® series is available in custom shapes and various forms.
For other thicknesses or more information, please contact us.