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Products Name: | Thermal Conductive Silica Sheet 6.5W Thermal Gap Filler Pad For Telecommunication Equipment | Application: | Telecommunication Equipment |
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Continuos Use Temp: | -45℃ To 200℃ | Density: | 3.4g/cc |
Hardness: | 12 Shore 00 | Color: | Gray |
Thermal Conductivity& Compostion: | 6.5W/m-K | Thickness: | 0.02~0.20inch / 0.5~5.0mmT |
Construction: | Ceramic Filled Silicone Elastomer | Keywords: | Thermal Gap Filler Pad |
Thermal Conductive Silica Sheet 6.5W Thermal Gap Filler Pad For Telecommunication Equipment
TIF®700NES Series thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base.Their flexibility and elasticity make them suited to coat very uneven surfaces.Heat can transmit to the metal housing or dissipation plate from the heating elements or even the entire PCB, which effecitly enhances the efficiency and life-time of the heat-generating electronic components.
Features
> Excellent thermal conductivity: 6.5 W/mK
> Naturally tacky needing no further adhesive coating
> High compliance adapts to various pressure application environments
> Available in different thickness options
Applications
> Heat dissipation structure for radiators
> Telecommunication equipment
> Automotive electronics
> Battery packs for electric vehicles
> LED TV and lamps
Typical Properties of TIF®700NES Series | ||
Property | Value | Test method |
Color | Gray | Visual |
Construction & Compostion | Ceramic filled silicone elastomer | ******* |
Density | 3.4g/cc | ASTM D792 |
Thickness range | 0.02~0.20inch / 0.5~5.0mmT | ASTM D374 |
Hardness | 12 Shore 00 | ASTM 2240 |
Breakdown Voltage(V/mm) | ≥5500 | ASTM D149 |
Recommended Operating Temp | -40 ~200℃ | Ziitek Test Method |
Dielectric Constant @1MHz | 7.0 | ASTM D150 |
Volume Resistivity | ≥1.0X1013Ohm-meter | ASTM D257 |
Fire rating | V-0 | UL94 (E331100) |
Thermal conductivity | 6.5W/mK | ASTM D5470 |
Product Specifications
Standard Thickness: 0.02" to 0.20" (0.50 to 5.00 mm) with increments of 0.01 (0.25 mm).
Standard Size: 16"X16"(406 mm×406 mm).
Component Codes:
Coating Options: NS1 (Non-adhesive treatment), DC1 (Single-sided hardening).
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive).
The TIF series is available in custom shapes and various forms. For other thicknesses or more information, please contact us.
The packaging of thermal pad
1.with PET film or foam-for protection
2. use Paper Card To Separate Each Layer
3. export carton inside and outside
4. meet with customers' requirement-customized
Lead Time :Quantity(Pieces):5000
Est. Time(days): To be negotiated
Ziitek Electronic Material and Technology Ltd. is a R&D and production company, we have many production lines and processing technology of thermal conductive materials, owns advanced production equipment and optimized process, can provide various thermal solutions for different applications.
Ziitek Culture
Quality :
Do it right the first time, total quality control
Effectiveness:
Work precisely and thoroughly for effectiveness
Service:
Quick response, On time delivery and Excellent service
Team work:
Complete teamwork, including sales team, Marketing team, engineering team, R&D team, Manufacturing team, logistics team. All is for supporting and servicing a satisfy service for customers.
Contact Person: Dana Dai
Tel: 18153789196