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Products Name: | Thermal Conductive Silicone Pad Aluminum Battery 5G Phone 0.5-5.0mm Thermal Interface Material Thermal Conductive Gap Filler | Keywords: | Thermal Silicone Pad |
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Continuos Use Temp: | -45℃ To 200℃ | Density: | 3.0g/cc |
Hardness: | 13 Shore 00 | Color: | Blue |
Thermal Conductivity& Compostion: | 2.6W/m-K | Thickness: | 0.02~0.20inch / 0.5~5.0mmT |
Construction: | Ceramic Filled Silicone Elastomer | Application: | Aluminum Battery 5G Phone |
Thermal Conductive Silicone Pad Aluminum Battery 5G Phone 0.5-5.0mm Thermal Interface Material Thermal Conductive Gap Filler
TIF500BS is a silicone based, thermally conductive gap pad. Its unreinforced construction allows additional compliancy. This product has low hardness is conformable and is electrically isolating. The low modulus characteristic of the product offers optimal thermal performance with the ease of handling.
Features:
> Good thermal conductive : 2.6W/mK
> Naturally tacky needing no further adhesive coating
> Soft and Compressible for low stress applications
> Available in varies thickness
Applications
> Cooling components to the
> chassis of frame
> Set Top Box
> Car Battery & Power Supply
> Charging Pile
> LED TV/ Lighting
> Graphics Card Thermal Module
Typical Properties of TIF500BS | ||
Color | Blue | Visual |
Construction & Compostion | Ceramic filled silicone elastomer | ******* |
Density | 3.0g/cc | ASTM D297 |
Thickness range | 0.02~0.20inch / 0.5~5.0mmT | ASTM C351 |
Hardness | 13 Shore 00 | ASTM 2240 |
Dielectric Breakdown Voltage | >5500 VAC | ASTM D412 |
Operating Temp | -45 ~200℃ | ******* |
Dielectric Constant | 5.0 MHz | ASTM D150 |
Volume Resistivity | ≥2.0X1013Ohm-meter | ASTM D257 |
Fire rating | 94 V0 | equivalent UL |
Thermal conductivity | 2.6W/mK | ASTM D5470 |
Product Specifications
Standard Thickness:
0.02 to 0.20 (0.50 to 5.00 mm) with increments of 0.01 (0.25 mm).
Standard Size:
8"X16"(203 mm×406 mm).
Component Codes:
Reinforcement Fabric: FG (Fiberglass).
Coating Options: NS1 (Non-adhesive treatment). DC1 (Single-sided hardening).
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive).
Notes: FG (Fiberglass)provides enhanced strength, suitable for materials with thicknesses of 0.01 to 0.02 inch (0.25 to 0.50 mm).
The TIF series is available in custom shapes and various forms.
For other thicknesses or moreinformation. please contact us.
The packaging of thermal pad
1.with PET film or foam-for protection
2. use Paper Card To Separate Each Layer
3. export carton inside and outside
4. meet with customers' requirement-customized
Lead Time :Quantity(Pieces):5000
Est. Time(days): To be negotiated
Dongguan Ziitek Electronic Material Technology Co., Ltd. was established in 2006. Is a high-tech enterprise specializing in the research, development, production and sales of thermal interface materials. We mainly produce: heat-conducting joint filler, low melting point thermal interface materials, heat-conducting insulator, heat-conducting adhesive tape, heat-conducting interface pad and heat-conducting grease, heat-conducting plastic, silicone rubber, silicone rubber foam, etc. We adhere to the business philosophy of "survival by quality, development by quality", and continue to provide the most efficient and best service for new and old customers with excellent quality in the spirit of rigor, pragmatism and innovation.
Why Choose us ?
1.Our value message is'' Do it right the First time, total quality control''.
2.Our core competencies is thermal conductive interface materials.
3.Competitive advantage products.
4.Condidentiality agreement Bussiness Secrect Contract.
5.Free sample offer.
6.Quality assurance contract.
Contact Person: Dana Dai
Tel: 18153789196