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Thermal Conductive Silicone Pad Aluminum Battery 5G Phone 0.5-5.0mm Thermal Interface Material Thermal Conductive Gap Filler

China Dongguan Ziitek Electronic Materials & Technology Ltd. certification
China Dongguan Ziitek Electronic Materials & Technology Ltd. certification
The Thermal Conductive Pad is looking and working very good. We have no need for other Thermal Conductive Pad now!

—— Peter Goolsby

I had cooperated with Ziitek for 2 years, they provided high quality thermal conductive materials, and delivery in time, recommend their phase change materials

—— Antonello Sau

Good quality, Good service. Your team always give us help and resolving, hope we will be good partner all the time!

—— Chris Rogers

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Thermal Conductive Silicone Pad Aluminum Battery 5G Phone 0.5-5.0mm Thermal Interface Material Thermal Conductive Gap Filler

Thermal Conductive Silicone Pad Aluminum Battery 5G Phone 0.5-5.0mm Thermal Interface Material Thermal Conductive Gap Filler

Large Image :  Thermal Conductive Silicone Pad Aluminum Battery 5G Phone 0.5-5.0mm Thermal Interface Material Thermal Conductive Gap Filler

Product Details:
Place of Origin: China
Brand Name: ZIITEK
Certification: UL and RoHs
Model Number: TIF500BS
Payment & Shipping Terms:
Minimum Order Quantity: 1000pcs
Price: negotiation
Packaging Details: 1000pcs/bag
Delivery Time: 3-5work days
Supply Ability: 10000/day
Detailed Product Description
Products Name: Thermal Conductive Silicone Pad Aluminum Battery 5G Phone 0.5-5.0mm Thermal Interface Material Thermal Conductive Gap Filler Keywords: Thermal Silicone Pad
Continuos Use Temp: -45℃ To 200℃ Density: 3.0g/cc
Hardness: 13 Shore 00 Color: Blue
Thermal Conductivity& Compostion: 2.6W/m-K Thickness: 0.02~0.20inch / 0.5~5.0mmT
Construction: Ceramic Filled Silicone Elastomer Application: Aluminum Battery 5G Phone

Thermal Conductive Silicone Pad Aluminum Battery 5G Phone 0.5-5.0mm Thermal Interface Material Thermal Conductive Gap Filler

 

TIF500BS is a silicone based, thermally conductive gap pad. Its unreinforced construction allows additional compliancy. This product has low hardness is conformable and is electrically isolating. The low modulus characteristic of the product offers optimal thermal performance with the ease of handling.


Features:

> Good thermal conductive : 2.6W/mK
> Naturally tacky needing no further adhesive coating

> Soft and Compressible for low stress applications
> Available in varies thickness

 

Applications
> Cooling components to the
> chassis of frame
> Set Top Box
> Car Battery & Power Supply
> Charging Pile
> LED TV/ Lighting
> Graphics Card Thermal Module

Typical Properties of TIF500BS
Color Blue Visual
Construction & Compostion Ceramic filled silicone elastomer *******
Density 3.0g/cc ASTM D297
Thickness range 0.02~0.20inch / 0.5~5.0mmT ASTM C351
Hardness 13 Shore 00 ASTM 2240
Dielectric Breakdown Voltage >5500 VAC ASTM D412
Operating Temp -45 ~200℃ *******
Dielectric Constant 5.0 MHz ASTM D150
Volume Resistivity ≥2.0X1013Ohm-meter ASTM D257
Fire rating 94 V0 equivalent UL
Thermal conductivity 2.6W/mK ASTM D5470

 

Product Specifications
Standard Thickness:

0.02 to 0.20 (0.50 to 5.00 mm) with increments of 0.01 (0.25 mm).

 

Standard Size:

8"X16"(203 mm×406 mm).


Component Codes:
Reinforcement Fabric: FG (Fiberglass).
Coating Options: NS1 (Non-adhesive treatment). DC1 (Single-sided hardening).

Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive).
Notes: FG (Fiberglass)provides enhanced strength, suitable for materials with thicknesses of 0.01 to 0.02 inch (0.25 to 0.50 mm).
The TIF series is available in custom shapes and various forms.

For other thicknesses or moreinformation. please contact us.

Thermal Conductive Silicone Pad Aluminum Battery 5G Phone 0.5-5.0mm Thermal Interface Material Thermal Conductive Gap Filler 0
Packaging Details & Lead time

 

The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

 

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

 

Company Profile

 

Dongguan Ziitek Electronic Material Technology Co., Ltd. was established in 2006. Is a high-tech enterprise specializing in the research, development, production and sales of thermal interface materials. We mainly produce: heat-conducting joint filler, low melting point thermal interface materials, heat-conducting insulator, heat-conducting adhesive tape, heat-conducting interface pad and heat-conducting grease, heat-conducting plastic, silicone rubber, silicone rubber foam, etc. We adhere to the business philosophy of "survival by quality, development by quality", and continue to provide the most efficient and best service for new and old customers with excellent quality in the spirit of rigor, pragmatism and innovation.

 

Why Choose us ?

 

1.Our value message is'' Do it right the First time, total quality control''.

2.Our core competencies is thermal conductive interface materials.

3.Competitive advantage products.

4.Condidentiality agreement Bussiness Secrect Contract.

5.Free sample offer.

6.Quality assurance contract.

Contact Details
Dongguan Ziitek Electronic Materials & Technology Ltd.

Contact Person: Dana Dai

Tel: 18153789196

Send your inquiry directly to us (0 / 3000)