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Factory Hot Sale Thermal Pad High Temperature Resistant Thermal Insulated Gap Pad Gpu Laptop Thermal Silicone Pad

China Dongguan Ziitek Electronic Materials & Technology Ltd. certification
China Dongguan Ziitek Electronic Materials & Technology Ltd. certification
The Thermal Conductive Pad is looking and working very good. We have no need for other Thermal Conductive Pad now!

—— Peter Goolsby

I had cooperated with Ziitek for 2 years, they provided high quality thermal conductive materials, and delivery in time, recommend their phase change materials

—— Antonello Sau

Good quality, Good service. Your team always give us help and resolving, hope we will be good partner all the time!

—— Chris Rogers

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Factory Hot Sale Thermal Pad High Temperature Resistant Thermal Insulated Gap Pad Gpu Laptop Thermal Silicone Pad

Factory Hot Sale Thermal Pad High Temperature Resistant Thermal Insulated Gap Pad Gpu Laptop Thermal Silicone Pad

Large Image :  Factory Hot Sale Thermal Pad High Temperature Resistant Thermal Insulated Gap Pad Gpu Laptop Thermal Silicone Pad

Product Details:
Place of Origin: China
Brand Name: ZIITEK
Certification: UL and RoHs
Model Number: TIF540-20-11US
Payment & Shipping Terms:
Minimum Order Quantity: 1000pcs
Price: negotiation
Packaging Details: 1000pcs/bag
Delivery Time: 3-5work days
Supply Ability: 10000/day
Detailed Product Description
Products Name: Factory Hot Sale Thermal Pad High Temperature Resistant Thermal Insulated Gap Pad Gpu Laptop Thermal Silicone Pad Thermal Conductivity& Compostion: 2.0W/m-K
Continuos Use Temp: -40℃ To 200℃ Construction: Ceramic Filled Silicone Elastomer
Specific Gravity: 2.7g/cc Keywords: Thermal Silicone Pad
Hardness: 20±5 Shore 00 Color: Gray
Thickness: 1.0mmT Application: LED CPU GPU MOS Laptop

Factory Hot Sale Thermal Pad High Temperature Resistant Thermal Insulated Gap Pad Gpu Laptop Thermal Silicone Pad

 

TIF540-20-11US series use a special process, with silicone as the base material, adding thermal conductive powder and flame retardant together to make the mixture to become thermal interface material. This is effective in lower the thermal resistance between the heat source and the heat sink.

 

Features:
> Excellent thermal conductivity 2.0W/mK

> Moldability for complex parts
> Soft and compressible for low stress applications
> High tack surface reduces contact resistance
> RoHS compliant
> UL recognized


Applications:

> Cooling components to the chassis of frame
> CPU and GPU processors and other chipsets
> High-performance computing (HPC)

> Industrial equipment
> Network communication devices

> New energy vehicles
> LED CPU GPU MOS

> Power supply
> Heat pipe thermal solutions
> Memory Modules
> Mass storage devices

Typical Properties of TIF540-20-11US Series
Color Gray Visual
Construction & Compostion Ceramic filled silicone elastomer *****
Specific Gravity 2.7 g/cc ASTM D792
thickness 1.0mmT ASTM D374
Hardness (thickness<1.0mm) 20±5 Shore 00 ASTM 2240
Continuos Use Temp -40 to 200℃ ******
Dielectric Breakdown Voltage ≥5500 VAC ASTM D149
Dielectric Constant 4.5 MHz ASTM D150
Volume Resistivity ≥1.0*1012 Ohm-cm ASTM D150
Fire rating 94 V0 UL (E331100)
Thermal conductivity 2.0 W/m-K ASTM D5470

Standard Thicknesses:

 

0.020" (0.51mm) 0.030" (0.76mm)

0.040" (1.02mm) 0.050" (1.27mm) 0.060" (1.52mm)

0.070" (1.78mm) 0.080" (2.03mm) 0.090" (2.29mm)

0.100" (2.54mm) 0.110" (2.79mm) 0.120" (3.05mm)

0.130" (3.30mm) 0.140" (3.56mm) 0.150" (3.81mm)

0.160" (4.06mm) 0.170" (4.32mm) 0.180" (4.57mm)

0.190" (4.83mm) 0.200" (5.08mm)

Consult the factory to alternate thickness.

 

Product Specification
Product Thicknesses: 0.020"(0.50mm)-0.200"(5.00mm)
Product Sizes:8" x 16"(203mm x406mm)
Custom die-cut shapes and thicknesses are available.Please contact us for details.
Store in a cool, dry place, away from fire and sunlight.
Factory Hot Sale Thermal Pad High Temperature Resistant Thermal Insulated Gap Pad Gpu Laptop Thermal Silicone Pad 0
Packaging Details & Lead time

 

The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

 

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

 

Company Profile

 

With professional R&D capabilities and many year experiences in thermal interface material industry, Ziitek company own many unique formulations which are our core technologies and advantages. Our goal is to provide quality & competitive products to our customers worldwide aiming for long-term business cooperation.

 

Why Choose us ?

 

1.Our value message is'' Do it right the First time, total quality control''.

2.Our core competencies is thermal conductive interface materials.

3.Competitive advantage products.

4.Condidentiality agreement Bussiness Secrect Contract.

5.Free sample offer.

6.Quality assurance contract.

Contact Details
Dongguan Ziitek Electronic Materials & Technology Ltd.

Contact Person: Dana Dai

Tel: 18153789196

Send your inquiry directly to us (0 / 3000)