|
|
Product Details:
Payment & Shipping Terms:
|
| Products Name: | Factory Hot Sale Thermal Pad High Temperature Resistant Thermal Insulated Gap Pad Gpu Laptop Thermal Silicone Pad | Thermal Conductivity& Compostion: | 2.0W/m-K |
|---|---|---|---|
| Continuos Use Temp: | -40℃ To 200℃ | Construction: | Ceramic Filled Silicone Elastomer |
| Specific Gravity: | 2.5g/cc | Keywords: | Thermal Silicone Pad |
| Hardness: | 20 Shore 00 | Color: | Dark Gray |
| Thickness: | 1.0mmT | Application: | LED CPU GPU MOS Laptop |
| Highlight: | Gpu Laptop Thermal Pad,High Temperature Resistant Thermal Pad,Thermal Insulated Gap Pad |
||
Factory Hot Sale Thermal Pad High Temperature Resistant Thermal Insulated Gap Pad Gpu Laptop Thermal Silicone Pad
TIF®540-20-11US Series is an ultra-soft thermal interface material designed specifically to protect precision components that are extremely_sensitive to mechanical stress. This product combines high thermal conductivity with an exceptionally gel-like softness, achieving a low-stress perfect fit. It is suitable for addressing issues in high-precision assemblies, such as large tolerances, uneven surfaces, and the susceptibility of delicate components to mechanical damage.
Features
> Excellent thermal conductivity 2.0W/mK
> Moldability for complex parts
> Soft and compressible for low stress applications
> High tack surface reduces contact resistance
> RoHS compliant
> UL recognized
Applications
> Cooling components to the chassis of frame
> CPU and GPU processors and other chipsets
> High-performance computing (HPC)
> Industrial equipment
> Network communication devices
> New energy vehicles
> LED CPU GPU MOS
> Power supply
> Heat pipe thermal solutions
> Memory Modules
> Mass storage devices
| Typical Properties of TIF®500-20-11US Series | |||
| Property | Value | Test method | |
| Color | Dark Gray | Visual | |
| Construction & Compostion | Ceramic filled silicone elastomer | ****** | |
| Density(g/cm³) | 2.5 | ASTM D792 | |
| Thickness Range(inch/mm) | 0.010~0.020 | 0.030~0.200 | ASTM D374 |
| (0.25~0.50) | (0.75~5.0) | ||
| Hardness | 65 Shore 00 | 20 Shore 00 | ASTM 2240 |
| Recommended Operating Temperature | -40 to 200℃ | ****** | |
| Breakdown Voltage(V/mm) | ≥5500 | ASTM D149 | |
| Dielectric Constant | 4.5 MHz | ASTM D150 | |
| Volume Resistivity | >1.0X1012 Ohm-meter | ASTM D257 | |
| Flame rating | V-0 | UL94 (E331100) | |
| Thermal conductivity | 2.0 W/m-K | ASTM D5470 | |
| 2.0 W/m-K | ISO22007 | ||
The packaging of thermal pad
1.with PET film or foam-for protection
2. use Paper Card To Separate Each Layer
3. export carton inside and outside
4. meet with customers' requirement-customized
Lead Time :Quantity(Pieces):5000
Est. Time(days): To be negotiated
Dongguan Ziitek Electronic Material Technology Co., Ltd. was established in 2006. Is a high-tech enterprise specializing in the research, development, production and sales of thermal interface materials. We mainly produce: heat-conducting joint filler, low melting point thermal interface materials, heat-conducting insulator, heat-conducting adhesive tape, heat-conducting interface pad and heat-conducting grease, heat-conducting plastic, silicone rubber, silicone rubber foam, etc. We adhere to the business philosophy of "survival by quality, development by quality", and continue to provide the most efficient and best service for new and old customers with excellent quality in the spirit of rigor, pragmatism and innovation.
Why Choose us ?
1.Our value message is'' Do it right the First time, total quality control''.
2.Our core competencies is thermal conductive interface materials.
3.Competitive advantage products.
4.Condidentiality agreement Bussiness Secrect Contract.
5.Free sample offer.
6.Quality assurance contract.
Contact Person: Dana Dai
Tel: 18153789196