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Factory Hot Sale Thermal Pad High Temperature Resistant Thermal Insulated Gap Pad Gpu Laptop Thermal Silicone Pad

china Dongguan Ziitek Electronic Materials & Technology Ltd. certification
china Dongguan Ziitek Electronic Materials & Technology Ltd. certification
The Thermal Conductive Pad is looking and working very good. We have no need for other Thermal Conductive Pad now!

—— Peter Goolsby

I had cooperated with Ziitek for 2 years, they provided high quality thermal conductive materials, and delivery in time, recommend their phase change materials

—— Antonello Sau

Good quality, Good service. Your team always give us help and resolving, hope we will be good partner all the time!

—— Chris Rogers

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Factory Hot Sale Thermal Pad High Temperature Resistant Thermal Insulated Gap Pad Gpu Laptop Thermal Silicone Pad

Factory Hot Sale Thermal Pad High Temperature Resistant Thermal Insulated Gap Pad Gpu Laptop Thermal Silicone Pad

Large Image :  Factory Hot Sale Thermal Pad High Temperature Resistant Thermal Insulated Gap Pad Gpu Laptop Thermal Silicone Pad

Product Details:
Place of Origin: China
Brand Name: ZIITEK
Certification: UL and RoHs
Model Number: TIF540-20-11US
Payment & Shipping Terms:
Minimum Order Quantity: 1000pcs
Price: Negotiation
Packaging Details: 1000pcs/bag
Delivery Time: 3-5work days
Payment Terms: T/T
Supply Ability: 10000/day
Detailed Product Description
Products Name: Factory Hot Sale Thermal Pad High Temperature Resistant Thermal Insulated Gap Pad Gpu Laptop Thermal Silicone Pad Thermal Conductivity& Compostion: 2.0W/m-K
Continuos Use Temp: -40℃ To 200℃ Construction: Ceramic Filled Silicone Elastomer
Specific Gravity: 2.5g/cc Keywords: Thermal Silicone Pad
Hardness: 20 Shore 00 Color: Dark Gray
Thickness: 1.0mmT Application: LED CPU GPU MOS Laptop
Highlight:

Gpu Laptop Thermal Pad

,

High Temperature Resistant Thermal Pad

,

Thermal Insulated Gap Pad

Factory Hot Sale Thermal Pad High Temperature Resistant Thermal Insulated Gap Pad Gpu Laptop Thermal Silicone Pad

 

TIF®540-20-11US Series is an ultra-soft thermal interface material designed specifically to protect precision components that are extremely_sensitive to mechanical stress. This product combines high thermal conductivity with an exceptionally gel-like softness, achieving a low-stress perfect fit. It is suitable for addressing issues in high-precision assemblies, such as large tolerances, uneven surfaces, and the susceptibility of delicate components to mechanical damage.

 

Features


> Excellent thermal conductivity 2.0W/mK

> Moldability for complex parts
> Soft and compressible for low stress applications
> High tack surface reduces contact resistance
> RoHS compliant
> UL recognized


Applications

 

> Cooling components to the chassis of frame
> CPU and GPU processors and other chipsets
> High-performance computing (HPC)

> Industrial equipment
> Network communication devices

> New energy vehicles
> LED CPU GPU MOS

> Power supply
> Heat pipe thermal solutions
> Memory Modules
> Mass storage devices

 

Typical Properties of TIF®500-20-11US Series
Property Value Test method
Color Dark Gray Visual
Construction & Compostion Ceramic filled silicone elastomer ******
Density(g/cm³) 2.5 ASTM D792
Thickness Range(inch/mm) 0.010~0.020 0.030~0.200 ASTM D374
(0.25~0.50) (0.75~5.0)
Hardness 65 Shore 00 20 Shore 00 ASTM 2240
Recommended Operating Temperature -40 to 200℃ ******
Breakdown Voltage(V/mm) ≥5500 ASTM D149
Dielectric Constant 4.5 MHz ASTM D150
Volume Resistivity >1.0X1012 Ohm-meter ASTM D257
Flame rating V-0 UL94 (E331100)
Thermal conductivity 2.0 W/m-K ASTM D5470
2.0 W/m-K ISO22007

 

Product Specifications
Standard Thickness: 0.010" (0.25 mm)~0.200" (5.00 mm) with increments of 0.010" (0.25 mm)
Standard Size: 16"X 16" (406 mm×406 mm)

Component Codes:
Reinforcement Fabric: FG (Fiberglass).
Coating Options: NS1 (Non-adhesive treatment),
DC1 (Single-sided hardening).
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive).

The TIF® series is available in custom shapes and various forms.
For other thicknesses or more information, please contact us.
Factory Hot Sale Thermal Pad High Temperature Resistant Thermal Insulated Gap Pad Gpu Laptop Thermal Silicone Pad 0
Packaging Details & Lead time

 

The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

 

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

 

Company Profile

 

Dongguan Ziitek Electronic Material Technology Co., Ltd. was established in 2006. Is a high-tech enterprise specializing in the research, development, production and sales of thermal interface materials. We mainly produce: heat-conducting joint filler, low melting point thermal interface materials, heat-conducting insulator, heat-conducting adhesive tape, heat-conducting interface pad and heat-conducting grease, heat-conducting plastic, silicone rubber, silicone rubber foam, etc. We adhere to the business philosophy of "survival by quality, development by quality", and continue to provide the most efficient and best service for new and old customers with excellent quality in the spirit of rigor, pragmatism and innovation.

 

Why Choose us ?

 

1.Our value message is'' Do it right the First time, total quality control''.

2.Our core competencies is thermal conductive interface materials.

3.Competitive advantage products.

4.Condidentiality agreement Bussiness Secrect Contract.

5.Free sample offer.

6.Quality assurance contract.

Contact Details
Dongguan Ziitek Electronic Materials & Technology Ltd.

Contact Person: Dana Dai

Tel: 18153789196

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