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2W High Quality Factory Wholesale Customized Thermal Pad Thermal Gap Filler Insulation Sheet Silicone Pad For LED CPU GPU MOS

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china Dongguan Ziitek Electronic Materials & Technology Ltd. certification

The Thermal Conductive Pad is looking and working very good. We have no need for other Thermal Conductive Pad now!

—— Peter Goolsby

I had cooperated with Ziitek for 2 years, they provided high quality thermal conductive materials, and delivery in time, recommend their phase change materials

—— Antonello Sau

Good quality, Good service. Your team always give us help and resolving, hope we will be good partner all the time!

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2W High Quality Factory Wholesale Customized Thermal Pad Thermal Gap Filler Insulation Sheet Silicone Pad For LED CPU GPU MOS

Large Image : 2W High Quality Factory Wholesale Customized Thermal Pad Thermal Gap Filler Insulation Sheet Silicone Pad For LED CPU GPU MOS

Product Details:

Place of Origin:	China
Brand Name:	ZIITEK
Certification:	UL and RoHs
Model Number:	TIF520-20-11US

Payment & Shipping Terms:

Minimum Order Quantity:	1000pcs
Price:	Negotiation
Packaging Details:	1000pcs/bag
Delivery Time:	3-5work days
Payment Terms:	T/T
Supply Ability:	10000/day

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Detailed Product Description

Products Name:	2W High Quality Factory Wholesale Customized Thermal Pad Thermal Gap Filler Insulation Sheet Silicone Pad For LED CPU GPU MOS	Thermal Conductivity& Compostion:	2.0W/m-K
Construction:	Ceramic Filled Silicone Elastomer	Specific Gravity:	2.5g/cc
Keywords:	Thermal Silicone Pad	Hardness:	20 Shore 00
Color:	Dark Gray	Thickness:	0.5mmT
Continuos Use Temp:	-40℃ To 200℃	Application:	LED CPU GPU MOS
Highlight:	2W Thermal Pad , High Quality Customized Thermal Pad , Factory Wholesale Customized Thermal Pad

2W High Quality Factory Wholesale Customized Thermal Pad Thermal Gap Filler Insulation Sheet Silicone Pad For LED CPU GPU MOS

TIF^®520-20-11US Series is an ultra-soft thermal interface material designed specifically to protect precision components that are extremely_sensitive to mechanical stress. This product combines high thermal conductivity with an exceptionally gel-like softness, achieving a low-stress perfect fit. It is suitable for addressing issues in high-precision assemblies, such as large tolerances, uneven surfaces, and the susceptibility of delicate components to mechanical damage.

Features

> Excellent thermal conductivity 2.0W/mK

> Moldability for complex parts
> Soft and compressible for low stress applications
> Broad range of hardnesses available
> Moldability for complex parts
> Outstanding thermal performance

Applications

> Cooling components to the chassis of frame
> CPU and GPU processors and other chipsets
> High-performance computing (HPC)

> Industrial equipment
> Network communication devices

> New energy vehicles
> LED CPU GPU MOS

> Display card
> Mainboard/mother board
> Notebook

Typical Properties of TIF^®500-20-11US Series
Property	Value		Test method
Color	Dark Gray		Visual
Construction & Compostion	Ceramic filled silicone elastomer		******
Density(g/cm³)	2.5		ASTM D792
Thickness Range(inch/mm)	0.010~0.020	0.030~0.200	ASTM D374
	(0.25~0.50)	(0.75~5.0)
Hardness	65 Shore 00	20 Shore 00	ASTM 2240
Recommended Operating Temperature	-40 to 200℃		******
Breakdown Voltage(V/mm)	≥5500		ASTM D149
Dielectric Constant	4.5 MHz		ASTM D150
Volume Resistivity	＞1.0X10¹² Ohm-meter		ASTM D257
Flame rating	V-0		UL94 (E331100)
Thermal conductivity	2.0 W/m-K		ASTM D5470
	2.0 W/m-K		ISO22007

Product Specifications
Standard Thickness: 0.010" (0.25 mm)~0.200" (5.00 mm) with increments of 0.010" (0.25 mm)
Standard Size: 16"X 16" (406 mm×406 mm)

Component Codes:
Reinforcement Fabric: FG (Fiberglass).
Coating Options: NS1 (Non-adhesive treatment),
DC1 (Single-sided hardening).
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive).

The TIF^® series is available in custom shapes and various forms.
For other thicknesses or more information, please contact us.

Packaging Details & Lead time

The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

Company Profile

Ziitek Electronic Material and Technology Ltd. is dedicated to developing composite thermal solution and manufacturing superior thermal interface materials for competitive market. Our vast experience allows us to assist our customers best in thermal engineering field.We serve customers with customized products, full product lines and flexible production, which makes us be the best and reliable partner of you. Let's make your design more perfect!

Our services

Online-service : 12 hours , Inquiry reply within fastest.

Working time: 8:00am - 5:30pm, Monday to Saturday (UTC+8).

Well-trained & experienced staff are to answer all your inquiries in English of course.

Standard Export Carton Or Marked With Customer's Information Or Customized.

Provide free samples

After-service: Even our products have passed strict inspection, if you find the parts can not work well, please show us the proof.

we will help you to deal with it and give you satisfactory solution.

Tag:

Contact Person: Dana Dai

Tel: 18153789196

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2W High Quality Factory Wholesale Customized Thermal Pad Thermal Gap Filler Insulation Sheet Silicone Pad For LED CPU GPU MOS

2W High Quality Factory Wholesale Customized Thermal Pad Thermal Gap Filler Insulation Sheet Silicone Pad For LED CPU GPU MOS

2W Thermal Pad

High Quality Customized Thermal Pad

Factory Wholesale Customized Thermal Pad

thermally conductive filler,

thermal conductivity silicone,

high temperature phase change materials