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Thermal Conductive Silicone Pad 8.0 W/M-K High-Temperature Insulation Gap Pad GPU Laptop Thermal Conductive Pad

China Dongguan Ziitek Electronic Materials & Technology Ltd. certification
China Dongguan Ziitek Electronic Materials & Technology Ltd. certification
The Thermal Conductive Pad is looking and working very good. We have no need for other Thermal Conductive Pad now!

—— Peter Goolsby

I had cooperated with Ziitek for 2 years, they provided high quality thermal conductive materials, and delivery in time, recommend their phase change materials

—— Antonello Sau

Good quality, Good service. Your team always give us help and resolving, hope we will be good partner all the time!

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Thermal Conductive Silicone Pad 8.0 W/M-K High-Temperature Insulation Gap Pad GPU Laptop Thermal Conductive Pad

Thermal Conductive Silicone Pad 8.0 W/M-K High-Temperature Insulation Gap Pad GPU Laptop Thermal Conductive Pad
Thermal Conductive Silicone Pad 8.0 W/M-K High-Temperature Insulation Gap Pad GPU Laptop Thermal Conductive Pad
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Large Image :  Thermal Conductive Silicone Pad 8.0 W/M-K High-Temperature Insulation Gap Pad GPU Laptop Thermal Conductive Pad

Product Details:
Place of Origin: China
Brand Name: ZIITEK
Certification: UL and RoHs
Model Number: TS-TIF100C 8045-11
Payment & Shipping Terms:
Minimum Order Quantity: 1000pcs
Price: negotiation
Packaging Details: 1000pcs/bag
Delivery Time: 3-5work days
Supply Ability: 10000/day
Detailed Product Description
Products Name: Thermal Conductive Silicone Pad 8.0 W/M-K High-Temperature Insulation Gap Pad GPU Laptop Thermal Conductive Pad Keywords: Thermal Conductive Silicone Pad
Hardness: 45 Shore 00 Color: Gray
Specific Gravity: 3.4g/cc Thickness: 0.012"(0.30mm)~0.200"(5.00mm)
Construction: Ceramic Filled Silicone Elastomer Continuos Use Temp: -45℃ To 200℃
Thermal Conductivity& Compostion: 8.0W/m-K Application: GPU Laptop
Highlight:

High Temperature Thermal Conductive Silicone Pad

,

Laptop Thermal Conductive Silicone Pad

,

High-Temperature Insulation Gap Pad

Thermal Conductive Silicone Pad 8.0 W/M-K High-Temperature Insulation Gap Pad GPU Laptop Thermal Conductive Pad

 

TS-TIF®100C 8045-11 series is a silicone-based thermal material designed to fill the gaps between heat-generating components and liquid cooling plates or metal bases. lts flexibility and elasticity make it ideal for covering highly uneven surfaces. With excellent thermal conductivity, it efficiently transfers heat from heat-generating elements or PCBs to liquid cooling plates or metal heat dissipation structures,thereby improving the cooling efficiency of high-power electronic components and extending the lifespan of the equipment.


Features:
> Excellent thermal conductivity 8.0W/mK

> Moldability for complex parts
> Soft and compressible for low stress applications
> Broad range of hardnesses available
> BMoldability for complex parts
> BOutstanding thermal performance


Applications:

> Telecommunication hardware
> Heat Sinking Housing at LED-lit BLU in LCD
> LED TV and LED-lit lamps
> RDRAM memory modules
> Micro heat pipe thermal solutions
> Automotive engine control units

> Telecommunication hardware
> Handheld portable electronics
> Semiconductor automated test equipment (ATE)
> CPU

> Display card
> Mainboard/mother board
> Notebook
> Power supply

Typical Properties of  TS-TIF®100C 8045-11 Series
Color Gray Visual
Construction & Compostion Ceramic filled silicone elastomer ******
Specific Gravity 3.4g/cc ASTM D297
thickness 0.012"(0.30mm)~0.200"(5.00mm) ASTM D374
Hardness (thickness<1.0mm) 45 (Shore 00) ASTM 2240
Continuos Use Temp -40 to 200℃ ******
Dielectric Breakdown Voltage >5500 VAC ASTM D149
Dielectric Constant 7.2MHz ASTM D150
Volume Resistivity ≥1.0X10¹²Ohm-meter ASTM D257
Fire rating 94 V0 equivalent UL
Thermal conductivity 8.0W/m-K ASTM D5470

Standard Thicknesses:

 

0.020" (0.51mm) 0.030" (0.76mm)

0.040" (1.02mm) 0.050" (1.27mm) 0.060" (1.52mm)

0.070" (1.78mm) 0.080" (2.03mm) 0.090" (2.29mm)

0.100" (2.54mm) 0.110" (2.79mm) 0.120" (3.05mm)

0.130" (3.30mm) 0.140" (3.56mm) 0.150" (3.81mm)

0.160" (4.06mm) 0.170" (4.32mm) 0.180" (4.57mm)

0.190" (4.83mm) 0.200" (5.08mm)

Consult the factory to alternate thickness.

 

Product Specification
Product Thicknesses: 0.012"(0.30mm)-0.200"(5.00mm)
Product Sizes:8" x 16"(203mm x406mm)
Custom die-cut shapes and thicknesses are available.Please contact us for details.
Store in a cool, dry place, away from fire and sunlight.
Thermal Conductive Silicone Pad 8.0 W/M-K High-Temperature Insulation Gap Pad GPU Laptop Thermal Conductive Pad 0
Packaging Details & Lead time

 

The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

 

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

 

Company Profile

 

Ziitek company is a high-tech enterprise which dedicated to the R&D, manufacture and sales of the thermal interface materials (TIMs). We have rich experiences in this field which can support you the latest, most effective and one -step thermal management solutions. We have many advanced production equipments,full test equipments and fully automatic coating production lines which can support the production for high performance thermal silicone pad, thermal graphite sheet/ film, thermal double-sided tape, thermal insulation pad, thermal ceramic pad, phase change material, thermal grease etc. UL94 V-0, SGS and ROHS are compliant.

 

Independent R&D team

 

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Contact Details
Dongguan Ziitek Electronic Materials & Technology Ltd.

Contact Person: Dana Dai

Tel: 18153789196

Send your inquiry directly to us (0 / 3000)