Thermal Pad GPU And CPU Heat Dissipation Pad High Thermal Conductive Pad With RoHS Compliant Material

Name: Thermal Pad GPU And CPU Heat Dissipation Pad High Thermal Conductive Pad With RoHS Compliant Material
Brand: Dongguan Ziitek Electronical Material and Technology Co., Ltd
SKU: TIF800QE Series
Price: 5.03 USD
Availability: InStock

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Thermal Pad GPU And CPU Heat Dissipation Pad High Thermal Conductive Pad With RoHS Compliant Material

Large Image : Thermal Pad GPU And CPU Heat Dissipation Pad High Thermal Conductive Pad With RoHS Compliant Material

Product Details:

Place of Origin:	China
Brand Name:	ZIITEK
Certification:	UL and RoHs
Model Number:	TIF800QE Series
Document:	TIF800QE_Data Sheet.pdf

Payment & Shipping Terms:

Minimum Order Quantity:	1000pcs
Price:	Negotiation
Packaging Details:	1000pcs/bag
Delivery Time:	3-7work days
Payment Terms:	T/T
Supply Ability:	10000/day

Contact Now

Thermal Pad GPU And CPU Heat Dissipation Pad High Thermal Conductive Pad With RoHS Compliant Material

Description

Products Name:	Thermal Pad GPU And CPU Heat Dissipation Pad High Thermal Conductive Pad With RoHS Compliant Material	Recommended Operating Temperature:	-40℃ To 200℃
Thermal Conductivity& Compostion:	13.0W/m-K	Hardness:	40/35 Shore 00
Construction:	Ceramic Filled Silicone Elastomer	Density:	3.45g/cm³
Thickness Range(inch/mm):	0.012"~0.200"(0.30mm~5.0mm)	Color:	Gray
Keywords:	Thermal Conductive Pad
Highlight:	CPU Heat Dissipation Pad , High Thermal Conductive Pad , GPU Heat Dissipation Pad

Thermal Pad GPU And CPU Heat Dissipation Pad High Thermal Conductive Pad With RoHS Compliant Material

TIF^®800QE Series Thermal Interface Material

The TIF^®800QE series of thermal interface materials is specifically designed to fill air gaps between heat-generating components and heat sinks or metal baseplates. It offers excellent compliance, allowing it to conform tightly to heat sources with varying shapes and height differences. Even in confined or irregular spaces, it maintains stable thermal conductivity, enabling efficient heat transfer from discrete components or the entire PCB to the metal housing or heat sink. This significantly improves the heat dissipation efficiency of electronic components, thereby enhancing operational stability and extending device lifespan.

Key Features

Excellent thermal conductivity: 13.0W/mK
Naturally tacky, needing no additional adhesive coating
High compliance adapts to various pressure application environments
Available in different thickness options
Easy release construction
Electrically isolating
High durability

Applications

Heat dissipation structure for radiators
Telecommunication equipment
Automotive electronics
Battery packs for electric vehicles
LED drivers and lamps
Mass storage devices
Set top boxes
Audio and video components

Typical Properties of TIF^®800QE Series

Property	Value	Test Method
Color	Gray	Visual
Construction	Ceramic filled silicone elastomer	ZKTM J024
Density (g/cm³)	3.45	ASTM D792
Thickness Range (inch/mm)	0.012~0.020 \| 0.030~0.200 0.30~0.50 \| 0.75~5.00	ASTM D374
Hardness (Shore 00)	40 \| 35	ASTM 2240
Recommended Operating Temperature	-40 to 200℃	ZKTM J025
Breakdown Strength (V/mm)	≥5500	ASTM D149
Dielectric Constant @1MHz	7.0	ASTM D150
Volume Resistivity (Ohm-meter)	＞1.0×10¹²	ASTM D257
Flame rating	V-0	UL 94 (E331100)
Thermal conductivity (W/m-K)	13.0	ASTM D5470

Product Specification

Standard Thickness: 0.012" (0.30mm) ~ 0.200" (5.00mm)

Standard Size: 16" × 16" (406mm × 406mm)

The TIF^® series is available in custom shapes and various forms. For other thicknesses or more information, please contact us.

Packaging Details

PET film or foam protection
Paper card separation between each layer
Export carton packaging inside and outside
Customized packaging available to meet customer requirements

Lead Time

Quantity: 5000 pieces

Estimated Time: To be negotiated

Company Profile

Ziitek Electronic Material and Technology Ltd was founded in 2006 and headquartered in Dongguan, Guangdong, is a high-tech enterprise specializing in heat conduction, heating, sealing and EMI products. In order to quickly respond to the global customer demand, the company has established production bases in Kunshan, Jiangsu, Taiwan Province and Viet Nam, and continues to promote the global distribution of production areas to ensure efficient delivery and localized services.

Zhaoke's product system covers thermal interface materials, EMI shielding, heating products, foamed silicone seals and thermal engineering plastics, and is widely used in new energy vehicles, energy storage, AI servers, 5G communications, aerospace and other fields. The company has passed many certifications such as IATF16949 and ISO9001, and its products meet ROHS, REACH and UL specifications, serving the global market with reliable quality.

Frequently Asked Questions

What Is a Thermal Pad?

A thermal pad is a pre-formed TIM designed to fill gaps between heat sources and heat sinks. Depending on the formulation, thermal pads can also provide electrical insulation and flame resistance.

How Do I Choose the Correct Thermal Pad Thickness?

Thermal pad thickness should be selected based on the actual gap, dimensional tolerance, compression ratio and assembly pressure rather than simply choosing the thinnest option.

Can Thermal Pads Be Customized?

Yes. ZIITEK can provide customized thermal interface solutions based on thickness, dimensions, shape, hardness and surface requirements.

Does a Thermal Pad Need Compression?

Most thermal pads require a controlled amount of compression to improve interface contact. Excessive compression, however, may create unwanted mechanical stress.

What Is a Low-Volatility Thermal Interface Material?

Low-volatility TIMs are designed to minimize volatile emissions during long-term operation, making them suitable for electronics requiring high cleanliness and long-term reliability.

Overall Rating

5.0

Based on 50 reviews for this supplier

Rating Snapshot

The following is the distribution of all ratings

5 stars

100%

4 stars

3 stars

2 stars

1 stars

All Reviews

Dante

Poland Jul 20.2026

Helpful (6)

These worked so well, I came back for more. I have a mini pc with passive cooling. When it heats up, the case/heat sink separates slightly from the CPU causing the CPU temps to increase drastically. These thermal pads filled the gap giving me consistent CPU temperatures. I also used them for LAN and NVME drives.

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