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Thermal Pad GPU And CPU Heat Dissipation Pad High Thermal Conductive Pad With RoHS Compliant Material

China Dongguan Ziitek Electronic Materials & Technology Ltd. certification
China Dongguan Ziitek Electronic Materials & Technology Ltd. certification
The Thermal Conductive Pad is looking and working very good. We have no need for other Thermal Conductive Pad now!

—— Peter Goolsby

I had cooperated with Ziitek for 2 years, they provided high quality thermal conductive materials, and delivery in time, recommend their phase change materials

—— Antonello Sau

Good quality, Good service. Your team always give us help and resolving, hope we will be good partner all the time!

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Thermal Pad GPU And CPU Heat Dissipation Pad High Thermal Conductive Pad With RoHS Compliant Material

Thermal Pad GPU And CPU Heat Dissipation Pad High Thermal Conductive Pad With RoHS Compliant Material
Thermal Pad GPU And CPU Heat Dissipation Pad High Thermal Conductive Pad With RoHS Compliant Material
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Product Details:
Place of Origin: China
Brand Name: ZIITEK
Certification: UL and RoHs
Model Number: TIF800QE Series
Payment & Shipping Terms:
Minimum Order Quantity: 1000pcs
Price: negotiation
Packaging Details: 1000pcs/bag
Delivery Time: 3-5work days
Supply Ability: 10000/day
Detailed Product Description
Products Name: Thermal Pad GPU And CPU Heat Dissipation Pad High Thermal Conductive Pad With RoHS Compliant Material Continuos Use Temp: -40℃ To 200℃
Thermal Conductivity& Compostion: 13.0W/m-K Hardness: 35 Shore 00
Construction: Ceramic Filled Silicone Elastomer Specific Gravity: 3.7g/cc
Thickness: 0.030"~0.20"(0.75mm~5.0mm) Color: Gray
Keywords: Thermal Conductive Pad
Highlight:

CPU Heat Dissipation Pad

,

High Thermal Conductive Pad

,

GPU Heat Dissipation Pad

Thermal Pad GPU And CPU Heat Dissipation Pad High Thermal Conductive Pad With RoHS Compliant Material

 

TIF®800QE series of thermal interface materials is specifically designed to fill air gaps between heat-generating components and heat sinks or metal baseplates. It offers excellent compliance, alowing it to conform fightly to heat sources with varying shapes and height dferences. Even in confined or iregular spaces,it maintains stable thermal conductivity, enabling efficient heat transfer from discrete components or the entire PCB to the metal housing or heat sink. This significantly improves the heat dissipation efficiency of electronic components, thereby enhancing operational stability and extending device lifespan.

 

Features:
> Excellent thermal conductivity 13.0W/mK

> Naturally tacky needing no further adhesive coating
> High compliance adapts to various pressure application environments
> Available in different thickness options

> Easy release construction
> Electrically isolating
> High durability


Applications:
> Heat dissipation structure for radiators

> Telecommunication equipment
> Automotive electronics
> Battery packs for electric vehicles

> LED drivers and lamps

> Mass storage devices
> Automotive electronics
> Set top boxes
> Audio and video components

Typical Properties of TIF®800QE Series
Color Gray Visual
Construction & Compostion Ceramic filled silicone elastomer ******
Specific Gravity 3.7g/cc ASTM D297
thickness 0.030"(0.75mm)~0.200"(5.00mm) ASTM D374
Hardness (thickness<1.0mm) 35 (Shore 00) ASTM 2240
Continuos Use Temp -40 to 200℃ ******
Dielectric Breakdown Voltage ≥5500 VAC ASTM D149
Dielectric Constant 8.0MHz ASTM D150
Volume Resistivity ≥1.0X10¹²Ohm-meter ASTM D257
Fire rating 94 V0 equivalent UL
Thermal conductivity 13.0W/m-K ASTM D5470

Standard Thicknesses:

 

0.020" (0.51mm) 0.030" (0.76mm)

0.040" (1.02mm) 0.050" (1.27mm) 0.060" (1.52mm)

0.070" (1.78mm) 0.080" (2.03mm) 0.090" (2.29mm)

0.100" (2.54mm) 0.110" (2.79mm) 0.120" (3.05mm)

0.130" (3.30mm) 0.140" (3.56mm) 0.150" (3.81mm)

0.160" (4.06mm) 0.170" (4.32mm) 0.180" (4.57mm)

0.190" (4.83mm) 0.200" (5.08mm)

Consult the factory to alternate thickness.

 

Product Specification
Product Thicknesses: 0.03"(0.75mm)~0.200"(5.00mm) with increments of 0.01(0.25mm)
Product Sizes:16" x 16"(406mm x406mm)
 
Component Codes:
Reinforcement Fabric: FG (Fiberglass).
Coating Options: NS1 (Non-adhesive treatment), DC1(Single-sided hardening).
Adhesive Options: A1/A2(Single-sided/Double-sided adhesive).
Notes:FG (Fiberglass) provides enhanced strength, suitable for materials with thicknesses of 0.01 to 0.02 inch (0.25to 0.5mm).
The TIF series is available in custom shapes and various forms.For other thicknesses or more information, please contact us.
Thermal Pad GPU And CPU Heat Dissipation Pad High Thermal Conductive Pad With RoHS Compliant Material 0

Packaging Details & Lead time

 

The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

 

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

 

Company Profile

 

With professional R&D capabilities and many year experiences in thermal interface material industry, Ziitek company own many unique formulations which are our core technologies and advantages. Our goal is to provide quality & competitive products to our customers worldwide aiming for long-term business cooperation.

 

Ziitek Culture

 

Quality :

Do it right the first time, total quality control

Effectiveness:

Work precisely and thoroughly for effectiveness

Service:

Quick response, On time delivery and Excellent service

Team work:

Complete teamwork, including sales team, Marketing team, engineering team, R&D team, Manufacturing team, logistics team. All is for supporting and servicing a satisfy service for customers.

Contact Details
Dongguan Ziitek Electronic Materials & Technology Ltd.

Contact Person: Dana Dai

Tel: 18153789196

Send your inquiry directly to us (0 / 3000)