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Thermal Interface Material 13W Soft Silicone Thermal Conductive Pad Gpu Cpu Light Thermal Gap Filler

China Dongguan Ziitek Electronic Materials & Technology Ltd. certification
China Dongguan Ziitek Electronic Materials & Technology Ltd. certification
The Thermal Conductive Pad is looking and working very good. We have no need for other Thermal Conductive Pad now!

—— Peter Goolsby

I had cooperated with Ziitek for 2 years, they provided high quality thermal conductive materials, and delivery in time, recommend their phase change materials

—— Antonello Sau

Good quality, Good service. Your team always give us help and resolving, hope we will be good partner all the time!

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Thermal Interface Material 13W Soft Silicone Thermal Conductive Pad Gpu Cpu Light Thermal Gap Filler

Thermal Interface Material 13W Soft Silicone Thermal Conductive Pad Gpu Cpu Light Thermal Gap Filler
Thermal Interface Material 13W Soft Silicone Thermal Conductive Pad Gpu Cpu Light Thermal Gap Filler
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Product Details:
Place of Origin: China
Brand Name: ZIITEK
Certification: UL and RoHs
Model Number: TIF800Q Series
Payment & Shipping Terms:
Minimum Order Quantity: 1000pcs
Price: negotiation
Packaging Details: 1000pcs/bag
Delivery Time: 3-5work days
Supply Ability: 10000/day
Detailed Product Description
Products Name: Thermal Interface Material 13W Soft Silicone Thermal Conductive Pad Gpu Cpu Light Thermal Gap Filler Continuos Use Temp: -40℃ To 200℃
Hardness: 45 Shore 00 Keywords: Thermal Gap Filler
Thermal Conductivity& Compostion: 13.0W/m-K Specific Gravity: 3.7g/cc
Thickness: 0.030"~0.20"(0.75mm~5.0mm) Color: Gray
Construction: Ceramic Filled Silicone Elastomer
Highlight:

Gpu Cpu Thermal Interface Material

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Soft Silicone Thermal Interface Material

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13W Thermal Interface Material

Thermal Interface Material 13W Soft Silicone Thermal Conductive Pad Gpu Cpu Light Thermal Gap Filler

 

TIF®800Q series of thermal interface materials is specifically designed to fill air gaps between heat-generating components and heat sinks or metal baseplates. It offers excellent compliance, alowing it to conform fightly to heat sources with varying shapes and height dferences. Even in confined or iregular spaces,it maintains stable thermal conductivity, enabling efficient heat transfer from discrete components or the entire PCB to the metal housing or heat sink. This significantly improves the heat dissipation efficiency of electronic components, thereby enhancing operational stability and extending device lifespan.

 

Features:
> Excellent thermal conductivity 13.0W/mK

> Naturally tacky needing no further adhesive coating
> High compliance adapts to various pressure application environments
> Available in different thickness options


Applications:
> Heat dissipation structure for radiators

> Telecommunication equipment
> Automotive electronics
> Battery packs for electric vehicles

> LED drivers and lamps

Typical Properties of TIF®800Q Series
Color Gray Visual
Construction & Compostion Ceramic filled silicone elastomer ******
Specific Gravity 3.7g/cc ASTM D297
thickness 0.030"(0.75mm)~0.200"(5.00mm) ASTM D374
Hardness (thickness<1.0mm) 45 (Shore 00) ASTM 2240
Continuos Use Temp -40 to 200℃ ******
Dielectric Breakdown Voltage ≥5500 VAC ASTM D149
Dielectric Constant 8.0MHz ASTM D150
Volume Resistivity ≥1.0X10¹²Ohm-meter ASTM D257
Fire rating 94 V0 equivalent UL
Thermal conductivity 13.0W/m-K ASTM D5470

Standard Thicknesses:

 

0.020" (0.51mm) 0.030" (0.76mm)

0.040" (1.02mm) 0.050" (1.27mm) 0.060" (1.52mm)

0.070" (1.78mm) 0.080" (2.03mm) 0.090" (2.29mm)

0.100" (2.54mm) 0.110" (2.79mm) 0.120" (3.05mm)

0.130" (3.30mm) 0.140" (3.56mm) 0.150" (3.81mm)

0.160" (4.06mm) 0.170" (4.32mm) 0.180" (4.57mm)

0.190" (4.83mm) 0.200" (5.08mm)

Consult the factory to alternate thickness.

 

Product Specification
Product Thicknesses: 0.03"(0.75mm)~0.200"(5.00mm) with increments of 0.01(0.25mm)
Product Sizes:16" x 16"(406mm x406mm)
 
Component Codes:
Reinforcement Fabric: FG (Fiberglass).
Coating Options: NS1 (Non-adhesive treatment), DC1(Single-sided hardening).
Adhesive Options: A1/A2(Single-sided/Double-sided adhesive).
Notes:FG (Fiberglass) provides enhanced strength, suitable for materials with thicknesses of 0.01 to 0.02 inch (0.25to 0.5mm).
The TIF series is available in custom shapes and various forms.For other thicknesses or more information, please contact us.
Thermal Interface Material 13W Soft Silicone Thermal Conductive Pad Gpu Cpu Light Thermal Gap Filler 0

Packaging Details & Lead time

 

The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

 

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

 

Company Profile

 

Ziitek Electronic Material and Technology Ltd. is dedicated to developing composite thermal solution and manufacturing superior thermal interface materials for competitive market. Our vast experience allows us to assist our customers best in thermal engineering field.We serve customers with customized products, full product lines and flexible production, which makes us be the best and reliable partner of you. Let's make your design more perfect!

 

FAQ:

Q: Are you trading company or manufacturer ?

A: We are manufacturer in China.

 

Q:How can we get detailed price list?

A:Please offer us detailed information of the product such as Size(length,width,thickness),color,specific packaging requirements and purchasing quantity.

 

Q: What kind of packaging you offer?

A: During the packaging process, preventive measures will be taken by us to assure that the goods are in a good condition during storage and delivery.

Contact Details
Dongguan Ziitek Electronic Materials & Technology Ltd.

Contact Person: Dana Dai

Tel: 18153789196

Send your inquiry directly to us (0 / 3000)