Low Thermal Inpedance 9W/MK Silicone Thermal Conductive Gel For Vehicle Engine Control

Low Thermal Inpedance 9W/MK Silicone Thermal Congductive Gel For Vihicel Enginee Controler

Company Profile

With professional R&D capabilities and many year experiences in thermal interface material industry, Ziitek company own many unique formulations which are our core technologies and advantages. Our goal is to provide quality & competitive products to our customers worldwide aiming for long-term business cooperation.

TIF^®090-11 is a soft silicone-based gap filler pad formulated with thermally conductive fillers and a unique compound that combines excellent themal performance with outstanding softness. Compared to conventional thermal grease,TIF^®090-11 has a higher viscosity, effectively preventing the separation of fllers from the siliconebase. lt also offers more stable bond line control under pressure,enhancing product reliability. TIF^®090-11 is applied similaty to traditional themal paste and is compatible with various commercial equipment,such as dispensing systems or automated production equipment. lt is suitable for a wide range of high-power electronic components and packaging formats, including flip-chip microprocessors (Flip-Chip MPU),PPGA, micro BGA,BGA,DSP chips, circular accelerator chips, and LED lighting modules.

Application
> Heat-sink & frame
> LED backlight module,LED lighting

> High speed hardware driver
> Micro heat pipe
> Vihicel enginee controler

> Telecom industry
> Semiconductor automatic laboratory equipment