Low Thermal Inpedance 9W/MK Silicone Thermal Congductive Gel For Vihicel Enginee Controler
Company Profile
Ziitek company is a high-tech enterprise dedicated to the R&D, manufacture and sales of thermal interface materials (TIMs). With rich experience in this field, we provide the latest, most effective one-step thermal management solutions. Our facility includes advanced production equipment, full test equipment, and fully automatic coating production lines capable of manufacturing high performance thermal products including:
Thermal gap pad
Thermal graphite sheet/film
Thermal double-sided tape
Thermal insulation pad
Thermal grease
Phase change material
Thermal gel
All products are compliant with UL94 V-0, SGS and ROHS standards.
Certifications: ISO9001:2015, ISO14001:2004, IATF16949:2016, IECQ QC 080000:2017, UL
Products desription
TIF®090-11 is a soft silicone gel-based gap filler pad, formulated with a special blend of fillers to provide both excellent thermal conductivity and superior softness. Compared to conventional thermal greases, TIFo90-11 has a higher viscosity, which effectively prevents filler separation from the silicone matrix and reduces filler migration, helping maintain consistent thermal performance. It is applied in a similar manner to thermal grease and is suitable for commercial dispensing or automated equipment. Typical applications include flip-chip microprocessors, PPGAs, micro BGA packages, BGA packages, DSP chips, circular silicon chips, LED lighting, and other high-power electronic components.
Feature
> Thermal conductivity: 9.0W/mK
> Soft, very low compression
> Low thermal inpedance
> Operate automaticly
> Proven long-term reliability
Application
> Heat-sink & frame
> LED backlight module,LED lighting
> High speed hardware driver
> Micro heat pipe
> Vihicel enginee controler
> Telecom industry
> Semiconductor automatic laboratory equipment
| TIF®090-11 Typical Property |
| Property |
Value |
Test method |
| Color |
Gray |
Visual |
| Construction & Composition |
Ceramic filled silicon material |
***** |
| Flow Rate(g/min) |
20 |
Ziitek Test Methbod |
| (30cc syringe/ 2.5mm or rifice/90 psi) |
| Density(g/cm³) |
3.45 |
ASTM D792 |
| Thermal conductivity(W/mK) |
9.0 |
ASTM D5470 |
| Thermal resistance @10Psi(℃-in²/W) |
0.089 |
ASTM D5470 |
| Thermal resistance @50Psi(℃-in²/W) |
0.055 |
ASTM D5470 |
| Recommended Operating temp |
-45~200℃ |
***** |
| Breakdown Voltage(V/mm) |
≥4000 |
ASTM D149 |
| Bond line Thickness (mm) |
0.4 |
Ziitek Test Method |
| Shelf life |
12 months |
**** |
| Flame Rating |
V-0 |
UL 94 |
Packing details
30 cc/pc, 98 pc/box;
300 cc/pc , 6 pc/box
We offer the custom packaged in syringes for automated despensing applications.
Please contact us for confirming.
Independent R&D team
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Certifications:
ISO9001:2015
ISO14001: 2004 IATF16949:2016
IECQ QC 080000:2017
UL
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