CPU Density Conductive Thermal Pad With 1.5mmT Thickness And Ceramic Filled Silicone Elastomer Construction

The TIF^®700QE Series is a high-end compressible thermal pad engineered to meet top-level cooling requirements while maintaining excellent assembly workmanship. Through an innovative material formulation, it achieves an ideal combination of ultra-high thermal conductivity and moderate hardness. This unique performance balance allows it to efficiently handle the cooling challenges posed by ultra-high heat flux densities, while also providing good mechanical strength and compressibility — making it easy to process and install. It offers a reliable interface material solution with both outstanding thermal performance and high reliability for high-power-density electronic devices.

• Good thermal conductivity: 8.0 W/mK
• Naturally tacky, needing no further adhesive coating
• Soft and compressible for low-stress applications
• Available in various thicknesses
• Outstanding thermal performance
• High-tack surface reduces contact resistance
• RoHS compliant
• UL recognized

• Cooling components to the chassis of frame
• High-speed mass storage drives
• Heat sinking housing at LED-lit BLU in LCD
• LED TV and LED-lit lamps
• RDRAM memory modules
• Micro heat pipe thermal solutions
• Semiconductor automated test equipment (ATE)
• CPU
• Display card
• Mainboard / motherboard

• Standard Thickness: 0.010" (0.25 mm) ~ 0.200" (5.00 mm) with increments of 0.010" (0.25 mm)
• Standard Size: 16" × 16" (406 mm × 406 mm)

• Coating Options: NS1 (Non-adhesive treatment), DC1 (Single-sided hardening)
• Adhesive Options: A1 / A2 (Single-sided / Double-sided adhesive)

The TIF® series is available in custom shapes and various forms. For other thicknesses or more information, please contact us.

Ziitek Electronic Material and Technology Ltd. is dedicated to developing composite thermal solutions and manufacturing superior thermal interface materials for the competitive market. Our vast experience allows us to assist our customers best in the thermal engineering field. We serve customers with customized products, full product lines, and flexible production, which makes us the best and most reliable partner for you. Let's make your design more perfect!

• ISO9001:2015
• ISO14001:2004
• IATF16949:2016
• IECQ QC 080000:2017
• UL

1. Our value message is "Do it right the first time, total quality control."
2. Our core competency is thermal conductive interface materials.
3. Competitive advantage products.
4. Confidentiality agreement and business secret contract.
5. Free sample offer.
6. Quality assurance contract.