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CPU Density Conductive Thermal Pad with 1.5mmT Thickness and Ceramic Filled Silicone Elastomer Construction

China Dongguan Ziitek Electronic Materials & Technology Ltd. certification
China Dongguan Ziitek Electronic Materials & Technology Ltd. certification
The Thermal Conductive Pad is looking and working very good. We have no need for other Thermal Conductive Pad now!

—— Peter Goolsby

I had cooperated with Ziitek for 2 years, they provided high quality thermal conductive materials, and delivery in time, recommend their phase change materials

—— Antonello Sau

Good quality, Good service. Your team always give us help and resolving, hope we will be good partner all the time!

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CPU Density Conductive Thermal Pad with 1.5mmT Thickness and Ceramic Filled Silicone Elastomer Construction

CPU Density Conductive Thermal Pad with 1.5mmT Thickness and Ceramic Filled Silicone Elastomer Construction

Large Image :  CPU Density Conductive Thermal Pad with 1.5mmT Thickness and Ceramic Filled Silicone Elastomer Construction

Product Details:
Place of Origin: China
Brand Name: ZIITEK
Certification: UL and RoHs
Model Number: TIF760QE
Payment & Shipping Terms:
Minimum Order Quantity: 1000pcs
Price: negotiation
Packaging Details: 1000pcs/bag
Delivery Time: 3-5work days
Supply Ability: 10000/day
Detailed Product Description
Products Name: High-Density Conductive Thermal Pad For CPU Thermal Conductivity& Compostion: 8.0 W/m-K
Thickness: 1.5mmT Specific Gravity: 3.5g/cc
Continuos Use Temp: -45℃ To 200℃ Hardness: 35±10 Shore 00
Construction: Ceramic Filled Silicone Elastomer Keywords: Thermal Pad
Color: Gray
Highlight:

CPU Density Thermal Pad

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Ceramic Filled Silicone Elastomer Thermal Pad

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1.5mmT Thickness Thermal Pad

High-Density conductive thermal pad For CPU

 

The TIF760QE is recommended for applications that require a minimum amount of pressure on components. The viscoelastic nature of the material also gives excellent low-stress vibration dampening and shock absorbing characteristics. Ziitek TIF760QE is an electrically isolating material, which allows its use in applications requiring isolation between heat sinks and high-voltage, bare-leaded devices.


Features:


> Good thermal conductive:8.0 W/mK 

> Naturally tacky needing no further adhesive coating 
> Soft and Compressible for low stress applications
> Available in varies thickness

> Outstanding thermal performance
> High tack surface reduces contact resistance
> RoHS compliant
> UL recognized

 


Applications:

 

> Cooling components to the chassis of frame
> High speed mass storage drives
> Heat Sinking Housing at LED-lit BLU in LCD
> LED TV and LED-lit lamps
> RDRAM memory modules
> Micro heat pipe thermal solutions
> Semiconductor automated test equipment (ATE)
> CPU
> Display card
> Mainboard/mother board

 

Typical Properties of TIF760QE Series
Color Gray Visual
Construction & Compostion Ceramic filled silicone elastomer ******
Specific Gravity 3.5g/cc ASTM D297
thickness 1.5mm ASTM D374
Hardness 35±10 (Shore 00) ASTM 2240
Continuos Use Temp -45 to 200℃ ******
Dielectric Breakdown Voltage >5500 VAC ASTM D149
Dielectric Constant 5.5MHz ASTM D150
Volume Resistivity 1.0X10¹²Ohm-meter ASTM D257
Fire rating 94 V0 equivalent UL
Thermal conductivity 8.0W/m-K ASTM D5470

Standard Thicknesses:

 

0.020" (0.51mm) 0.030" (0.76mm)

0.040" (1.02mm) 0.050" (1.27mm) 0.060" (1.52mm)

0.070" (1.78mm) 0.080" (2.03mm) 0.090" (2.29mm)

0.100" (2.54mm) 0.110" (2.79mm) 0.120" (3.05mm)

0.130" (3.30mm) 0.140" (3.56mm) 0.150" (3.81mm)

0.160" (4.06mm) 0.170" (4.32mm) 0.180" (4.57mm)

0.190" (4.83mm) 0.200" (5.08mm)

Consult the factory to alternate thickness.


Standard Sheets Sizes:    
8" x 16"(203mm x 406mm) 
TIF™ series Individual die cut shapes can be supplied. 
CPU Density Conductive Thermal Pad with 1.5mmT Thickness and Ceramic Filled Silicone Elastomer Construction 0
Company Profile

 

Ziitek Electronic Material and Technology Ltd. is dedicated to developing composite thermal solution and manufacturing superior thermal interface materials for competitive market. Our vast experience allows us to assist our customers best in thermal engineering field.We serve customers with customized products, full product lines and flexible production, which makes us be the best and reliable partner of you. Let's make your design more perfect!

 

Certifications:

ISO9001:2015

ISO14001: 2004 IATF16949:2016

IECQ QC 080000:2017

UL

 

Why Choose us ?

 

1.Our value message is'' Do it right the First time, total quality control''.

2.Our core competencies is thermal conductive interface materials

3.Competitive advantage products.

4.Condidentiality agreement Bussiness Secrect Contract

5.Free sample offer

6.Quality assurance contract.

Contact Details
Dongguan Ziitek Electronic Materials & Technology Ltd.

Contact Person: Dana Dai

Tel: 18153789196

Send your inquiry directly to us (0 / 3000)