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Product Details:
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Products Name: | Factory High Performance Cooling Thermal Pad Soft Silicone Thermally Conductive Gap Filler Pad For Electronic Components | Thickness: | Available In Varies Thicknes |
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Keywords: | Thermal Gap Pad | Hardness: | 80±5 Shore 00 |
Construction & Compostion: | Ceramic Filled Silicone Rubber | Specific Gravity: | 3.15 G/cc |
Flame Rating: | 94 -V0 | Thermal Conductivity: | 4.0 W/mK |
Highlight: | Electronic Components Thermal Pad,Silicone Thermally Conductive Gap Filler Pad,Soft Silicone Thermal Pad |
Factory High Performance Cooling Thermal Pad Soft Silicone Thermally Conductive Gap Filler Pad for Electronic Components
TIF™100-40-11U Series thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base.Their flexibility and elasticity make them suited to coat very uneven surfaces. Heat can transmit to the metal housing or dissipation plate from the heating elements or even the entire PCB, which effecitly enhances the efficiency and life-time of
the heat-generating electronic components.
TIF100-40-11U Datasheet-REV02.pdf
Features:
> Good thermal conductive: 4.0W/mK
> RoHS compliant
> UL recognized
> Naturally tacky needing no furtheradhesive coating
> Soft and Compressible for low stress applications
> Available in varies thickness
Applications:
> Micro heat pipe thermal solutions
> Automotive engine control units
> Telecommunication hardware
> Handheld portable electronics
> Semiconductor automated test equipment (ATE)
> CPU
Typical Properties of TIF™100-40-11USeries | ||
Color | Gray | Visual |
Construction & Compostion | Ceramic filled silicone elastomer | ****** |
Specific gravity | 3.15g/cc | ASTM D297 |
Thickness range | 0.020"(0.5mm)-0.200"(5.0mm) | ****** |
Hardness | 27Shore 00 | ASTM 2240 |
Outgasing (TML) | 0.35% | ASTM E595 |
Continuos Use Temp | -40 to 160℃ | ****** |
Dielectric Breakdown Voltage | >5500 VAC | ASTM D149 |
Dielectric Constant | 4.0 MHz | ASTM D150 |
Volume Resistivity(Ohm-cm) | 1.0X1012 | ASTM D257 |
Fire rating | 94 V0 | UL E331100 |
Thermal conductivity | 3.0 W/m-K | ASTM D5470 |
Packaging Details & Lead time
The packaging of thermal pad
1.with PET film or foam-for protection
2. use Paper Card To Separate Each Layer
3. export carton inside and outside
4. meet with customers' requirement-customized
Lead Time :Quantity(Pieces):5000
Est. Time(days): To be negotiated
Company Profile
Ziitek Electronic Material and Technology Ltd. provides product solutions to equipment product which generates too much heat affecting its high performance when using. Plus thermal products can control and manage heat to keep it cool to some extent.
Our services
Online-service : 12 hours , Inquiry reply within fastest.
Working time: 8:00am - 5:30pm, Monday to Saturday (UTC+8).
Well-trained & experienced staff are to answer all your inquiries in English of course.
Standard Export Carton Or Marked With Customer's Information Or Customized.
Provide free samples
After-service: Even our products have passed strict inspection, if you find the parts can not work well, please show us the proof.
we will help you to deal with it and give you satisfactory solution.
Contact Person: Dana Dai
Tel: 18153789196