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Cooling Thermal Pad Soft Silicone Thermally Conductive Gap Filler Pad for Electronic Components 80±5 Shore 00

China Dongguan Ziitek Electronic Materials & Technology Ltd. certification
China Dongguan Ziitek Electronic Materials & Technology Ltd. certification
The Thermal Conductive Pad is looking and working very good. We have no need for other Thermal Conductive Pad now!

—— Peter Goolsby

I had cooperated with Ziitek for 2 years, they provided high quality thermal conductive materials, and delivery in time, recommend their phase change materials

—— Antonello Sau

Good quality, Good service. Your team always give us help and resolving, hope we will be good partner all the time!

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Cooling Thermal Pad Soft Silicone Thermally Conductive Gap Filler Pad for Electronic Components 80±5 Shore 00

Cooling Thermal Pad Soft Silicone Thermally Conductive Gap Filler Pad for Electronic Components 80±5 Shore 00

Large Image :  Cooling Thermal Pad Soft Silicone Thermally Conductive Gap Filler Pad for Electronic Components 80±5 Shore 00

Product Details:
Place of Origin: China
Brand Name: ZIITEK
Certification: UL and RoHs
Model Number: TIF100-40-11U
Payment & Shipping Terms:
Minimum Order Quantity: 1000pcs
Price: negotiation
Packaging Details: 1000pcs/bag
Delivery Time: 3-5work days
Supply Ability: 10000/day
Detailed Product Description
Products Name: Factory High Performance Cooling Thermal Pad Soft Silicone Thermally Conductive Gap Filler Pad For Electronic Components Thickness: Available In Varies Thicknes
Keywords: Thermal Gap Pad Hardness: 80±5 Shore 00
Construction & Compostion: Ceramic Filled Silicone Rubber Specific Gravity: 3.15 G/cc
Flame Rating: 94 -V0 Thermal Conductivity: 4.0 W/mK
Highlight:

Electronic Components Thermal Pad

,

Silicone Thermally Conductive Gap Filler Pad

,

Soft Silicone Thermal Pad

Factory High Performance Cooling Thermal Pad Soft Silicone Thermally Conductive Gap Filler Pad for Electronic Components

 

TIF™100-40-11U Series thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base.Their flexibility and elasticity make them suited to coat very uneven surfaces. Heat can transmit to the metal housing or dissipation plate from the heating elements or even the entire PCB, which effecitly enhances the efficiency and life-time of

the heat-generating electronic components.

 

TIF100-40-11U Datasheet-REV02.pdf

 

Cooling Thermal Pad Soft Silicone Thermally Conductive Gap Filler Pad for Electronic Components 80±5 Shore 00 0


Features:


>  Good thermal conductive: 4.0W/mK 

>  RoHS compliant
>  UL recognized
>  Naturally tacky needing no furtheradhesive coating
>  Soft and Compressible for low stress applications
>  Available in varies thickness

 


Applications:

 

> Micro heat pipe thermal solutions
> Automotive engine control units
> Telecommunication hardware
> Handheld portable electronics
> Semiconductor automated test equipment (ATE)
> CPU

 

Typical Properties of TIF™100-40-11USeries
Color Gray Visual
Construction & Compostion Ceramic filled silicone elastomer ******
Specific gravity 3.15g/cc ASTM D297
Thickness range 0.020"(0.5mm)-0.200"(5.0mm) ******
Hardness 27Shore 00 ASTM 2240
Outgasing (TML) 0.35% ASTM E595
Continuos Use Temp -40 to 160℃ ******
Dielectric Breakdown Voltage >5500 VAC ASTM D149
Dielectric Constant 4.0 MHz ASTM D150
Volume Resistivity(Ohm-cm) 1.0X1012 ASTM D257
Fire rating 94 V0 UL E331100
Thermal conductivity 3.0 W/m-K ASTM D5470

 

 
Cooling Thermal Pad Soft Silicone Thermally Conductive Gap Filler Pad for Electronic Components 80±5 Shore 00 1
 

Packaging Details & Lead time

 

The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

 

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

 

Company Profile

 

Ziitek Electronic Material and Technology Ltd. provides product solutions to equipment product which generates too much heat affecting its high performance when using. Plus thermal products can control and manage heat to keep it cool to some extent.

 

Cooling Thermal Pad Soft Silicone Thermally Conductive Gap Filler Pad for Electronic Components 80±5 Shore 00 2

 

Our services

 

Online-service : 12 hours , Inquiry reply within fastest.


Working time: 8:00am - 5:30pm, Monday to Saturday (UTC+8).

Well-trained & experienced staff are to answer all your inquiries in English of course.

Standard Export Carton Or Marked With Customer's Information Or Customized.

Provide free samples

 

After-service: Even our products have passed strict inspection, if you find the parts can not work well, please show us the proof.

we will help you to deal with it and give you satisfactory solution.

Contact Details
Dongguan Ziitek Electronic Materials & Technology Ltd.

Contact Person: Dana Dai

Tel: 18153789196

Send your inquiry directly to us (0 / 3000)