Hard Drive CPU GPU Thermal Gap Filler 1.W 1.5mm 2mm 3mm for Heat Capacity 1 l /g-K

Manufacturer Supplier Custom Laptop 1.W 1mm 1.5mm 2mm 3mm Hard Drive Cpu GPU Thermal Gap Filler

The TIF100-16-38UF is a silicone based, thermally conductive gap pad. Its unreinforced construction allows additional compliancy. This product has low hardness is conformable and is electrically isolating. The low modulus characteristic of the product offers optimal thermal performance with the ease of handling.

TIF100-16-38UF-Series-Datasheet-rev3.pdf

Features:

>  Good thermal conductive: 1.6 W/mK 
>  Moldability for complex parts
> Soft and compressible for low stress applications
> Naturally tacky needing no further adhesive coating

Applications:

> Cooling components to the chassis of frame
> High speed mass storage drives
> Heat Sinking Housing at LED-lit BLU in LCD
> LED TV and LED-lit lamps
> RDRAM memory modules
> Micro heat pipe thermal solutions

Typical Properties of TIF100-16-38UF Series
Color	Pink	Visual	Composite Thickness	hermalImpedance @10psi (℃-in²/W)
Construction & Compostion	Ceramic filled silicone rubber	***	10mils / 0.254 mm	0.36
			20mils / 0.508 mm	0.41
Specific Gravity	2.1 g/cc	ASTM D297	30mils / 0.762 mm	0.47
			40mils / 1.016 mm	0.52
Heat Capacity	1 l /g-K	ASTM C351	50mils / 1.270 mm	0.58
			60mils / 1.524 mm	0.65
Hardness	65 Shore 00	ASTM 2240	70mils / 1.778 mm	0.72
			80mils / 2.032 mm	0.79
Tensile Strength	45 psi	ASTM D412	90mils / 2.286 mm	0.87
			100mils / 2.540 mm	0.94
Continuos Use Temp	-40 to 160℃	***	110mils / 2.794 mm	1.01
			120mils / 3.048 mm	1.09
Dielectric Breakdown Voltage	>5500 VAC	ASTM D149	130mils / 3.302mm	1.17
			140mils / 3.556 mm	1.24
Dielectric Constant	5.5 MHz	ASTM D150	150mils / 3.810 mm	1.34
			160mils / 4.064 mm	1.42
Volume Resistivity	1.0X10¹² Ohm-meter	ASTM D257	170mils / 4.318 mm	1.50
			180mils / 4.572 mm	1.60
Fire rating	94 V0	equivalent UL	190mils / 4.826 mm	1.68
			200mils / 5.080 mm	1.77
Thermal conductivity	1.6W/m-K	ASTM D5470	Visua l/ ASTM D751	ASTM D5470