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Product Details:
Payment & Shipping Terms:
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| Heat Capacity: | 1 L/g-K | Thermal Conductivity: | 1.8 W/m-K |
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| Hardness: | 18 Shore 00 | Density: | 2.5 G/cc |
| Continuos Use Temp: | -40 To 160℃ | Flame Rating: | 94 V0 |
| High Light: | 1.5mmT Thermal Gap Pad,Thermal Gap Pad UL Recognized,thermal conductivity pad 18 Shore 00 |
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UL Recognized 1.5mmT Thermal Gap Pad, 2.5g/cc, 18 Shore 00 for Audio Video Components
The TIF160-18-01US use a special process, with silicone as the base material, adding thermal conductive powder and flame retardant together to make the mixture to become thermal interface material. This is effective in lower the thermal resistance between the heat source and the heat sink.
TIF100-18-01US-Specification-sheet.pdf
Features
> Good thermal conductive: 1.8 W/mK
>Thickness:1.5mmT
>hardness:18 shore00
>Colour: black
>High durability
>Moldability for complex parts
>Soft and compressible for low stress applications
Applications
>notebook
>power supply
>Heat pipe thermal solutions
>Memory Modules
>CD-Rom, DVD-Rom cooling
>LED Power Supply
>LED Controller
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Typical Properties of TIF160-18-01US Series
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Color
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black
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Visual
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Composite Thickness
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Thermal Impedance@10psi
(℃-in²/W) |
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Construction &
Compostion |
Ceramic filled silicone rubber
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***
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10mils / 0.254 mm
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0.16
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20mils / 0.508 mm
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0.20
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Specific gravity |
2.5g/cc
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ASTM D297
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30mils / 0.762 mm
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0.31
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40mils / 1.016 mm
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0.36
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| Thickness |
1.5mmT
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***
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50mils / 1.270 mm
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0.42
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60mils / 1.524 mm
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0.48
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Hardness
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18 Shore 00
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ASTM 2240
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70mils / 1.778 mm
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0.53
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80mils / 2.032 mm
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0.63
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Outgassing(TML)
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0.45%
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ASTM E595
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90mils / 2.286 mm
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0.73
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100mils / 2.540 mm
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0.81
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Continuos Use Temp
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-40 to 160℃
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110mils / 2.794 mm
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0.86
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120mils / 3.048 mm
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0.93
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Dielectric Breakdown Voltage
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>5500 VAC
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ASTM D149
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130mils / 3.302mm
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1.00
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140mils /3.556 mm
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1.08
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Dielectric Constant
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4.5 MHz
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ASTM D150
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150mils / 3.810 mm
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1.13
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160mils / 4.064 mm
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1.20
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Volume Resistivity
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1.0X1012
Ohm-cm |
ASTM D257
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170mils / 4.318 mm
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1.24
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180mils / 4.572 mm
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1.32
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Fire rating
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94 V0
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equivalent
UL |
190mils / 4.826 mm
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1.41
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200mils / 5.080 mm
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1.52
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Thermal conductivity
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1.8 W/m-K
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ASTM D5470
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Visua l/ ASTM D751
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ASTM D5470
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Company Profile
With a wide range, good quality, reasonable prices and stylish designs, Ziitek thermal conductive interface materials are extensively used in Mainboards, VGA cards, Notebooks, DDR&DDR2 products, CD-ROM ,LCD TV, PDP products, Server Power products, Down lamps, Spotlights, Street lamps, Daylight lamps, LED Server Power products and others.
Packaging Details & Lead time
The packaging of thermal pad
1.with PET film or foam-for protection
2. use Paper Card To Separate Each Layer
3. export carton inside and outside
4. meet with customers' requirement-customized
Lead Time :Quantity(Pieces):5000
Est. Time(days): To be negotiated
6.Quality assurance contract
Standard Thicknesses:
0.020" (0.51mm) 0.030" (0.76mm)
0.040" (1.02mm) 0.050" (1.27mm) 0.060" (1.52mm)
0.070" (1.78mm) 0.080" (2.03mm) 0.090" (2.29mm)
0.100" (2.54mm) 0.110" (2.79mm) 0.120" (3.05mm)
0.130" (3.30mm) 0.140" (3.56mm) 0.150" (3.81mm)
0.160" (4.06mm) 0.170" (4.32mm) 0.180" (4.57mm)
0.190" (4.83mm) 0.200" (5.08mm)
Consult the factory to alternate thickness.
FAQ
Q: Do you offer free samples ?
A: Yes, we are willing to offer free sample.
Q: What's the thermal conductivity test method given on the data sheet ?
A: All the data in the sheet are actual tested.Hot Disk and ASTM D5470 are utilized to test the thermal conductivity.
Contact Person: Miss. Dana
Tel: 18153789196
