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Thermal Conductive Gap Pad 20±5 Shore 00 3.0 W/M-K For Mainboard/Mother Board

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The Thermal Conductive Pad is looking and working very good. We have no need for other Thermal Conductive Pad now!

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Thermal Conductive Gap Pad 20±5 Shore 00 3.0 W/M-K For Mainboard/Mother Board

Large Image : Thermal Conductive Gap Pad 20±5 Shore 00 3.0 W/M-K For Mainboard/Mother Board

Product Details:

Place of Origin:	China
Brand Name:	ZIITEK
Certification:	UL and RoHs
Model Number:	TIF1160-30-11US

Payment & Shipping Terms:

Minimum Order Quantity:	1000pcs
Price:	negotiation
Packaging Details:	1000pcs/bag
Delivery Time:	3-5 work days
Supply Ability:	100000pcs/day

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Detailed Product Description

Heat Capacity:	1 L/g-K	Thermal Conductivity:	3.0 W/m-K
Hardness:	20±5 Shore 00	Density:	3.0 G/cc
Continuos Use Temp:	-40 To 160℃	Flame Rating:	94 V0
Highlight:	20±5 Shore thermal conductivity pad , Mainboard Thermal Conductive Gap Pad , Thermal Conductive Gap Pad 3.0 W/M-K

High cost-effective thermal conductive gap pad 20±5 Shore 00,3.0 W/m-K for mainboard/mother board

The TIF1160-30-11US is an extremely soft gap filling material rated at a thermal conductivity of 3.0 W/m-K. It is specially formulated for high performance applications requiring low assembly stress. The material offers exceptional thermal performance at low pressures due to the unique filler package and ultra low modulus resin formulation. TIF1160-30-11US is highly conformal to rough or irregular surfaces, allowing excellent wet-out at the interface. Protective liners are supplied on both sides allowing for ease of use.

Features

> Good thermal conductive: 3.0 W/mK

>Thickness:4.0mmT

>hardness:20±5 shore00

>Colour: gray

>Fiberglass reinforced for puncture, shear and tear resistance

>Easy release construction

>Electrically isolating

Applications

>Memory Modules

>Mass storage devices

>Automotive electronics

>Set top boxes

>Monitoring the Power Box

>AD-DC Power Adapters

>Rainproof LED Power

Typical Properties of TIF1160-30-11US Series
Color	gray	Visual	Composite Thickness	Thermal Impedance@10psi (℃-in²/W)
Construction & Compostion	Ceramic filled silicone rubber	***	10mils / 0.254 mm	0.16
			20mils / 0.508 mm	0.20
Specific gravity	3.0g/cc	ASTM D297	30mils / 0.762 mm	0.31
			40mils / 1.016 mm	0.36
Thickness	4.0mmT	***	50mils / 1.270 mm	0.42
			60mils / 1.524 mm	0.48
Hardness	20±5 Shore 00	ASTM 2240	70mils / 1.778 mm	0.53
			80mils / 2.032 mm	0.63
Outgassing(TML)	0.35%	ASTM E595	90mils / 2.286 mm	0.73
			100mils / 2.540 mm	0.81
Continuos Use Temp	-40 to 160℃	***	110mils / 2.794 mm	0.86
			120mils / 3.048 mm	0.93
Dielectric Breakdown Voltage	>5500 VAC	ASTM D149	130mils / 3.302mm	1.00
			140mils /3.556 mm	1.08
Dielectric Constant	4.0 MHz	ASTM D150	150mils / 3.810 mm	1.13
			160mils / 4.064 mm	1.20
Volume Resistivity	1.0X10¹² Ohm-cm	ASTM D257	170mils / 4.318 mm	1.24
			180mils / 4.572 mm	1.32
Fire rating	94 V0	equivalent UL	190mils / 4.826 mm	1.41
			200mils / 5.080 mm	1.52
Thermal conductivity	3.0 W/m-K	ASTM D5470	Visua l/ ASTM D751	ASTM D5470

Company Profile

Ziitek company is a high-tech enterprise which dedicated to the R&D, manufacture and sales of the thermal interface materials (TIMs). We have rich experiences in this field which can support you the latest, most effective and one -step thermal management solutions. We have many advanced production equipments,full test equipments and fully automatic coating production lines which can support the production for high performance thermal silicone pad, thermal graphite sheet/ film, thermal double-sided tape, thermal insulation pad, thermal ceramic pad, phase change material, thermal grease etc. UL94 V-0, SGS and ROHS are compliant.

Peressure Sensitive Adhesive:

Request adhesive on one side with "A1" suffix.

Request adhesive on double side with "A2" suffix.

Reinforcement: TIF™ series sheets type can add with fiberglass reinforced.

FAQ

Q: Do you provide samples ? is it free or extra cost?

A: Yes, we could offer samples free of charge

Q:Is there promotion price for big buyer?

A:Yes, we do have promotion price for big buyer. Please send us email for inquiry.

Tag:

Contact Person: Dana Dai

Tel: 18153789196

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Thermal Conductive Gap Pad 20±5 Shore 00 3.0 W/M-K For Mainboard/Mother Board

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