Product Details:
Payment & Shipping Terms:
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Heat Capacity: | 1 L/g-K | Thermal Conductivity: | 3.0 W/m-K |
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Hardness: | 20±5 Shore 00 | Density: | 3.0 G/cc |
Continuos Use Temp: | -40 To 160℃ | Flame Rating: | 94 V0 |
Highlight: | Soft Thermal Conductive Gap Pad,Compressible Thermal Conductive Gap Pad,Compressible thermal conductivity pad |
3.0 W/mK ,2.0mmT Soft and compressible thermal conductive gap pad for IT infrastructure
The TIF180-30-11US is a highly compliant Gap Pad material that is ideal for fragile component leads. The material is fiberglass reinforced for improved puncture resistance and handling Ziitek TIF180-30-11US maintains a conformable, yet elastic nature that provides excellent interfacing and wet-out characteristics, even to surfaces with high roughness or uneven topography. Ziitek TIF180-30-11US features an inherent tack on both sides of the material, eliminating the need for thermally impeding adhesive layers.Options and ConfigurationsStandard sheet size - 8" x 16" or custom configurationStandard thickness available - 0.020", 0.040", 0.060", 0.080", 0.100", 0.125", 0.160", 0.200", 0.250"Custom made configurations available upon request
TIF100-30-11US-Series-Datasheet-.pdf
Features
> Good thermal conductive: 3.0 W/mK
>Thickness:2.0mmT
>hardness:20±5 shore00
>Colour: gray
>Fiberglass reinforced for puncture, shear and tear resistance
>Easy release construction
Applications
>IT infrastructure
>GPS navigation and other portable devices
>CD-Rom, DVD-Rom cooling
>notebook
>power supply
>Heat pipe thermal solutions
Typical Properties of TIF180-30-11US Series
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Color
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gray
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Visual
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Composite Thickness
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Thermal Impedance@10psi
(℃-in²/W) |
Construction &
Compostion |
Ceramic filled silicone rubber
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***
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10mils / 0.254 mm
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0.16
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20mils / 0.508 mm
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0.20
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Specific gravity |
3.0g/cc
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ASTM D297
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30mils / 0.762 mm
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0.31
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40mils / 1.016 mm
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0.36
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Thickness |
2.0mmT
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***
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50mils / 1.270 mm
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0.42
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60mils / 1.524 mm
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0.48
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Hardness
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20±5 Shore 00
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ASTM 2240
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70mils / 1.778 mm
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0.53
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80mils / 2.032 mm
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0.63
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Outgassing(TML)
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0.35%
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ASTM E595
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90mils / 2.286 mm
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0.73
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100mils / 2.540 mm
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0.81
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Continuos Use Temp
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-40 to 160℃
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***
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110mils / 2.794 mm
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0.86
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120mils / 3.048 mm
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0.93
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Dielectric Breakdown Voltage
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>5500 VAC
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ASTM D149
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130mils / 3.302mm
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1.00
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140mils /3.556 mm
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1.08
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Dielectric Constant
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4.0 MHz
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ASTM D150
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150mils / 3.810 mm
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1.13
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160mils / 4.064 mm
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1.20
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Volume Resistivity
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1.0X1012
Ohm-cm |
ASTM D257
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170mils / 4.318 mm
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1.24
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180mils / 4.572 mm
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1.32
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Fire rating
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94 V0
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equivalent
UL |
190mils / 4.826 mm
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1.41
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200mils / 5.080 mm
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1.52
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Thermal conductivity
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3.0 W/m-K
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ASTM D5470
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Visua l/ ASTM D751
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ASTM D5470
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Company Profile
Ziitek company is a manufacturer of thermal conductive gap fillers, low melting point thermal interface materials, thermal conductive insulators, thermally conductive tapes, electrically & thermally conductive Interface pads and thermal grease,Thermal Conductive plastic,Silicone Rubber,Silicone Foams,Phase Changing Materials products, with well-equipped testing equipment and strong technical force.
Certifications:
ISO9001:2015
ISO14001: 2004 IATF16949:2016
IECQ QC 080000:2017
UL
Standard Thicknesses:
0.020" (0.51mm) 0.030" (0.76mm)
0.040" (1.02mm) 0.050" (1.27mm) 0.060" (1.52mm)
0.070" (1.78mm) 0.080" (2.03mm) 0.090" (2.29mm)
0.100" (2.54mm) 0.110" (2.79mm) 0.120" (3.05mm)
0.130" (3.30mm) 0.140" (3.56mm) 0.150" (3.81mm)
0.160" (4.06mm) 0.170" (4.32mm) 0.180" (4.57mm)
0.190" (4.83mm) 0.200" (5.08mm)
Consult the factory to alternate thickness.
FAQ
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Contact Person: Dana Dai
Tel: 18153789196