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Ultra Soft 1.0mmT Thermal Gap Filler For Telecommunication 3.0 W/MK 20 Shore 00

China Dongguan Ziitek Electronic Materials & Technology Ltd. certification
China Dongguan Ziitek Electronic Materials & Technology Ltd. certification
The Thermal Conductive Pad is looking and working very good. We have no need for other Thermal Conductive Pad now!

—— Peter Goolsby

I had cooperated with Ziitek for 2 years, they provided high quality thermal conductive materials, and delivery in time, recommend their phase change materials

—— Antonello Sau

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Ultra Soft 1.0mmT Thermal Gap Filler For Telecommunication 3.0 W/MK 20 Shore 00

Ultra Soft 1.0mmT Thermal Gap Filler For Telecommunication 3.0 W/MK 20 Shore 00
Ultra Soft 1.0mmT Thermal Gap Filler For Telecommunication 3.0 W/MK 20 Shore 00
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Large Image :  Ultra Soft 1.0mmT Thermal Gap Filler For Telecommunication 3.0 W/MK 20 Shore 00

Product Details:
Place of Origin: China
Brand Name: ZIITEK
Certification: UL and RoHs
Model Number: TIF540-30-11US
Payment & Shipping Terms:
Minimum Order Quantity: 1000pcs
Price: negotiation
Packaging Details: 1000pcs/bag
Delivery Time: 3-5work days
Supply Ability: 10000/day
Detailed Product Description
Hardness: 20 Shore 00 Specific Gravity: 2.9 G/cc
Dielectric Breakdown Voltage: >5000 VAC Fire Rating: 94-V0
Construction & Compostion: Ceramic Filled Silicone Rubber Tensile Strength: 40 Psi
High Light:

1.0mmT Thermal Gap Filler

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Ultra Soft Gap Filler

,

Thermal Gap Filler 20 Shore 00

1.0mmT professional factory thermal gap filler For telecommunication hardware 3.0 W/mK ultra soft,20 Shore 00
 
 
  The TIF540-30-11US Series is a highly compliant Gap Pad material that is ideal for fragile component leads. The material is fiberglass reinforced for improved puncture resistance and handling TIF540-30-11US maintains a conformable, yet elastic nature that provides excellent interfacing and wet-out characteristics, even to surfaces with high roughness or uneven topography. TIF540-30-11US features an inherent tack on both sides of the material, eliminating the need for thermally impeding adhesive layers.Options and ConfigurationsStandard sheet size - 8" x 16" or custom configurationStandard thickness available - 0.020", 0.040", 0.060", 0.080", 0.100", 0.125", 0.160", 0.200", 0.250"Custom made configurations available upon request

 

TIF500-30-11US Datasheet-REV02.pdf
 
Features:
> Good thermal conductive: 3.0 W/mK 

>Thickness:1.0mmT

>Naturally tacky needing no further adhesive coating

>Broad range of hardnesses available

>UL recognized

>RoHS compliant

 

Applications:

>Telecommunication hardware

>Handheld portable electronics

>Memory Modules

>Mass storage devices

>GPS navigation and other portable devices

>CD-Rom, DVD-Rom cooling
 
 
Typical Properties of TIF540-30-11US Series
Color

Gray

Visual Composite Thickness  hermalImpedance
@10psi
(℃-in²/W)
Construction &
Compostion
Ceramic filled silicone rubber
*** 10mils / 0.254 mm

0.55

20mils / 0.508 mm

0.82

Specific Gravity

2.9 g/cc

ASTM D297

30mils / 0.762 mm

1.01

40mils / 1.016 mm

1.11

Thickness

1.0mmT

***

50mils / 1.270 mm

1.27

60mils / 1.524 mm

1.45

Hardness
20 (Shore 00) ASTM 2240

70mils / 1.778 mm

1.61

80mils / 2.032 mm

1.77 

Tensile Strength 

40 psi

ASTM D412

90mils / 2.286 mm

1.91 

100mils / 2.540 mm

2.05

Continuos Use Temp
-40 to 160℃

***

110mils / 2.794 mm

2.16   

120mils / 3.048 mm

2.29   

Dielectric Breakdown Voltage
>5500 VAC ASTM D149

130mils / 3.302mm

2.44

140mils / 3.556 mm

2.56

Dielectric Constant
4.0 MHz ASTM D150

150mils / 3.810 mm

2.67

160mils / 4.064 mm

2.77

Volume Resistivity
1.0X1012
Ohm-meter
ASTM D257

170mils / 4.318 mm

2.89

180mils / 4.572 mm

2.98

Fire rating
94 V0

equivalent UL

190mils / 4.826 mm

3.05 

200mils / 5.080 mm

3.14

 
Thermal conductivity 
 3.0W/m-K ASTM D5470 Visua l/ ASTM D751 ASTM D5470
 
 

Packaging Details & Lead time

 

The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

 

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

Ultra Soft 1.0mmT Thermal Gap Filler For Telecommunication 3.0 W/MK 20 Shore 00 0
 

Why Choose us ?

 

1.Our value message is'' Do it right the First time, total quality control''.

2.Our core competencies is thermal conductive interface materials

3.Competitive advantage products.

4.Condidentiality agreement Bussiness Secrect Contract

5.Free sample offer

6.Quality assurance contract

 

Certifications:

ISO9001:2015

ISO14001: 2004 IATF16949:2016

IECQ QC 080000:2017

UL

 

Contact Details
Dongguan Ziitek Electronic Materials & Technology Ltd.

Contact Person: Miss. Dana

Tel: 18153789196

Send your inquiry directly to us (0 / 3000)