|
Product Details:
Payment & Shipping Terms:
|
| Name: | Thermal Gel For Cooling | Specific Gravity: | 2.3 G/cc |
|---|---|---|---|
| Color: | Green | Continuous Use Temperature: | -45~200℃ |
| Good Thermal Conductive: | 1.5 W/mK | Dielectic Breakdown: | 200 V/mil |
| Flame Rating: | 94V0 | Keywords: | Thermal Gel |
| High Light: | thermally conductive putty,electrically conductive putty |
||
Thermal Gel For Cooling
TIF015-07 is a soft silicone putty thermal gap filler,which blend with exclusive formula,that offer superior thermal performance, and compressibility. Due to TIF015-07 is made by high vicosity silicon oil ,that can prevent thermal formula seprate from it. Besides ,compared with traditionally thermal pad, it can control bonded shifiting issue much better.
TIF015-07 operation mold is simliar as grease ,such as silkprint and screen print or automatic injected facility. TIF015-07 can be applied on chip micro processor,PPGAs,Micro BGA package,BGA package,DSP chip,LED lighting and other high power electric component .
TIF015-07-Specification-sheet.-pdf.pdf
Application
> Heat-sink & frame
> LED backlight module,LED lighting
> High speed hardware driver
> Micro heat pipe
> Vihicel enginee controler
> Telecom industry,Semiconductor
Feature
> Thermal conductivity: 1.5W/mK
> Soft, very low compression
> Low thermal inpedance
> Operate automaticly
| TIFTM015-07 Property | |||
| Color | Green | Visual | |
| Construction & Composition | Ceramic filled silicon material | ********** | |
| Viscosity | 4000,000cps | GB/T 10247 | |
| Specific Gravity | 2.3 g/cc | ASTM D297 | |
| Thermal conductivity | 1.5 W/mK | ISO 22007-2 | |
| Thermal diffusivity | 0.847 mm2/s | ISO 22007-2 | |
| Specific heat capacity | 2.2 MJ/m3K | ISO 22007-2 | |
| Continuous Use Temperature | -45 ~200°C | ****** | |
| Dielectric breakdown strength | 200 V/mil | ASTM D149 | |
| Flame Rating | 94V0 | E331100 | |
| Outgassing,%TML | 0.90% | ASTM E595 | |
Package :
30 cc/pc, 98 pc/box; 300 cc/pc 6 pc/box
We offer the custom packaged in syringes for automated despensing applications.
Please contact us for confirming.
Company Profile
Ziitek company is a manufacturer of thermal conductive gap fillers, low melting point thermal interface materials, thermal conductive insulators, thermally conductive tapes, electrically & thermally conductive Interface pads and thermal grease,Thermal Conductive plastic,Silicone Rubber,Silicone Foams,Phase Changing Materials products, with well-equipped testing equipment and strong technical force.
Why Choose us ?
1.Our value message is'' Do it right the First time, total quality control''.
2.Our core competencies is thermal conductive interface materials
3.Competitive advantage products.
4.Condidentiality agreement Bussiness Secrect Contract
5.Free sample offer
6.Quality assurance contract
Contact Person: Miss. Dana
Tel: 18153789196
