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Stable chemical performance light 3W thermal conductive gap filler pad TIF100-30-23E for cpu

China Dongguan Ziitek Electronic Materials & Technology Ltd. certification
China Dongguan Ziitek Electronic Materials & Technology Ltd. certification
The Thermal Conductive Pad is looking and working very good. We have no need for other Thermal Conductive Pad now!

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I had cooperated with Ziitek for 2 years, they provided high quality thermal conductive materials, and delivery in time, recommend their phase change materials

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Stable chemical performance light 3W thermal conductive gap filler pad TIF100-30-23E for cpu

Stable chemical performance light 3W thermal conductive gap filler pad TIF100-30-23E for cpu
Stable chemical performance light 3W thermal conductive gap filler pad TIF100-30-23E for cpu
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Product Details:
Place of Origin: China
Brand Name: ZIITEK
Certification: UL and RoHs
Model Number: TIF100-30-23E
Payment & Shipping Terms:
Minimum Order Quantity: 1000pcs
Price: negotiation
Packaging Details: 1000pcs/bag
Delivery Time: 3-5 days
Supply Ability: 10000pcs/day
Detailed Product Description
Color: The Light Blue Thermal Conductivity: 3 W/m-K
Hardness: 35 Shore 00 Application: Cpu
Dielectric Breakdown Voltage: >10000 VAC Fire Rating: 94-V0
High Light:

thermally conductive pad

,

thermal conductive material

Stable chemical performance light 3W thermal conductive gap filler pad TIF100-30-23E for cpu

 

 

  The TIF™100-30-23​E thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base. Their flexibility and elasticity make them suited to the coating of the very uneven surfaces. Heat can transmit to the metal housing or dissipation plate from the separate elements or even the entire PCB, which in effect enhances the efficiency and life-time of the heat-generating electronic components.

 


Features:


>  Good thermal conductive: 3 W/mK 
>  Naturally tacky needing no further adhesive coating 
>  Soft and Compressible for low stress applications
>  Available in varies thickness


Applications:


>  IGBTs
>  High speed mass storage drives
>  Heat Sinking Housing at LED-lit BLU in LCD
>  LED TV and LED-lit lamps
>  RDRAM memory modules 
>  Micro heat pipe thermal solutions 
>  Automotive engine control units
>  Telecommunication hardware
>  Handheld portable electronics

 
Typical Properties of TIF™100-30-23E  Series
Color

The light blue

Visual Composite Thickness hermalImpedance
@10psi
(℃-in²/W)
Construction &
Compostion
Ceramic filled silicone rubber
*** 10mils / 0.254 mm

0.57

20mils / 0.508 mm

0.71

Specific Gravity

2.50 g/cc

ASTM D297

30mils / 0.762 mm

0.88

40mils / 1.016 mm

0.96

Heat Capacity

1 l/g-K

ASTM C351

50mils / 1.270 mm

1.11

60mils / 1.524 mm

1.26

Hardness
35 Shore 00 ASTM 2240

70mils / 1.778 mm

1.39 

80mils / 2.032 mm

1.54 

Tensile Strength  

48 psi

ASTM D412

90mils / 2.286 mm

1.66 

100mils / 2.540 mm

1.78

Continuos Use Temp
-50 to 200℃

***

110mils / 2.794 mm

1.87   

120mils / 3.048 mm

1.99   

Dielectric Breakdown Voltage >10000 VAC ASTM D149

130mils / 3.302mm

2.12

140mils / 3.556 mm

2.22

Dielectric Constant
10.2 MHz ASTM D150

150mils / 3.810 mm

2.31

160mils / 4.064 mm

2.41

Volume Resistivity 7.3X10"
Ohm-meter
ASTM D257

170mils / 4.318 mm

2.51

180mils / 4.572 mm

2.58

Fire rating
94 V0

equivalent UL

190mils / 4.826 mm

2.64 

200mils / 5.080 mm

2.72

Thermal conductivity
3 W/m-K ASTM D5470 Visua l/ ASTM D751 ASTM D5470
 
Standard Thicknesses:           
0.010" (0.25mm)       0.020" (0.51mm)       0.030" (0.76mm)       0.040" (1.02mm)       0.050" (1.27mm)       0.060" (1.52mm)       0.070" (1.78mm)       0.080" (2.03mm)       0.090" (2.29mm)       0.100" (2.54mm)       0.110" (2.79mm)       0.120" (3.05mm)       0.130" (3.30mm)       0.140" (3.56mm)       0.150" (3.81mm)       0.160" (4.06mm)       0.170" (4.32mm)       0.180" (4.57mm)       0.190" (4.83mm)       0.200" (5.08mm)
Consult the factory alternate thickness.

Standard Sheets Sizes:    
     
8" x 16"(203mm x 406mm)   16" x 18"(406mm x 457mm)
TIF™ series Individual die cut shapes can be supplied. 

Peressure Sensitive Adhesive:      
               
Request adhesive on one side with "A1" suffix.
Request adhesive on double side with "A2" suffix.

Reinforcement:     
          
TIF™ series sheets type can add with fiberglass reinforced.
 
Stable chemical performance light 3W thermal conductive gap filler pad TIF100-30-23E for cpu 0
 

Company Profile

Ziitek Electronic Material and Technology Ltd. is a R&D and production company, we have many production lines and processing technology of thermal conductive materials, owns advanced production equipment and optimized process, can provide various thermal solutions for different applications. Ziitek provide thermal conductive gap fillers, low melting point thermal interface materials, thermal conductive insulators, thermally conductive tapes, electrically & thermally conductive Interface pads and thermal grease,Thermal Conductive plastic,Silicone Rubber,Silicone Foams,Phase Changing Materials products and so on, for various applications.

 

FACTORY INFORMATION:

 

Factory Size

5,000-10,000 square meters

 

Factory Country/Region

Building B8, Industry District , Xicheng, Hengli Township, Dongguan City, Guangdong Province, P.R.China

 

Annual Output Value

US$1 Million - US$2.5 Million

 

 

Ziitek Culture

 

Quality :

Do it right the first time, total quality control

Effectiveness:

Work precisely and thoroughly for effectiveness

Service:

Quick response, On time delivery and Excellent service

Team work:

Complete teamwork, including sales team, Marketing team, engineering team, R&D team, Manufacturing team, logistics team. All is for supporting and servicing a satisfy service for customers.

 

Contact Details
Dongguan Ziitek Electronic Materials & Technology Ltd.

Contact Person: Dana

Tel: +8618153789196

Send your inquiry directly to us (0 / 3000)