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pink 3.0W/mK CPU Heatsink Cutting Thermal Conductive Foam Ultrasoft Compressible 7.5 MHz Dielectric Constant

China Dongguan Ziitek Electronic Materials & Technology Ltd. certification
China Dongguan Ziitek Electronic Materials & Technology Ltd. certification
The Thermal Conductive Pad is looking and working very good. We have no need for other Thermal Conductive Pad now!

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I had cooperated with Ziitek for 2 years, they provided high quality thermal conductive materials, and delivery in time, recommend their phase change materials

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pink 3.0W/mK CPU Heatsink Cutting Thermal Conductive Foam Ultrasoft Compressible 7.5 MHz Dielectric Constant

pink 3.0W/mK CPU Heatsink Cutting Thermal Conductive Foam Ultrasoft Compressible 7.5 MHz Dielectric Constant
pink 3.0W/mK CPU Heatsink Cutting Thermal Conductive Foam Ultrasoft Compressible 7.5 MHz Dielectric Constant
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Product Details:
Place of Origin: China
Brand Name: ZIITEK
Certification: UL and RoHs
Model Number: TIF100-30-25E
Payment & Shipping Terms:
Minimum Order Quantity: 1000pcs
Price: negotiation
Packaging Details: 1000pcs/bag
Delivery Time: 3-5 days
Supply Ability: 100000pcs/day
Detailed Product Description
Tensile Strength: 40 Psi Thermal Conductivity: 3.0W/m-K
Hardness: 35 Shore 00 Specific Gravity: 2.50 G/cc
Dielectric Constant: 7.5 MHz Fire Rating: 94-V0
High Light:

thermally conductive pad

,

thermal conductive material

pink 3.0W/mK CPU Heatsink Cutting Thermal Conductive Foam Ultrasoft Compressible 7.5 MHz Dielectric Constant

 

Ziitek company is a high-tech enterprise which dedicated to the R&D, manufacture and sales of the thermal interface materials (TIMs). We have rich experiences in this field which can support you the latest, most effective and one -step thermal management solutions. We have many advanced production equipments,full test equipments and fully automatic coating production lines which can support the production for high performance thermal silicone pad, thermal graphite sheet/ film, thermal double-sided tape, thermal insulation pad, thermal ceramic pad, phase change material, thermal grease etc. UL94 V-0, SGS and ROHS are compliant.

 

 The TIF100-30-25E Series  use a special process, with silicone as the base material, adding thermal conductive powder and flame retardant together to make the mixture to become thermal interface material. This is effective in lower the thermal resistance between the heat source and the heat sink.


Features:

 

Moldability for complex parts 3.0W/mK
Outstanding thermal performance
High tack surface reduces contact resistance
RoHS compliant
UL recognized

 

 

Applications:

 

LED Power Supply
LED Controller
LED Ceilinglamp
Monitoring the Power Box
AD-DC Power Adapters
Rainproof LED Power
Waterproof LED Power
SMD LED module
LED Flesible strip, LED bar
LED PanelLight
LED floor light
routers

 

 

Typical Properties of TIF100-30-25E Series
Color

Pink

Visual Composite Thickness hermalImpedance
@10psi
(℃-in²/W)
Construction &
Compostion
Ceramic filled silicone rubber
*** 10mils / 0.254 mm

0.48

20mils / 0.508 mm

0.56

Specific Gravity

2.50 g/cc

ASTM D297

30mils / 0.762 mm

0.71

40mils / 1.016 mm

0.80

Heat Capacity

1 l/g-K

ASTM C351

50mils / 1.270 mm

0.91

60mils / 1.524 mm

0.94

Hardness
35 Shore 00 ASTM 2240

70mils / 1.778 mm

1.05 

80mils / 2.032 mm

1.15 

Tensile Strength
 

40 psi

ASTM D412

90mils / 2.286 mm

1.25 

100mils / 2.540 mm

1.34 

Continuos Use Temp
-50 to 200℃

***

110mils / 2.794 mm

1.43   

120mils / 3.048 mm

1.52   

Dielectric Breakdown Voltage
>10000 VAC ASTM D149

130mils / 3.302mm

1.63

140mils / 3.556 mm

1.71

Dielectric Constant
7.5 MHz ASTM D150

150mils / 3.810 mm

1.81

160mils / 4.064 mm

1.89
Volume Resistivity
7.8X10" Ohm-meter ASTM D257

170mils / 4.318 mm

1.98

180mils / 4.572 mm

2.07 

Fire rating
94 V0

equivalent UL

190mils / 4.826 mm

2.14 

200mils / 5.080 mm

2.22 

Thermal conductivity
3.0 W/m-K ASTM D5470 Visua l/ ASTM D751 ASTM D5470

 

 

Standard Thicknesses:           
0.010" (0.25mm)       0.020" (0.51mm)       0.030" (0.76mm)       0.040" (1.02mm)       0.050" (1.27mm)       0.060" (1.52mm)       0.070" (1.78mm)       0.080" (2.03mm)       0.090" (2.29mm)       0.100" (2.54mm)       0.110" (2.79mm)       0.120" (3.05mm)       0.130" (3.30mm)       0.140" (3.56mm)       0.150" (3.81mm)       0.160" (4.06mm)       0.170" (4.32mm)       0.180" (4.57mm)       0.190" (4.83mm)       0.200" (5.08mm)
Consult the factory alternate thickness.

Standard Sheets Sizes:         
8" x 16"(203mm x 406mm)   16" x 18"(406mm x 457mm)
TIF™ series Individual die cut shapes can be supplied. 

Peressure Sensitive Adhesive:                     
Request adhesive on one side with "A1" suffix.
Request adhesive on double side with "A2" suffix.

Reinforcement:                     
TIF™ series sheets type can add with fiberglass reinforced.
 
pink 3.0W/mK CPU Heatsink Cutting Thermal Conductive Foam Ultrasoft Compressible 7.5 MHz Dielectric Constant 0
 

Ziitek Culture

 

Quality :

Do it right the first time, total quality control

Effectiveness:

Work precisely and thoroughly for effectiveness

Service:

Quick response, On time delivery and Excellent service

Team work:

Complete teamwork, including sales team, Marketing team, engineering team, R&D team, Manufacturing team, logistics team. All is for supporting and servicing a satisfy service for customers.

 

 

Standard Sheets Sizes:

8" x 16"(203mm x 406mm)

16" x 18"(406mm x 457mm)

 

TIF™ series Individual die cut shapes can be supplied.

Contact Details
Dongguan Ziitek Electronic Materials & Technology Ltd.

Contact Person: Dana

Tel: +8618153789196

Send your inquiry directly to us (0 / 3000)