Payment & Shipping Terms:
|Continuous Use Temp:||-45-200 ℃||Good Thermal Conductive:||4.5 W/mK|
High Viscosity Thermally Conductive Putty,
Black Thermally Conductive Putty,
4.5w/mk thermal gap filler
High performance high viscosity thermally conductive putty TIF045-01 black gap filler
TIF045-01 is a soft silicone putty thermal gap filler,which blend with exclusive formula,that offer superior thermal performance, and compressibility. Due to TIF045-01 is made by high vicosity silicon oil ,that can prevent thermal formula seprate from it. Besides ,compared with traditionally thermal pad, it can control bonded shifiting issue much better.
TIF045-01 operation mold is simliar as grease ,such as silkprint and screen print or automatic injected facility. TIF045-01 can be applied on chip micro processor,PPGAs,Micro BGA package,BGA package,DSP chip,LED lighting and other high power electric component .
>Heat-sink & frame
>LED backlight module,LED lighting
>High speed hardware driver
>Micro heat pipe ,Vihicel enginee controler
>Thermal conductivity: 4.5W/mK
>Soft, very low compression
|Construction & Composition||Ceramic filled silicon material||**********|
|Specific Gravity||2.95 g/cc||ASTM D297|
|Thermal conductivity||4.5 W/mK||ISO 22007-2|
|Thermal diffusivity||1.651 mm2/s||ISO 22007-2|
|Specific heat capacity||2.7 MJ/m3K||ISO 22007-2|
|Continuous Use Temperature||-45 ~200°C||******|
|Dielectric breakdown strength||200 V/mil||ASTM D149|
30 cc/pc, 98 pc/box; 300 cc/pc 6 pc/box
We offer the custom packaged in syringes for automated despensing applications.Please contact us for confirming.
Contact Person: sales02