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Factory Thermal Conductive Gel For Electronic Components Cooling

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Factory Thermal Conductive Gel For Electronic Components Cooling

Large Image : Factory Thermal Conductive Gel For Electronic Components Cooling

Product Details:

Place of Origin:	China
Brand Name:	ZIITEK
Certification:	UL and RoHs
Model Number:	TIF015-07

Payment & Shipping Terms:

Minimum Order Quantity:	1000pcs
Price:	negotiation
Packaging Details:	1000tubes
Delivery Time:	7-15work days
Supply Ability:	10000/day

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Detailed Product Description

Products Name:	Factory Thermal Conductive Gel For Electronic Components Cooling	Specific Gravity:	2.5 G/cc
Good Thermal Conductive:	1.5 W/mK	Color:	Green
Continuous Use Temperature:	-45~200℃	Flame Rating:	94V0
Keywords:	Thermal Conductive Gel	Material:	Ceramic Filled Silicon Material
Highlight:	thermally conductive putty , electrically conductive putty

Factory Thermal Conductive Gel For Electronic Components Cooling

TIF015-07 is a soft silicone putty thermal gap filler,which blend with exclusive formula,that offer superior thermal performance, and compressibility. Due to TIF015-07 is made by high vicosity silicon oil ,that can prevent thermal formula seprate from it. Besides ,compared with traditionally thermal pad, it can control bonded shifiting issue much better.

TIF015-07 operation mold is simliar as grease ,such as silkprint and screen print or automatic injected facility. TIF015-07 can be applied on chip micro processor,PPGAs,Micro BGA package,BGA package,DSP chip,LED lighting and other high power electric component .

TIF015-07-Specification-sheet.-pdf.pdf

Application

> Heat-sink & frame

> LED backlight module,LED lighting

> Good thermal conductive
> Moldability for complex parts
> Soft and compressible for low stress applications

Feature

> Thermal conductivity: 1.5W/mK

> Soft, very low compression

> Audio and video components
> IT infrastructure
> GPS navigation and other portable devices
> CD-Rom, DVD-Rom cooling

TIF^TM015-07 Property
Property	Value	Test method
Color	Green	Visual
Construction & Composition	Ceramic filled silicon material	*****
Viscosity	4000 Pa.s	GB/T 10247
Specific Gravity	2.5g/cm³	ASTM D297
Thermal conductivity	1.5 W/mK	ISO 22007-2
Thermal diffusivity	0.847 mm²/s	ISO 22007-2
Specific heat capacity	2.2 MJ/m³K	ISO 22007-2
Continuous Use Temperature	-45 ~200°C	******
Flame Rating	94V0	UL E331100

Package :

30 cc/pc, 98 pc/box; 300 cc/pc 6 pc/box

We offer the custom packaged in syringes for automated despensing applications.

Please contact us for confirming.

Company Profile

With a wide range, good quality, reasonable prices and stylish designs, Ziitek thermal conductive interface materials are extensively used in Mainboards, VGA cards, Notebooks, DDR&DDR2 products, CD-ROM ,LCD TV, PDP products, Server Power products, Down lamps, Spotlights, Street lamps, Daylight lamps, LED Server Power products and others.

Factory Thermal Conductive Gel For Electronic Components Cooling 2

Ziitek Culture

Quality :

Do it right the first time, total quality control

Effectiveness:

Work precisely and thoroughly for effectiveness

Service:

Quick response, On time delivery and Excellent service

Team work:

Complete teamwork, including sales team, Marketing team, engineering team, R&D team, Manufacturing team, logistics team. All is for supporting and servicing a satisfy service for customers.

Tag:

Contact Person: Dana Dai

Tel: 18153789196

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Factory Thermal Conductive Gel For Electronic Components Cooling

Factory Thermal Conductive Gel For Electronic Components Cooling

thermally conductive putty

electrically conductive putty

thermally conductive putty,

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electrically conductive putty