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Customerized ultra soft 35 shore00 1.5W pink thermal conductive gap filler pad 2.34 g/cc for Memory Modules

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China Dongguan Ziitek Electronic Materials & Technology Ltd. certification
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Customerized ultra soft 35 shore00 1.5W pink thermal conductive gap filler pad 2.34 g/cc for Memory Modules

Customerized ultra soft 35 shore00 1.5W pink thermal conductive gap filler pad 2.34 g/cc for Memory Modules
Customerized ultra soft 35 shore00 1.5W pink thermal conductive gap filler pad 2.34 g/cc for Memory Modules
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Large Image :  Customerized ultra soft 35 shore00 1.5W pink thermal conductive gap filler pad 2.34 g/cc for Memory Modules

Product Details:
Place of Origin: China
Brand Name: ZIITEK
Certification: UL and RoHs
Model Number: TIF100-14E
Payment & Shipping Terms:
Minimum Order Quantity: 1000pcs
Price: negotiation
Packaging Details: 1000pcs/bag
Delivery Time: 3-5 days
Supply Ability: 100000pcs/day
Detailed Product Description
Tensile Strength: 40 Psi Thermal Conductivity: 1.5 W/m-K
Hardness: 35 Shore 00 Specific Gravity: 2.34 G/cc
Dielectric Constant: 5.5 MHz Fire Rating: 94-V0
High Light:

thermally conductive pad

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thermal conductive material

Customerized ultra soft 35 shore00 1.5W pink thermal conductive gap filler for Memory Modules
 
 
 The TIF100-14E Series thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base. Their flexibility and elasticity make them suited to the coating of the very uneven surfaces. Heat can transmit to the metal housing or dissipation plate from the separate elements or even the entire PCB, which in effect enhances the efficiency and life-time of the heat-generating electronic components.It is a unique thermal pad with low oil permeability, low thermal resistance, high softness and high compliance.It can work stably at -50℃~200℃ and meet the requirement of UL94V0.
 
Features:
>  Outstanding thermal performance
>  Good thermal conductive: 1.5 W/mK 
>  Moldability for complex parts
>  Soft and compressible for low stress applications
> Naturally tacky needing no further adhesive coating
 
Applications:

Cooling components to the chassis of frame
High speed mass storage drives
Heat Sinking Housing at LED-lit BLU in LCD
LED TV and LED-lit lamps
RDRAM memory modules
Micro heat pipe
Automotive engine control units
Telecommunication hardware
Cooling components to chassis frame or other mating components
Home and small office network equipment
Handheld portable electronics
Plasma supply panels
Semiconductor automated test equipment (ATE)
Heat pipe thermal solutions
Memory Modules
Mass storage devices
Automotive electronics
Radios

 
 

Typical Properties of TIF100-14E Series
Color

Pink

VisualComposite ThicknesshermalImpedance
@10psi
(℃-in²/W)
Construction &
Compostion
Ceramic filled silicone rubber
***10mils / 0.254 mm

0.48

20mils / 0.508 mm

0.56

Specific Gravity

2.34 g/cc

ASTM D297

30mils / 0.762 mm

0.71

40mils / 1.016 mm

0.80

Heat Capacity

1 l/g-K

ASTM C351

50mils / 1.270 mm

0.91

60mils / 1.524 mm

0.94

Hardness
35 Shore 00ASTM 2240

70mils / 1.778 mm

1.05 

80mils / 2.032 mm

1.15 

Tensile Strength
 

40 psi

ASTM D412

90mils / 2.286 mm

1.25 

100mils / 2.540 mm

1.34 

Continuos Use Temp
-50 to 200℃

***

110mils / 2.794 mm

1.43   

120mils / 3.048 mm

1.52   

Dielectric Breakdown Voltage
>10000 VACASTM D149

130mils / 3.302mm

1.63

140mils / 3.556 mm

1.71

Dielectric Constant
5.5 MHzASTM D150

150mils / 3.810 mm

1.81

160mils / 4.064 mm

1.89
Volume Resistivity
7.8X10" Ohm-meterASTM D257

170mils / 4.318 mm

1.98

180mils / 4.572 mm

2.07 

Fire rating
94 V0

equivalent UL

190mils / 4.826 mm

2.14 

200mils / 5.080 mm

2.22 

Thermal conductivity
1.5 W/m-KASTM D5470Visua l/ ASTM D751ASTM D5470

 
 

Standard Thicknesses:           
0.010" (0.25mm)       0.020" (0.51mm)       0.030" (0.76mm)       0.040" (1.02mm)       0.050" (1.27mm)       0.060" (1.52mm)       0.070" (1.78mm)       0.080" (2.03mm)       0.090" (2.29mm)       0.100" (2.54mm)       0.110" (2.79mm)       0.120" (3.05mm)       0.130" (3.30mm)       0.140" (3.56mm)       0.150" (3.81mm)       0.160" (4.06mm)       0.170" (4.32mm)       0.180" (4.57mm)       0.190" (4.83mm)       0.200" (5.08mm)
Consult the factory alternate thickness.

Standard Sheets Sizes:         
8" x 16"(203mm x 406mm)   16" x 18"(406mm x 457mm)
TIF™ series Individual die cut shapes can be supplied. 

Peressure Sensitive Adhesive:                     
Request adhesive on one side with "A1" suffix.
Request adhesive on double side with "A2" suffix.

Reinforcement:                     
TIF™ series sheets type can add with fiberglass reinforced.
 
Customerized ultra soft 35 shore00 1.5W pink thermal conductive gap filler pad 2.34 g/cc for Memory Modules 0
 

Quality:
Do it Right the First Time, Total Quality Control.
Effectiveness:
Work Precisely and Thoroughly for Effectiveness.
Service:
Quick Response, On Time Delivery and Excellent Service.
TeamWord:
Teamwork that Integrates Sales, Marketing, Engineering, R&D, Manufacturing, Logistics, all other Supporting and Services to Satisfy Customer Needs.

Contact Details
Dongguan Ziitek Electronic Materials & Technology Ltd.

Contact Person: Dana

Tel: +8618153789196

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